Electrical Insulation / Dielectric Material UV Curing Adhesives
from Master Bond, Inc.
UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes and passes stringent ISO10993-5 cytotoxicity standards. [See More]
- Features: High Dielectric; Non-corrosive; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Key Features. Outstanding physical properties. Superb chemical resistance. Bonds well to many types of plastics. Withstands thermal cycling. Product Description. Master Bond UV18S is a specialty UV curable system for bonding, featuring good strength, toughness, and chemical resistance. It cures... [See More]
- Features: High Dielectric; Sealant
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE ® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product is formulated to temporarily cure when exposed to UV light, followed with a secondary... [See More]
- Features: High Dielectric
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass
from Epoxies Etc...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Filled
- Type / Form: Gel
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component