Yttria Industrial Ceramic Materials
from San Jose Delta Associates, Inc.
While the same design features common to alumina ceramics; blind holes, threads etc. are easily produced in Zirconia the grinding time required is about fifty percent more. The post-grinding surface finish is significantly better than a comparable feature in most aluminas. Zirconia is much more... [See More]
- Material Type: Yttria; Zirconia; SpecialtyMaterial
- Max Use Temperature: 1500
- Shape / Form: Custom Shape
- Thermal Conductivity: 2.2
from Umicore Metal Deposition Solutions
Coating material. Yttrium oxide. Purity. 99.99%. Form. Tablet. Dimensions. Ø 9.5 x 5 mm. Quantity. 500 g. Theoretical density at 20 °C in g/cm ³. 5.0. Melting point in °C. 2410. 10 ⁻ ² mbar in °C. ~ 2300. 10 ⁻ ¹ mbar in °C. ~ 2700. Boiling point in... [See More]
- Material Type: Yttria; SpecialtyMaterial
- Width / Diameter: 0.3740
- Length: 0.1969
- Density: 5
from CoorsTek
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles. ETCH... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from CoorsTek
Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from CoorsTek
Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge. ADVANCED CERAMIC COMPONENTS. CoorsTek advanced, high-purity ceramic... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from CoorsTek
Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance. Semiconductor Processing Components. CoorsTek is your partner for... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Silicate / Clay; Quartz; Aluminum Nitride; Yttria; SpecialtyMaterial
- Applications: Chemical or material processing; Wear resistant parts or tooling
- Shape / Form: WaferCarrier
from CoorsTek
CoorsTek leads the market in ceramic sensor components - delivering over 100,000,000 advanced ceramic sensor components every year. For over three decades, CoorsTek has helped OEMs and their suppliers select the best design, material, process, and secondary services to ensure exceptional quality and... [See More]
- Material Type: Alumina; Alumina-Zirconia; Yttria; Zirconia
- Thermal Conductivity: 12 to 35
- Composition: Alumina, Zirconia-Toughened Alumina, Yttria Fully-Stabilized Zirconia
- CTE: 7.2 to 11