Wafer Edge Inspection
from Micro-Epsilon

The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than 300 nm are thus reliably detected. Defective wafers can significantly affect later process steps and result in shutdown of the production. Details. [See More]

  • Technology: Optical / Imaging
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Measurements: Defects, dimples or film residues; Flatness
Wafer Edge Inspection
from Micro-Epsilon Group

The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than 300 nm are thus reliably detected. Defective wafers can significantly affect later process steps and result in shutdown of the production. Details. [See More]

  • Technology: Optical / Imaging
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Measurements: Defects, dimples or film residues; Flatness
SigmaTech Wafer Metrology Systems -- UltraMap-100B
from MicroSense, LLC

Benchtop, automated Thickness measurement systems. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 2 ” to 4 ” (50 to 100mm). Thickness range: 50um to 3mm. Throughput up to 100W/hours. 2D & 3D... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Applications: Wafer
NEXIV FOUP CNC Video Measuring System
from Nikon Metrology

Provides all dimensional measurements required for wafer carrier fabrication including control of deformation due to aging of wafer carriers. The NEXIV VMR-C4540 - designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers - detects hard to... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Applications: Wafer
11000 Series -- 1110XB
from Cascade Microtech, Inc.

Features high-temperature ceramic low-noise probes [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Applications: Wafer
8900
from KLA-Tencor Corporation

Suitable for detecting a wide variety of defects in the sub-micron to five-micron range, the 8900 is the fastest of all KLA-Tencor patterned-wafer defect inspection systems. Based on the production-proven Puma platform, the 8900 enables cost-effective inspection of 200mm or 300mm wafers from initial... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Applications: Photolithography
Automated Optical Inspection System -- nSPEC™
from Nanotronics Imaging

The Nanotronics Imaging nSpec ® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec ® offers fast quantification and qualification of defects with detailed... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Applications: Wafer
Wafer Inspection System -- MX51
from Olympus America Inc.

The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: In-line (optional feature); Manual loading
  • Form Factor: Monitor or instrument
  • Applications: Wafer
IRIS DIE & Wafer Inspection Systems -- EVA Semiautomatic Align, Stepping & Inspection
from SemiProbe

SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has... [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Applications: Wafer (optional feature)
Laser Diode Bar Tester
from TELOPS, Inc.

The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]

  • Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument; ProbingSystem
  • Applications: Packaged IC or substrate; Laser Diode Bar Tester
MS Series -- E1S
from ULVAC Technologies, Inc.

High temperature heating imaging system, radiant heating generates no dust [See More]

  • Technology: Optical / Imaging
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD
Mask Aligner -- 15912
from Unitron Ltd.

Modular microscope system that readily adapts to instrumentation [See More]

  • Technology: Optical / Imaging
  • Applications: Wafer
  • Form Factor: Mask Aligner
  • Features: Noncontact; Non-destructive
Auto Focus & Tracking System -- ATF-6CM
from WDI Wise Device Inc.

WDI's Laser Auto-Focus ATF6 sensor is an active optical device (incorporating a class II semiconductor laser) designed to provide focusing servo systems with fast feedback signals needed to quickly and accurately focus all types of infinity corrected microscopes. [See More]

  • Technology: Optical / Imaging
  • Applications: Wafer; CVD / PVD; Photolithography
  • Form Factor: Sensor or sensing element
  • Features: Noncontact; Non-destructive
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Bumping Processes