Semiconductors / IC Packaging UV Curing Adhesives
from MacDermid Alpha Electronics Solutions
A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing. Product Overview. A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: UV or Radiation Cured; Single Component
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Industry: Aerospace; Automotive; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Key Features. Outstanding physical properties. Superb chemical resistance. Bonds well to many types of plastics. Withstands thermal cycling. Product Description. Master Bond UV18S is a specialty UV curable system for bonding, featuring good strength, toughness, and chemical resistance. It cures... [See More]
- Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Features: High Dielectric; Sealant
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV22DC80-1 is a one part nano silica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Sanitary; Optical; Photonics; Semiconductors, IC's
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type / Form: Liquid
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured