OEM / Industrial UV Curing Adhesives

Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Printing, Medical use and General Industrial Assembly
  • Type / Form: Liquid
  • Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Features: Encapsulant, Potting Compound
UV Curable Adhesive Designed for Glob Top Encapsulation -- EPO-TEK® OG653
from Epoxy Technology

EPO-TEK ® OG653 is a UV curable adhesive designed for glob top encapsulation. [See More]

  • Industry: Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Composition: Filled
  • Type / Form: Liquid
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Viscosity UV System for High Performance Bonding, Sealing and Coating, Features Superb Physical Properties, High Glass Transition Temperature and Sterilization Resistance -- UV10TKMed
from Master Bond, Inc.

UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1
from Master Bond, Inc.

Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature -- UV26
from Master Bond, Inc.

Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Composition: Unfilled
  • Type / Form: Liquid
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Ultrabond™ Adhesive -- Grade 706
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Composition: Filled
  • Type / Form: Gel