Aerospace Epoxy Adhesives Datasheets

Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20E-PFC
from Epoxy Technology

EPO-TEK ® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method. [See More]

  • Industry: Aerospace; Electronics; Semiconductors, IC's
  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; Filled
Custom Epoxy Resin
from Gabriel Performance Products, LLC

Specialty Chemicals. Specialized Focus. Specialty chemicals are what we do and who we are, which has made us a leader in performing complex organic synthesis to provide the highest quality products to meet your exacting custom manufacturing requirements. Need to scale up from lab to pilot to larger... [See More]

  • Industry: Aerospace; Automotive; Sanitary; Petrochemical, Personal Care, Chemical
  • Cure / Technology: Thermoset
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Construction; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Double/Bubble® Epoxy Adhesive -- 4007 [4007 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Aerospace; Automotive; Marine
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Cure / Technology: Two Component  
  • Viscosity: 50000
Pyro-Weld™ -- 657-FST
from Aremco Products, Inc.

Curing takes place at room temperature in 30-45 minutes [See More]

  • Industry: Aerospace; Automotive; Construction
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Metal; Plastic
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Substrate Compatibility: Composites; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Thermally Conductive; Filled
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Industry: Aerospace; Automotive
  • Substrate Compatibility: Composites; Metal
  • Cure / Technology: Thermoset; Two Component  
  • Features: Unfilled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible; Unfilled
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal