Non-corrosive Cure UV Curing Adhesives
from Master Bond, Inc.
UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes and passes stringent ISO10993-5 cytotoxicity standards. [See More]
- Features: High Dielectric; Non-corrosive; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV22DC80-1 is a one part nano silica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]
- Features: Non-corrosive; Sealant; Thermal Insulation
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. [See More]
- Features: Non-corrosive; Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80 °F to +250 °F. It is 100% reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Polyurethane
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond UV15X-5 offers... [See More]
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such... [See More]
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient... [See More]
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive, medium viscosity liquid at ambient temperatures which does not contain any solvents or other... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Featuring breakthrough LED curing technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured, it has impressive physical properties, including outstanding dimensional stability, very good... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
With a glass transition temperature exceeding 180 °C, UV25 offers impressive thermal stability over the broad service temperature range of -60 °F to +500 °F. This one part, fast curing, moderate viscosity UV curable system bonds well to glass, surface treated metals, plastics such as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Sheet or Film; Liquid
from Master Bond, Inc.
Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100% reactive moderate viscosity liquid at ambient temperatures which does not contain any solvents or... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System UV 15-7LRI is a new one component, optically clear, non-yellowing UV curable polymer system for high performance adhesives, sealants and coatings. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80 °C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Polyurethane
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nano silica filled system features outstanding physical strength... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid