Filled / Reinforced UV Curing Adhesives

Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Composition: Filled
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Filled
  • Type / Form: Liquid