Dissimilar Substrates UV Curing Adhesives
from Dymax
Dymax MD ® 1040-M is a versatile autoclave resistant adhesive, coating and encapsulant resistant to 100+ cycles of sterilization. It offers extremely low water absorption (0.5%) making it ideal for surgical tools and devices that are subjected to numerous instances of sterilization, including... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: variety of medical scopes and dental equipment
- Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; SS, Aluminum, Glass, PP/PE, PCBs
- Viscosity: 775
from Master Bond, Inc.
UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes and passes stringent ISO10993-5 cytotoxicity standards. [See More]
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Dymax
Curing in seconds upon exposure to UV or LED light, MD ® 1128A-M-Z medical device adhesive features Multi-Cure ® a secondary heat cure for shadow areas. The product bonds metals and plastics typically used in the manufacture of medical devices. This impact-resistant material also... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: metal bonding, needle bonding, and heat exchanger assembly.
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; Stainless Steel; Aluminum; Nickel Titanium; Glass; ABS; PA; PU
- Viscosity: 650
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Composition: Filled
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
from Dymax
MD ® 1405-M-UR-SC-Z needle bonding adhesive is LED curable at either 385 nm or 405 nm wavelength light for fast bonding of multiple substrates typically used in syringe and medical device manufacturing. Its low viscosity makes it ideal for tight tolerance applications. The product features... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: assembling dialyzers, winged infusion sets, and point-of-care devices, as well as needle/syringe joining.
- Substrate Compatibility: Metal; Dissimilar Substrates; Stainless Steel; ABS; PC; PCTG; PEI; PETG; PS; SAN
- Viscosity: 160
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive
from Dymax
Dymax MD ® 1406-M-Z needle bonding adhesive cures using LED light at either 385 or 405 nm wavelength for fast bonding of substrates typically used in needle/syringe assemblies and other medical devices. This product fluoresces blue for in-line inspection of the bond line under low-intensity... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 160
- Substrate Compatibility: Metal; Dissimilar Substrates; Stainless Steel; ABS; PC; PEI; PETG; PMMA; PS
- Elongation: 92.0
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and ceramic. The... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Rubber or Elastomer; Dissimilar Substrates; Lead frame; ceramic; PCB; silicon
- Type / Form: Gel
- Industry: where shock attenuation or ruggedization is necessary.
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Dymax 9773 is a low outgassing, low-ionic content, high-performance light-cure staking/ruggedizing adhesive especially formulated to stabilize critical components on printed circuit boards in missiles, satellites, and spacecraft. This material is designed for rapid on-demand broad-spectrum curing. [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Rubber or Elastomer; Dissimilar Substrates; PCB; Silicon; Leadframe; Ceramic
- Type / Form: Gel
- Industry: Fine-Pitch or Leadless Components on Printed Circuit Boards, Ruggedization/Staking Material, Shock Absorption, Underfill Alternative, Encapsulant
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Multi-Cure ® 9-20801 cures upon exposure to UV light, heat, and/or activator. The material rapidly mounts heat-sensitive components on printed circuit boards to provide highly conductive bonds to heat-dissipation elements such as heat sinks. 9-20801 thermal interface material is a Multi-Cure... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 110000
- Substrate Compatibility: Ceramic, Glass; Rubber or Elastomer; Dissimilar Substrates; PCB; Ceramic; Lead Frame; Silicon; FR4; Metal
from Master Bond, Inc.
Master Bond UV22DC80-1 is a one part nano silica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Filled
- Type / Form: Liquid
from Dymax
Designed for optical bonding applications found in consumer wearables, low-stress 9204-W features very low modulus and low shifting after reliability testing. This optical bonding adhesive is suitable for sealing and packaging due to its high elongation that provides a buffer layer to absorb impact... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Rubber or Elastomer; Dissimilar Substrates; LCP; PC; PS, silicon
- Type / Form: Liquid
- Industry: Designed for optical bonding applications
from Master Bond, Inc.
Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. [See More]
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: Non-corrosive; Sealant
from Dymax
Dymax 9501-F is a UV/Visible light-curing adhesive optimized for LED curing at 385nm designed for electric vehicle battery potting and bonding. This material provides a highly reliable bond for cylindrical cells to the base of the battery pack. This colorless adhesive has no solvents added and will... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: battery assemblies and structural applications
- Substrate Compatibility: Dissimilar Substrates; ABS, CAP, FR-4, GL, PC/ABS Blend, PCTG, PETG, PS, PVC, SAN, AL, Ni Plating
- Viscosity: 10000
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Composition: Unfilled
- Features: Flexible; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Dymax 9801 is an LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle-resistant and meets the stringent low-shrinkage requirements introduced for active alignment... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; CAP; PS; FR-4; Glass
- Type / Form: Gel
- Industry: for bonding camera modules, lidar, active alignment applications
from Master Bond, Inc.
LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated... [See More]
- Composition: Unfilled
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Dymax
Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
- Type / Form: Gel
- Industry: used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications
from Master Bond, Inc.
Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Dymax 9906-AA is a heat and/or LED light-curable epoxy adhesive designed specifically for use in Asia. This active alignment adhesive meets NASA ASTM E595 low-outgassing specifications making it ideal for critical optical components, camera modules, LiDAR (Light Detection and Ranging, and other ADAS... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
- Type / Form: Gel
- Industry: lens bonding, bonding the lens barrel to holder, or bonding the holder to printed circuit boards (PCBs).
from Master Bond, Inc.
Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80 °F to +250 °F. It is 100% reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Dymax
Dymax Low-Shrink ™ OP-81-LS is a UV/Visible light-curable optical adhesive epoxy with very low shrinkage during cure and is ideal for rapid positioning of optical components. OP-81-LS cures with UV light and includes a low-temperature heat-curing function in applications where shadow areas... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; CAP; PS; FR-4; PA; PC; PETG; PMMA; SAN; Glass, Aluminum, Stainless Steel
- Type / Form: Gel
- Industry: applications where shadow areas exist or where heat cure only is preferred.
from Master Bond, Inc.
Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]
- Chemical System: Polyurethane
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5 offers... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Contact or Pressure Sensitive Adhesives; Single Component
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive, medium viscosity liquid at ambient temperatures which does not contain any solvents or other... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid