Thermal Compound / Heat Conductive Polyurethane Adhesives and Sealants
from MacDermid Alpha Electronics Solutions
Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview. UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics. Once cured, it has... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Features: Flame Retardant
- Cure / Technology: Two Component
- Industry: Electronics; Marine; Semiconductors, IC's
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's PU4500 Series Thermal Conductive PU Adhesive are renowned for their distinctive characteristics, which include: ◆ Thermal conductivity ranging from 1.0 to 2.0 W/m ·K. ◆ Two-component adhesive, cures at room temperature or with heat. ◆ 100% solid content, non-toxic,... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -40 to 185
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
from Master Bond, Inc.
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]
- Compound Type: Thermally Conductive
- Cure / Technology: Two Component
- Type / Form: Liquid
- Viscosity: 3500
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Substrate Compatibility: Metal; Plastic
- Features: Flexible
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Substrate Compatibility: Composites; Metal; Plastic
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Features: High Dielectric; Unfilled; Flame Retardant; Flexible; UL Rating
from Epoxies Etc...
50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Features: Filled; Flame Retardant; UL Rating