Low Power Methodology Manual: For System-on-Chip Design

This chapter discusses some of the architectural issues involved in implanting power gating designs. In particular, it addresses the issues of partitioning, hierarchy, and multiple power-gated domains.
A scalable approach to chip architecture is valuable since a system-on-chip design today often becomes a component in an even larger chip in a subsequent product generation.
To support this portability, module boundaries must be enforced at the power domain level. That is, a given module should belong to a single power domain, not split across several domains. Some tools and flows support RTL process by RTL process assignment to power domains, but this leads to much more complicated implementation and analysis. Clean visibility of the boundaries of a power-gated block is key to having a clean, top-down implementation and verification flow.
Although one can in theory nest power gated modules arbitrarily within power gated subsystems which are in turn nested on a shared switched power rail, there are considerable benefits in not creating multiple levels of power switching fabric. As described in Chapter 11, power-gating is intrusive and adds in some voltage drop and degradation of performance. Cascading multiple voltage drops can lead to unacceptable increases in delay.
Even if the design is represented as hierarchical at the architectural level, the implementation is improved if this is mapped onto a single level of power gating at implementation. Consider the example shown in Figure 6-1. The CPU conceptually has all the core logic power gated, and within it...