Specialty / Other UV Curing Adhesives
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Composition: Filled
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
from Epoxies Etc...
UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7112 also has high impact strength and flexibility. This material is a good choice when water and weather... [See More]
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Features: Encapsulant, Potting Compound
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Features: Thermal Insulation
from Henkel Corporation - Electronics
Single component, photocurable adhesive is designed for bonding camera module assemblies. [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 7000
- Industry: Electronics
- CTE: 34