Aluminum Nitride Industrial Ceramic Materials
Last Updated: April 1, 2025
Description
Aluminum nitride (AlN) is an industrial ceramic material known for its exceptional thermal conductivity and electrical insulation properties. It is a high-temperature resistant ceramic that can withstand environments up to 2200°C. AlN is also resistant to corrosion by molten metals and remains stable when exposed to acids. Its surface forms a thin oxide film when exposed to moist air, which can be advantageous in certain applications.
Working Principle
Aluminum nitride operates on the principle of covalent bonding within a hexagonal crystal system, specifically a wurtzite structure. This structural configuration contributes to its high thermal conductivity, which is approximately five times that of alumina. The material's ability to conduct heat efficiently while maintaining electrical insulation makes it particularly useful in applications requiring heat dissipation and electrical isolation. Its thermal expansion coefficient closely matches that of silicon, making it suitable for integration with silicon-based technologies.
Applications
Aluminum nitride ceramics are widely used in various fields due to their unique properties. In the electronics industry, they serve as substrates for high-frequency circuit boards and power module packaging. They are also used in LED lighting and laser equipment for effective heat dissipation. Additionally, AlN is employed in the smelting of metals such as aluminum, copper, and silver, where it acts as a crucible and firing mold material.
Advantages over other Industrial Ceramic Materials
Aluminum nitride offers several advantages over other ceramic materials. Its thermal conductivity is significantly higher than that of traditional alumina ceramics, making it an ideal choice for heat dissipation applications. Unlike beryllium oxide, AlN is non-toxic, providing a safer alternative for electronic applications. Its excellent metallization properties further enhance its suitability for electronic device packaging.
Limitations
Despite its advantages, aluminum nitride has certain limitations. It is challenging to machine due to its hardness and brittleness, which can increase manufacturing costs. Additionally, while it is resistant to many chemicals, its surface can react with moist air, potentially affecting its performance in certain environments.
Considerations
When considering aluminum nitride for industrial applications, several factors should be taken into account. The initial cost of AlN can be higher compared to other ceramics due to its complex manufacturing process. However, its durability and high thermal conductivity can lead to lower operating expenses in applications requiring efficient heat management. Maintenance and replacement costs may also be higher due to the material's machining challenges. Overall, the choice of AlN should be based on a careful evaluation of its performance benefits against its cost implications.
from 3X Ceramic Parts Company Limited
Aluminum Nitride Substrate Application : With the development of electronic components towards volume reduction, performance improvement and environmental protection and energy saving, highly dense and high power, high frequency High-energy electronic components in high-heat environments have a heat... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Density: 3.34 to 3.6
- Thermal Conductivity: 165 to 185
from Shenzhen Great Precision Ceramic CO., LTD.
Aluminum nitride. AlN. If high thermal conductivity and electrical insulation are required, aluminum nitride (AlN) is an excellent material, making it an ideal material for thermal management and electrical applications. In addition, aluminum nitride is a common alternative to beryllium oxide (BeO)... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4.5
- Thermal Conductivity: 150
- Applications: HV / Electrical
from Xiamen Unipretec Ceramic Technology Co., Ltd.
AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin film, thick... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Max Use Temperature: 1200
- Shape / Form: Plate / Board
- Density: 3.25 to 3.35
from Xiamen Innovacera Advanced Materials Co., Ltd.
With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Max Use Temperature: 1500
- Shape / Form: Custom Shape; BarStock
- Thermal Conductivity: 70 to 180
from Fountyl Technologies Pte. Ltd.
Main Characteristics: High Thermal Conductivity, Excellent Thermal Shocking Resistance, Excellent resistance to plasma erosion. Main Applications: Heat Dissipating Parts, corrosion resistant parts. Aluminum nitride (AlN) is a material with high thermal conductivity and high electrical insulation,... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 170
- Shape / Form: Custom Shape
- CTE: 4.6
from 3X Ceramic Parts Company Limited
Diameter 1.2mm Length 20mm AIN Aluminum Nitride Ceramic Pin. We could provide micro precision machining on the aluminum nitride material . This small diameter aluminum nitride pin is grinded on the centerless grinding machine to get the outside diameter . Aluminum nitride pin rod has excellent... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 170
- Shape / Form: Rod
- Density: 3.36
from Shenzhen Great Precision Ceramic CO., LTD.
Advantages Of AlN Ceramic Spacer. AlN ceramic spacer has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal high temperature insulation ceramic product.AIN ceramics... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4 to 6
- Thermal Conductivity: 170
- Applications: HV / Electrical
from Xiamen Unipretec Ceramic Technology Co., Ltd.
Aluminum Nitride (AlN) substrate is a ceramic material widely used in the electronics industry. It is renowned for its superior thermal conductivity, high electrical insulating properties, and outstanding chemical stability. AlN substrates have a unique combination of properties that make them... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Max Use Temperature: 1200
- Shape / Form: Plate / Board
- Density: 3.25 to 3.35
from Xiamen Innovacera Advanced Materials Co., Ltd.
Aluminum nitride heater is mainly made of aluminum nitride ceramic material, it is a high-performance heating element that can withstand extreme temperatures and provide efficient heat distribution, it revolutionizes high-temperature applications. [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Performance Features: High electrical insulation,Low thermal expansion,Excellent heat conductivity,Fast heating and cooling,Excellent corrosion resistance
- Applications: Semiconductormanufacturing,Ceramicsintering,Vacuumcoating
from 3X Ceramic Parts Company Limited
Aluminum Nitride Ceramic Plate 114x114x2mm. The end user use the aluminium Nitride Ceramic Plate two pieces of those to sandwich the graphite element in between.During the energising the EV2 resistor the current is passing through the graphite element (to offer the resistance) the aluminum nitride... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 170
from Shenzhen Great Precision Ceramic CO., LTD.
Aluminum nitride. AlN. If high thermal conductivity and electrical insulation are required, aluminum nitride (AlN) is an excellent material, making it an ideal material for thermal management and electrical applications. In addition, aluminum nitride is a common alternative to beryllium oxide (BeO)... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4.5
- Thermal Conductivity: 150
- Applications: HV / Electrical
from Xiamen Unipretec Ceramic Technology Co., Ltd.
Ceramic components are manufactured of ceramic materials, which are an extensive family of inorganic, non-metallic compounds typically consisting of metal, non-metal, and metalloid elements. The exceptional properties exhibited by ceramics, such as their high hardness, low electrical conductivity,... [See More]
- Material Type: Alumina; Silicon Carbide; Tungsten Carbide; Cordierite; Glass Ceramics; Porcelain; Steatite; Aluminum Nitride; Silicon Nitride; Zirconia; SpecialtyMaterial
- Performance Features: Hard
- Applications: Abrasion Resistant; Armor / Ballistic Protection; Biomaterial; Corrosion resistant; Electronics or semiconductors; HV / Electrical; Thermal Insulation or Fire Proofing Material; Wear resistant parts or tooling; Battery / Fuel Cell; Refractory or High Temperature Insulation
- Bond & Processing: Sintered / Fired
from Xiamen Innovacera Advanced Materials Co., Ltd.
Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped sides, customized sizes or request... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Applications: Semiconductor manufacturing
- Shape / Form: WaferSubstrate
- Performance Features: Superior corrosion resistance against molten metal
from 3X Ceramic Parts Company Limited
Aluminum Nitride Characteristics: Aluminum Nitride Crucible with excellent thermal , mechanical and electrical properties, such as High thermal conductivity, low dielectric constant, linear expansion coefficient matched with silicon, excellent electrical insulation, low density, non-toxic, strength... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 3 to 4.5
- Thermal Conductivity: 165 to 185
- Density: 3.34 to 3.6
from Shenzhen Great Precision Ceramic CO., LTD.
Aluminum nitride. AlN. If high thermal conductivity and electrical insulation are required, aluminum nitride (AlN) is an excellent material, making it an ideal material for thermal management and electrical applications. In addition, aluminum nitride is a common alternative to beryllium oxide (BeO)... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4.5
- Thermal Conductivity: 150
- Applications: HV / Electrical
from Xiamen Unipretec Ceramic Technology Co., Ltd.
DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent... [See More]
- Material Type: Alumina; Aluminum Nitride; SpecialtyMaterial
- Performance Features: Metallized or electrode film
- Applications: BuildingConstruction; Electronics or semiconductors; HV / Electrical; Battery / Fuel Cell
- Bond & Processing: Sintered / Fired
from Xiamen Innovacera Advanced Materials Co., Ltd.
Some extreme environments require the high electrical resistivity in additional to exceptional thermal conductivity, high abrasive and high-temperature thermal cycling. To solve this kind problem, Innovacera provides Hot-pressed aluminum nitride ceramic material as solutions. Innovacera Hot pressed... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Applications: Semiconductor heaters
- Shape / Form: Plate / Board
- Performance Features: Metallized or electrode film
from 3X Ceramic Parts Company Limited
22x22x1.5mm Aluminum Nitride Insert Heat Plate. This Aluminum Nitride heat insert worked as a vacuum plate for LED wafer, To absorb heat as fast as possible and consistency maintain 273 °C and above, this Aluminium Nitride ceramic material must not melt or shape change at this heating point. [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Density: 3.33
- Thermal Conductivity: 170
- MOR / Flexural Strength: 58015
from Shenzhen Great Precision Ceramic CO., LTD.
Advantages Of ALN Ceramics Washers. ALN Ceramics Washers has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal high temperature insulation ceramic product.AIN... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4 to 6
- Thermal Conductivity: 170
- Applications: HV / Electrical
from Xiamen Unipretec Ceramic Technology Co., Ltd.
DPC ceramic substrates are typically composed of aluminium nitride or alumina ceramic materials, to which a copper layer is directly bonded on one or both sides. DPC ceramic substrates are frequently used in applications like electronic packaging and power electronics because they are made to offer... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Performance Features: Metallized or electrode film
- Applications: Electronics or semiconductors; HV / Electrical
- Bond & Processing: Sintered / Fired
from Xiamen Innovacera Advanced Materials Co., Ltd.
Magnesia Stabilized Zirconia (MSZ) Ceramic is a great refractory and insulating material due to high oxygen ion conductivity, high strength and toughness, and good thermal shock resistance. It has a clean melt at temperatures above 1900°C and above and is specially manufactured for melting... [See More]
- Material Type: Aluminum Nitride; Zirconia; SpecialtyMaterial
- Performance Features: High thermal shock resistance
- Applications: Metal powder industry
from 3X Ceramic Parts Company Limited
Aluminum Nitride (AlN) Substrate Description: AlN substrate is produced by tape casting using AlN powder as raw material and high temperature sintering. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which makes it the key material in... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 165 to 185
- Shape / Form: Rod; Custom Shape; BarStock
- Density: 3.34 to 3.36
from Shenzhen Great Precision Ceramic CO., LTD.
AlN Ceramic Substrate Laser Cutting Overview. Aluminum nitride (AlN) ceramic substrate is a technical ceramic material with excellent performance, which has a wide range of applications in semiconductor, optoelectronics, aerospace and other fields. Laser cutting is one of the important processes in... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Applications: HV / Electrical
- Thermal Conductivity: 170
from Xiamen Unipretec Ceramic Technology Co., Ltd.
The heater plate for deposition equipment is an essential component in numerous electronics and manufacturing applications. It can be manufactured using aluminium nitride ceramics, and featured by high thermal conductivity, excellent electrical insulation, and exceptional mechanical strength. [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Applications: Chemical or material processing; Electronics or semiconductors; HV / Electrical
- Shape / Form: Plate / Board
- Bond & Processing: Sintered / Fired
from Xiamen Innovacera Advanced Materials Co., Ltd.
Innovacera TO-247 Ceramic Insulating Sheet is designed to optimize thermal management in discrete semiconductors, including MOSFETs, IGBTs, and transistors. TO-247 Ceramic Insulating Sheet is a high-performance thermal interface product and was made by Alumina Ceramic (Al ₂O ₃) and... [See More]
- Material Type: Alumina; Aluminum Nitride; SpecialtyMaterial
- Performance Features: Heat dissipation,electrical insulation,mechanical stability
- Applications: Electronics or semiconductors; IGBT thermal management,power module cooling,High-temperature power electronics,Electric vehicle (EV) traction inverters
from 3X Ceramic Parts Company Limited
Aluminum Nitride Tube Properties. High thermal conductivity,(170-230W/mK), up to 9.5 times than that of Alumina. Similar coefficient of thermal expansion to that of silicon(Si). Higher electric insulation, and Smaller dielectric constant. Higher mechanical strength (450MPa). Superior corrosion... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 3 to 4.5
- Thermal Conductivity: 165 to 185
- Density: 3.34 to 3.36
from Shenzhen Great Precision Ceramic CO., LTD.
Advantages Of Aluminum nitride backing plate. Aluminum nitride backing plate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal high temperature insulation... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4 to 6
- Thermal Conductivity: 170
- Applications: HV / Electrical
from Xiamen Innovacera Advanced Materials Co., Ltd.
Innovacera TO-220 Ceramic Insulators were to be mounted between the TO-220 packaged power transistors and the heatsink, its dimensions is 14 x 20 x 1 mm (0.55 x 0.79 x 0.04in), the Mounting hole diameter can be 3.8mm or 5mm, without holes and customized holes is also available. It was packed by... [See More]
- Material Type: Alumina; Aluminum Nitride; SpecialtyMaterial
- Performance Features: Heat dissipation,electrical insulation,mechanical stability
- Applications: Electronics or semiconductors; IGBT thermal management,power module cooling,High-temperature power electronics,Electric vehicle (EV) traction inverters
from 3X Ceramic Parts Company Limited
Ceramic Fork Aluminum Nitride Vacuum Plate for LED wafer. Aluminum nitride ceramic fork have excellent physical properties such as high thermal conductivity, low dielectric constant, reliable electrical insulation, thermal expansion coefficient matched with silicon, insulation and non toxicity. They... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 170
- Shape / Form: BarStock
- Density: 3.36
from Shenzhen Great Precision Ceramic CO., LTD.
Advantages Of Aluminum nitride ceramic gasket. Aluminum nitride ceramic gasket has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal high temperature insulation... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 4 to 6
- Thermal Conductivity: 170
- Applications: HV / Electrical
from Xiamen Wintrustek Advanced Materials Co., Ltd.
Boron Nitride is a high-temperature ceramic that has a structure similar to graphite. Our portfolio of hot-pressed solid materials includes pure Hexagonal Boron Nitride as well as composites suitable for applications requiring excellent thermal properties combined with electrical isolation. Easy... [See More]
- Material Type: Aluminum Nitride; Boron Nitride
- Density: 1.5 to 1.6
from Accuratus Corporation
Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 20 years. Aluminum nitride has a hexagonal... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Shape / Form: Custom Shape
from Aremco Products, Inc.
Bonds and coats zirconia, high strength, zirconia, SOFC's [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- CTE: 2.70E6
- Max Use Temperature: 1649
- Applications: Abrasives, ceramics or glass manufacturing; Chemical or material processing; Corrosion resistant; HV / Electrical; Fiberoptics, Radiant Heaters, Temp Probe; Refractory or High Temperature Insulation
from CoorsTek
Chamber domes (sometimes referred to as lids) are used to create a clean, inert, and protected environment in deposition chambers. Chemical reactions inside the chamber deposit thin layers of metallic, dielectric, or semiconductive material onto the wafers. Chamber lids and liners are exposed to... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from San Jose Delta Associates, Inc.
Aluminum Nitride - AlN, is most often the material of choice due to its relatively excellent thermal conductivity and non-toxic nature. Because San Jose Delta has a segregated beryllium oxide - BeO department with over 20 years of experience fabricating common microwave designs such as helix support... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Thermal Conductivity: 170 to 200
- Shape / Form: Rod; Custom Shape
- CTE: 5
from Xiamen Wintrustek Advanced Materials Co., Ltd.
Boron Nitride is a high-temperature ceramic that has a structure similar to graphite. Our portfolio of hot-pressed solid materials includes pure Hexagonal Boron Nitride as well as composites suitable for applications requiring excellent thermal properties combined with electrical isolation. Easy... [See More]
- Material Type: Aluminum Nitride; Boron Nitride
from Accuratus Corporation
Accuratus maintains an inventory of standard aluminum nitride substrates for fast delivery requirements. They are stocked in industry standard thicknesses of .025 inches and .040 inches. We will be happy to provide a quotation. Call us at 908-213-7070 or fax your requirement to 908-213-7069. If you... [See More]
- Material Type: Aluminum Nitride; SpecialtyMaterial
- Length: 2
- Shape / Form: WaferSubstrate
- Width / Diameter: 2
from CoorsTek
Rings cover the wafer edge and perimeter, protecting critical chamber components and extending their useful life. Since they are directly exposed to the deposition process, strong plasma durability and high purity are critical to final wafer yield. SEMICONDUCTOR DEPOSITION PROCESSING. Semiconductor... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from Xiamen Wintrustek Advanced Materials Co., Ltd.
Aluminum Nitride (AlN) is a suitable material to utilize when high thermal conductivity and electrical insulation are required, making it perfect for use in thermal management and electrical applications. Furthermore, AlN is a popular alternative to Beryllium Oxide (BeO) in the semiconductor... [See More]
- Material Type: Aluminum Nitride
from CoorsTek
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles. ETCH... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from Xiamen Wintrustek Advanced Materials Co., Ltd.
Aluminium Nitride (AlN) has an astonishingly high thermal conductivity of 180-200 W/m ·K. Aluminium Nitride is particularly well suited for electrical engineering applications due to its excellent electrical insulating characteristics. Aluminium Nitride is an ideal material for uses in... [See More]
- Material Type: Aluminum Nitride
- Dielectric Strength: 2.00E7
- Thermal Conductivity: 180 to 200
from CoorsTek
Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from Xiamen Wintrustek Advanced Materials Co., Ltd.
Aluminum Nitride (AlN) is a suitable material to utilize when high thermal conductivity and electrical insulation are required, making it perfect for use in thermal management and electrical applications. Furthermore, AlN is a popular alternative to Beryllium Oxide (BeO) in the semiconductor... [See More]
- Material Type: Aluminum Nitride
- Shape / Form: Plate / Board
from CoorsTek
Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from CoorsTek
Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge. ADVANCED CERAMIC COMPONENTS. CoorsTek advanced, high-purity ceramic... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Aluminum Nitride; Yttria; SpecialtyMaterial
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Applications: Chemical or material processing
from CoorsTek
CoorsTek ceramics provide superior thermal performance in wafers, phosphors, and substrates for high-brightness LED manufacturing. Ceramic substrates. Thick-Film Alumina. Aluminum Nitride. Ceramic phosphors. Gallium nitride on silicon epiwafers. MOCVD process equipment components [See More]
- Material Type: Alumina; Aluminum Nitride; SpecialtyMaterial
- Applications: Thermal Insulation or Fire Proofing Material; LED Components
from CoorsTek
Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance. Semiconductor Processing Components. CoorsTek is your partner for... [See More]
- Material Type: Alumina; Carbide Material; Silicon Carbide; Silicate / Clay; Quartz; Aluminum Nitride; Yttria; SpecialtyMaterial
- Applications: Chemical or material processing; Wear resistant parts or tooling
- Shape / Form: WaferCarrier