Electrical Power / HV UV Curing Adhesives

Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Composition: Filled
  • Type / Form: Liquid
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Viscosity UV System for High Performance Bonding, Sealing and Coating, Features Superb Physical Properties, High Glass Transition Temperature and Sterilization Resistance -- UV10TKMed
from Master Bond, Inc.

UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1
from Master Bond, Inc.

Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature -- UV26
from Master Bond, Inc.

Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
One Component LED Curable Adhesive System -- LED401
from Master Bond, Inc.

LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
One Component Low Viscosity, Optically Clear UV Curable -- UV19
from Master Bond, Inc.

Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Composition: Unfilled
  • Type / Form: Liquid
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Industry: Electronics; Electric Power
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured