Electronics Polyurethane Adhesives and Sealants

Hysol STYCAST U2500 -- 8799570460673
from Henkel Corporation - Electronics

Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. [See More]

  • Industry: Electronics
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 5000
ELAN-Tron® -- U 225 Black Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
MG Chemicals 4223 Urethane Conformal Coating 55ml -- MGCC00009
from Techsil Limited

MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against... [See More]

  • Industry: Electronics
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Techsil VT2420LV Clear Potting Polyurethane 250gm -- TEEP14085
from Techsil Limited

Techsil ® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and... [See More]

  • Industry: Electronics
  • Compound Type: Encapsulant, Potting Compound
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Techsil® PU217 Black 78 Shore A Polyurethane 1kg -- TEPU14415
from Techsil Limited

Techsil ® PU 217 is a two-component Polyurethane which offers high strength & outstanding abrasion resistance with a slow cure. Techsil ® PU217 is a black resin with medium viscosity and is ideal for cable jointing. Once cured, PU217 is 78A Shore. If heat cured, PU217 requires 2hrs at... [See More]

  • Industry: Electronics
  • Compound Type: Sealant
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087
from Techsil Limited

Techsil ® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features. Excellent long term UV stability. Scratch and mark resistant. Non-toxic. High mechanical strength. Easy to mix... [See More]

  • Industry: Electronics
  • Compound Type: Encapsulant, Potting Compound
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Techsil® PU23955 Pearl Potting PU 250gm -- TEPU14434
from Techsil Limited

Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many applications for this... [See More]

  • Industry: Electronics
  • Compound Type: Encapsulant, Potting Compound
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Cure / Technology: Reactive or Moisture Cured; Single Component; Thermoset; UV or Radiation Cured
One Component, Biocompatible UV Curable Adhesive -- UV10Med
from Master Bond, Inc.

Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
One Component, UV and Heat Curable Epoxy -- UV15DC80
from Master Bond, Inc.

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80 °C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing the EP21TDCHT offers high shear and peel strength which allows it to be... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS
from Master Bond, Inc.

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Transparent, Highly Flexible Epoxy Compound -- EP30D-10
from Master Bond, Inc.

Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Industry: Electronics; OEM or Industrial; Tooling
  • Type / Form: Liquid
  • Compound Type: Sealant; Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
Filled Polyurethane Elastomer -- 20-2350 (35%)
from Epoxies Etc...

This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition... [See More]

  • Industry: Electronics
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
Hapflex™ 700 Series High Performance Hybrid Elastomeric Polymer Alloy -- 765
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]

  • Industry: Electronics; OEM or Industrial; Tooling
  • Type / Form: Liquid
  • Compound Type: Sealant; Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Composites; Metal; Plastic
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Industry: Electronics; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
UV Potting Material -- ANA-97174
from Protavic America, Inc.

ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Thermally Conductive PU Potting Compound -- 50-2366 FR
from Epoxies Etc...

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Industry: Electronics
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component