Thermal Compound / Interface (Thermally Conductive) UV Curing Adhesives

Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Composition: Filled
  • Type / Form: Liquid
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Composition: Unfilled
  • Type / Form: Liquid