Dielectric / Electrical Insulation Industrial Ceramic Materials Datasheets

Alumina Extruded Rod -- 031AE
from Accuratus Corporation

Accuratus maintains an inventory of standard extruded and cast aluminum oxide, mullite and sialon shapes for fast delivery requirements. These are low cost, quality rods and tubes that can be quickly cut to precision lengths. (See Mullite Sizes, Aluminum Oxide Sizes and Sialon Sizes). Accuratus will... [See More]

  • Material Type: Alumina
  • Shape / Form: Rod
  • Composition: 94% - 99.5% Al2O3
  • Length: 59.06
Aluminum Nitride (ALN) Ceramic Substrates -- AlN-170
from CoorsTek

Aluminum Nitride Advantages. High heat dissipation with thermal conductivity of 170 W/m K. Non-toxic alternative to BeO. Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors. High dielectric strength. Setting the Standard – for Over Four Decades!. CoorsTek developed the... [See More]

  • Material Type: Aluminum Nitride; SpecialtyMaterial
  • Thermal Conductivity: 170
  • Composition: Aluminum Nitride
  • CTE: 4.4
3M™ Boron Nitride
from 3M Advanced Materials Division

3M boron nitride cooling fillers provide a unique opportunity to improve the efficiency of thermally conductive polymers while maintaining electrical resistivity of an insulator. Ongoing miniaturization and large-scale production of electronic components requires materials that can quickly and... [See More]

  • Material Type: Boron Nitride; SpecialtyMaterial
  • Density: 0.1500 to 0.5500
  • Shape / Form: Custom Shape
  • Applications: Cooling Fillers
Beryllium Oxide Ceramics -- BW1000
from Materion Corporation

Materion Ceramics has the capabilities to manufacture complex and custom designs by the addition of a variety of machining functions. Input material used for customized products can be dry pressed, isopressed or extruded in form and consist of Materion Ceramics' BW1000 "high strength" material. [See More]

  • Material Type: Beryllia / Beryllium Oxide; SpecialtyMaterial
  • Thermal Conductivity: 275 to ?
  • Shape / Form: Custom Shape
  • CTE: 16.2
Sapphire Wafer
from Monocrystal, Inc.

Due to its dielectric and crystallographic properties, sapphire is an outstanding material for producing various wafers for electronic applications. Sapphire is the basic material in LED production, as its crystal lattice allows the growth of an epitaxial layer of gallium nitride (GaN) with fine... [See More]

  • Material Type: Sapphire
  • Width / Diameter: 2 to 10
  • Shape / Form: WaferCarrier
  • Thickness: 0.0059 to 0.0394
Alumina -- 96% Al2O3
from Noritake Co., Inc. / Electronics and Ceramics Division

Metallized alumina ceramics for sensor stems, cathode disc, electronics [See More]

  • Material Type: Alumina
  • Density: 3.8
  • Shape / Form: Rod; WaferSubstrate; Plate / Board; Custom Shape; BarStock
  • MOR / Flexural Strength: 49782
Aluminum Nitride (AlN) Ceramic Component
from San Jose Delta Associates, Inc.

Aluminum Nitride - AlN, is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. Because San Jose Delta has a segregated beryllium oxide - BeO department with over 20 years of experience fabricating common microwave designs such as helix support... [See More]

  • Material Type: Aluminum Nitride; SpecialtyMaterial
  • Thermal Conductivity: 170 to 200
  • Shape / Form: Rod; Custom Shape
  • CTE: 5
96% Alumina Plate/Disk -- P96001-x x
from Superior Technical Ceramics Corp.

Plate sizes can be made to various thicknesses. Standard thicknesses are .125", .250", .375", .500", .625", .750", and 1.00". Not all plates can be made to the thicknesses listed above. Please contact us for the maximum thickness that can be manufactured for your desired plate size. [See More]

  • Material Type: Alumina
  • Length: 2.11
  • Shape / Form: Plate / Board
  • Width / Diameter: 2.11