Electronics UV Curing Adhesives

UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Features: Encapsulant, Potting Compound; Sealant
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Composition: Filled
  • Type / Form: Liquid
Ablestik ABLELUX A4502 -- 8799473565697
from Henkel Corporation - Electronics

Photocurable adhesive is designed for high throughput assembly operations. [See More]

  • Industry: Electronics
  • Viscosity: 20000
  • Cure / Technology: UV or Radiation Cured; Single Component
  • CTE: 29
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Printing, Medical use and General Industrial Assembly
  • Type / Form: Liquid
  • Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Features: Encapsulant, Potting Compound
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Composition: Unfilled
  • Type / Form: Liquid
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
Electronic Grade UV Adhesive -- UV Cure 60-7112
from Epoxies Etc...

UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure 60-7112 also has high impact strength and flexibility. This material is a good choice when water and weather... [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid
Light Cure Adhesives -- Vibra-Tite®
from ND Industries, Inc.

Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]

  • Industry: Electronics; Electric Power
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Non-slump, Low Modulus Silicone, Soft Sealing Adhesive -- SEMICOSIL® 811
from Wacker Chemical Corp.

If you prefer short curing times andfast adhesion built-up with minimumenergy input, SEMICOSIL ® 811 is the product of choice. The highly specialized silicone adhesive sealant provides state of the art technology for efficient and ecofriendly processing. [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Chemical System: Silicone
  • Type / Form: Gel
Ultrabond™ Adhesive -- Grade 758
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured