Encapsulanting / Potting UV Curing Adhesives
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
- Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Substrate Compatibility: Plastic
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Sealant
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
- Chemical System: Epoxy
- Type / Form: Liquid
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Epoxies Etc...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Filled
- Type / Form: Gel
from Henkel Corporation - Industrial
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Henkel Corporation - Industrial
LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Polyurethane
- Viscosity: 120