Epoxy (EP) UV Curing Adhesives

LOCTITE 3131 -- 8799436898305
from Henkel Corporation - Electronics

LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components. [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 14000
Biocompatible, UV Hybrid Curing Epoxy -- EPO-TEK® MED-HYB-353ND
from Epoxy Technology

EPO-TEK ® MED-HYB-353ND is a biocompatible, high temperature specialty UV hybrid curing epoxy, formulated for process improvement (assembly) for photonic packaging. It has very high strength and moisture resistance. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass
Die Attach Adhesives -- LOCTITE ECCOBOND LUX AA50T
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE ® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue)... [See More]

  • Chemical System: Epoxy
  • Industry: Optical
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 96000
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
Panacol Vitralit UC 1619 UV Curable Epoxy 30gm -- PNVI00023
from Techsil Limited

Panacol Vitralit ® UC 1619 is a uv-curable compound designed for opto-electronic components like LED and VCSEL. This product features excellent transmission (650-1300nm) along with ionic pureness, non-yellowing and extremely good thermal shock resistance when operating between -55 °C and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured
UV Epoxy -- EPO-TEK® OG133-8
from Epoxy Technology

EPO-TEK ® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK ®... [See More]

  • Chemical System: Epoxy
  • Features: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
UV Light Cure Adhesives -- LOCTITE EA 3336 A/B
from Henkel Corporation - Industrial

Epoxy colorless/slightly yellowish adhesive for applications demanding high structural, mechanical, and electrical insulating properties. LOCTITE ® EA 3336 is a colorless to slightly yellowish, 2-part, medium-viscosity, epoxy adhesive liquid for potting, bonding, sealing, and laminating... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; UV or Radiation Cured
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
UV Light Cure Adhesives -- LOCTITE EA 3355
from Henkel Corporation - Industrial

Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE ® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy adhesive liquid designed for bonding optical connectors,... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Industry: Optical
High Viscosity UV System for High Performance Bonding, Sealing and Coating, Features Superb Physical Properties, High Glass Transition Temperature and Sterilization Resistance -- UV10TKMed
from Master Bond, Inc.

UV10TKMed is USP Class VI approved and meets ISO10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
UV Light Cure Adhesives -- LOCTITE ECCOBOND LUX 4047
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LUX 4047, Acrylate, Assembly, Photocurable Adhesive LOCTITE ® ECCOBOND LUX 4047 photocurable adhesive is designed for high throughput optoelectronic assembly operations. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue) or UV light. [See More]

  • Chemical System: Epoxy
  • Viscosity: 3000
  • Cure / Technology: UV or Radiation Cured; Single Component
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1
from Master Bond, Inc.

Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Filled
  • Type / Form: Liquid
One Component, Low Viscosity UV Curable System -- UV15LV
from Master Bond, Inc.

Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive, medium viscosity liquid at ambient temperatures which does not contain any solvents or other... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2
from Master Bond, Inc.

Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100% reactive moderate viscosity liquid at ambient temperatures which does not contain any solvents or... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
One Component, UV Curable, Nanosilica Reinforced Epoxy -- UV22
from Master Bond, Inc.

Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nanosilica filled system features outstanding physical strength... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
UV Curable Adhesive -- UV Cure 60-7157
from Epoxies Etc...

UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7157 will continue to cure in the absence of light. This is... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Features: Encapsulant, Potting Compound
UV Curable Compound -- UV-Cure 60-7155
from Epoxies Etc...

UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Type / Form: Liquid