Thermal Compound / Heat Conductive Polyurethane Adhesives and Sealants

Encapsulants -- LOCTITE STYCAST US 0155
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]

  • Compound Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Type / Form: Liquid
  • Viscosity: 3500
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS
from Master Bond, Inc.

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most noteworthy properties are its high flexibility and elongation. [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT
from Master Bond, Inc.

EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT
from Master Bond, Inc.

EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN
from Master Bond, Inc.

Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy systems, the EP21TDCN has a... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Compound Type: Thermally Conductive; Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
  • Substrate Compatibility: Metal; Plastic
  • Features: Flexible
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Composites; Metal; Plastic
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Type / Form: Liquid
  • Features: High Dielectric; Unfilled; Flame Retardant; Flexible; UL Rating
Thermally Conductive PU Potting Compound -- 50-2366 FR
from Epoxies Etc...

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Type / Form: Liquid
  • Features: Filled; Flame Retardant; UL Rating