Ceramic / Glass UV Curing Adhesives

35 Results
Light-Curable Materials, Dissimilar Substrate Bonding, 6-621
from Dymax

Dymax Multi-Cure ® 6-621 adhesive is designed for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other substrate materials. The material is specially formulated to cure with heat in applications where shadow areas exist. This product is curable with... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; EP; PA; Phenolic Plastic; Ceramic; AL; CU; Glass; CRS; Stainless Steel
  • Industry: coil winding, potting, as well as metal-to-glass bonding.
  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 800
Biocompatible UV Curable Adhesive Formulated for TPU Bonding -- UV17Med
from Master Bond, Inc.

UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes and passes stringent ISO10993-5 cytotoxicity standards. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Features: High Dielectric; Non-corrosive; Sealant
Formulations - Applications - Bonding - Ultrabond 787 -- 378730
from Hernon Manufacturing, Inc.

Ultrabond ® 787 is a one component, thixotropic adhesive, which cures when exposed to ultraviolet radiation and/or visible light of sufficient intensity. Ultrabond ® 787 is primarily used for bonding rigid and flexible PVC to polycarbonate where large gap filling capabilities and a... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Variety of substrates including glass, many plastics and most metals
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Vinyl
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
Light-Curable Materials, Dissimilar Substrate Bonding, 6-630-T
from Dymax

Dymax Multi-Cure ® 6-630-T structural bonding adhesive cures in seconds for fast assembly of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other substrates. The product demonstrates excellent flexibility and is high-temperature and moisture-resistant. The material cures... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; PEEK; PEI; PSU; PVC; AL; Stainless Steel; Glass
  • Industry: automotive latch assembly, potting, and bonding glass fixtures and furniture.
  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 6000
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Composition: Filled
  • Type / Form: Liquid
Formulations - Chemistries - UV Curable Adhesives - Ultrabond 3444 -- 2152_NULL_SKU
from Hernon Manufacturing, Inc.

Ultrabond ® 3444 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3444 is excellent for bonding and tacking many parts. Ultrabond ® 3444 can also be cured with heat above 200 °F (93 °C) or Activator 56. [See More]

  • Substrate Compatibility: Ceramic, Glass
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Light-Curable Materials, Dissimilar Substrate Bonding, 9310
from Dymax

Dymax 9310 cures upon exposure to light and is designed for rapid ruggedization of circuit board components. This adhesive is specially formulated to cure with heat in applications where shadowed areas exist. Ideal applications for this material include reinforcement of fine-pitch or leadless... [See More]

  • Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; PVC; SAN; glass
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured
  • Industry: reinforcement of fine-pitch or leadless components on printed circuit boards, shock absorption, and underfill alternative
Flexible, Thixotropic, One Component Dual Cure Epoxy -- UV23FLDC-80TK
from Master Bond, Inc.

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Light-Curable Materials, Dissimilar Substrate Bonding, 9505-TC
from Dymax

Dymax 9505-TC cures upon exposure to UV light and is 405 nm LED curable. 9505-TC thermal interface material is designed for rapid mounting of heat-sensitive components on printed circuit boards. Dymax materials contain no nonreactive solvents. Their ability to cure in seconds enables faster... [See More]

  • Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; Aluminum; Glass; PA; SAN; SS
  • Viscosity: 100000
  • Cure / Technology: UV or Radiation Cured
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Light-Curable Materials, Dissimilar Substrate Bonding, 9801
from Dymax

Dymax 9801 is an LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle-resistant and meets the stringent low-shrinkage requirements introduced for active alignment... [See More]

  • Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; CAP; PS; FR-4; Glass
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Industry: for bonding camera modules, lidar, active alignment applications
High strength, toughened UV curable system for bonding, especially in optical and electro-optic applications -- UV18S
from Master Bond, Inc.

Key Features. Outstanding physical properties. Superb chemical resistance. Bonds well to many types of plastics. Withstands thermal cycling. Product Description. Master Bond UV18S is a specialty UV curable system for bonding, featuring good strength, toughness, and chemical resistance. It cures... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric; Sealant
Light-Curable Materials, Dissimilar Substrate Bonding, 9803
from Dymax

Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Industry: used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications.
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Light-Curable Materials, Dissimilar Substrate Bonding, 9906-AA
from Dymax

Dymax 9906-AA is a heat and/or LED light-curable epoxy adhesive designed specifically for use in Asia. This active alignment adhesive meets NASA ASTM E595 low-outgassing specifications making it ideal for critical optical components, camera modules, LiDAR (Light Detection and Ranging, and other ADAS... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured
  • Industry: lens bonding, bonding the lens barrel to holder, or bonding the holder to printed circuit boards (PCBs).
High Viscosity UV System for High Performance Bonding, Sealing and Coating, Features Superb Physical Properties, High Glass Transition Temperature and Sterilization Resistance -- UV10TKMed
from Master Bond, Inc.

UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Light-Curable Materials, Dissimilar Substrate Bonding, OP-81-LS
from Dymax

Dymax Low-Shrink ™ OP-81-LS is a UV/Visible light-curable optical adhesive epoxy with very low shrinkage during cure and is ideal for rapid positioning of optical components. OP-81-LS cures with UV light and includes a low-temperature heat-curing function in applications where shadow areas... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; CAP; PS; FR-4; PA; PC; PETG; PMMA; SAN; Glass, Aluminum, Stainless Steel
  • Type / Form: Gel
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 60000
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1
from Master Bond, Inc.

Master Bond UV22DC80-1 is a one part nano silica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Composition: Unfilled
  • Type / Form: Liquid
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
Biocompatible, UV Curing Epoxy -- EPO-TEK® MED-OG116-31
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Substrate Compatibility: Ceramic, Glass
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Ultrabond™ Adhesive -- Grade 736
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 2200
from Henkel Corporation - Industrial

LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE ® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product is formulated to temporarily cure when exposed to UV light, followed with a secondary... [See More]

  • Substrate Compatibility: Ceramic, Glass
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric
Medical Application Translucent UV Curing Adhesive -- DM-6656
from Shenzhen DeepMaterial Technologies Co., Ltd

Fast curing, high toughness, excellent heat cycle performance, low yellowing. Typical applications include bonding electronic equipment, home appliance parts and decorative components. After curing, it has excellent resistance to vibration and shock. [See More]

  • Substrate Compatibility: Ceramic, Glass; Plastic
  • Cure / Technology: UV or Radiation Cured
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Industry: Electronics; Electric Power
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
UV Light Cure Adhesives -- LOCTITE AA 3933
from Henkel Corporation - Industrial

UV, liquid acrylic adhesive for a wide variety of applications that require fast cure, flexibility, high adhesion and autoclave resistance. LOCTITE ® AA 3933 is a transparent to slightly hazy, UV acrylic, instant, liquid adhesive suitable for a wide variety of applications requiring fast cure,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
UV Curable Adhesive -- UV Cure 60-7157
from Epoxies Etc...

UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7157 will continue to cure in the absence of light. This is... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: UV or Radiation Cured; Single Component
UV Light Cure Adhesives -- LOCTITE AA 3944
from Henkel Corporation - Industrial

Fluorescent, UV acrylic light cure adhesive liquid primarily designed for bonding plastic substrates where a flexible, tough bond is required. LOCTITE ® AA 3944 is a transparent to hazy, fluorescent, UV acrylic light cure adhesive liquid primarily designed for bonding plastic substrates where a... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
UV Light Cure Adhesives -- LOCTITE EA 3336 A/B
from Henkel Corporation - Industrial

Epoxy colorless/slightly yellowish adhesive for applications demanding high structural, mechanical, and electrical insulating properties. LOCTITE ® EA 3336 is a colorless to slightly yellowish, 2-part, medium-viscosity, epoxy adhesive liquid for potting, bonding, sealing, and laminating... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Two Component  ; UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
UV Light Cure Adhesives -- LOCTITE ECCOBOND LUX A4083T
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LUX A4083T , Acrylate, Assembly, Photocurable Adhesive LOCTITE ® ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices. In addition to light cure, this adhesive contains a secondary... [See More]

  • Substrate Compatibility: Ceramic, Glass
  • Industry: Optical
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 300
UV Light Cure Adhesives -- LOCTITE SI 5083
from Henkel Corporation - Industrial

Translucent, viscous, UV light/moisture-cure acetoxy adhesive good for elastic bonding, sealing and leak-proofing on glass, metals and ceramics. LOCTITE ® SI 5083 is a translucent, slightly milky, UV light and atmospheric moisture-cured, thixotropic acetoxy silicone adhesive paste which forms a... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Silicone
  • Viscosity: 55000