Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
3M Scotch-Weld EC-2216 Epoxy Adhesive Gray 43ml Duo-Pak -- EC2216 43 ML
from Ellsworth Adhesives

3M Scotch-Weld EC-2216 is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. 43ml Available Applicator and Static Mix Nozzle . [See More]

  • Industry: Aerospace; OEM or Industrial
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Cure / Technology: Two Component  
  • Features: Flexible
Electrical -- E2101
from Epoxy Technology

Product Description: EPO-TEK ® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. EPO-TEK ® E2101 Advantages & Application Notes:  Thixotropic paste allows for application by stencil or... [See More]

  • Industry: Aerospace; Electronics; Semiconductors, IC's
  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; Filled
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Double/Bubble® Epoxy Adhesive -- 4007 [4007 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Aerospace; Automotive; Marine
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Cure / Technology: Two Component  
  • Viscosity: 50000
Pyro-Weld™ -- 657-FST
from Aremco Products, Inc.

Curing takes place at room temperature in 30-45 minutes [See More]

  • Industry: Aerospace; Automotive; Construction
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Metal; Plastic
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Substrate Compatibility: Composites; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Thermally Conductive; Filled
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Industry: Aerospace; Automotive
  • Substrate Compatibility: Composites; Metal
  • Cure / Technology: Thermoset; Two Component  
  • Features: Unfilled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal