Wafer Carrier / Holder Industrial Ceramic Materials Datasheets

Ceramic Fixturing Material -- Hexoloy® SA
from Saint-Gobain High Performance Ceramics, Refractories and Hexoloy® Products

Technical Data. Hexoloy ® SA SiC is a pressureless, sintered form of alpha silicon carbide, with a density greater than 98 percent theoretical. It has a very fine grain structure (4 - 10 microns) for excellent wear resistance and contains no free silicon, which makes it highly chemically... [See More]

  • Shape / Form: Spout; WaferCarrier; KilnFurniture; Custom Shape
  • Max Use Temperature: 1900
  • Material Type: Carbide Material; Silicon Carbide
  • Thermal Conductivity: 126
Low Temperature Co-Fired Ceramic -- A6M Tape System
from Ferro Corporation-Electronic Material Systems

High frequency up to 110 GHz for military and aerospace [See More]

  • Shape / Form: WaferCarrier
  • CTE: 7
  • Max Use Temperature: 850
  • Density: 2.45
Sapphire Wafer
from Monocrystal, Inc.

Due to its dielectric and crystallographic properties, sapphire is an outstanding material for producing various wafers for electronic applications. Sapphire is the basic material in LED production, as its crystal lattice allows the growth of an epitaxial layer of gallium nitride (GaN) with fine... [See More]

  • Shape / Form: WaferCarrier
  • Width / Diameter: 2 to 10
  • Material Type: Sapphire
  • Thickness: 0.0059 to 0.0394