Room Temperature Curing Polyurethane Adhesives and Sealants
from ELANTAS North America LLC
The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Industry: Aerospace; Electronics; Military
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight or volume. This adhesive is 100% reactive and... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many metal and plastic substrates. It can be used as structural adhesive, void filler, or as... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Leveling Filling; Sealant; Adhesive
- Industry: Aerospace; OEM or Industrial
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Thermally Conductive; Adhesive
- Features: Flexible
from Henkel Corporation - Electronics
Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Industry: Electronics
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 5000
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Features: Unfilled
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates and is designed to... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Adhesive
- Features: Flexible
from Epoxies Etc...
This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Features: Filled
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Features: Unfilled
from 3M Aerospace and Aircraft Maintenance Division
Two-component, polyurethane adhesive which cures at room temperature. Forms tough, impact-resistant structural bonds. Excellent adhesion to many primed or painted metal and plastic substrates. Designed to develop sag resistance approximately 30 seconds after mixing. Work Life: 100 grams mixed at 75F... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Adhesive
- Features: Flexible
from Epoxies Etc...
50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Features: Filled; Flame Retardant; UL Rating
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most. 600 Series products are offered in 2 speeds: a standard 20-25 minute working... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Features: Unfilled
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Urethane Adhesive 3549 is a flexible, two-part urethane. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Urethane Adhesive 3549 cures at room temperature or with heat to produce impact-resistant, high peel strength bonds on primed or painted metal and... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Adhesive
- Industry: Aerospace; OEM or Industrial
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Features: Unfilled
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Urethane Adhesive DP605 NS is a semi-rigid, non-sag, two-part urethane. 1:1 mix ratio, 5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP605 NS has high... [See More]
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Substrate Compatibility: Ceramic, Glass; Plastic; Wood
- Compound Type: Adhesive
- Industry: Aerospace; OEM or Industrial