System-on-Chip Test Architectures: Nanometer Design for Testability

Chapter 7: Low-Power Testing

Patrick Girard,
LIRMM/CNRS, Montpellier,
France
Xiaoqing Wen,
Kyushu Institute of Technology,
Fukuoka,Japan
Nur A. Touba,
University of Texas,
Austin,, Texas

ABOUT THIS CHAPTER

Power dissipation has become a major design objective in many application areas, such as wireless communications and high-performance computing, thus leading to the production of numerous low-power designs. At the same time, power dissipation is also becoming a critical parameter during manufacturing test, as the design can consume much more power during testing than during the functional mode of operation. Because test throughput and manufacturing yield are often affected by test power, dedicated test methodologies have emerged since the mid-1990s.

In this chapter, we discuss issues arising from excessive power consumption during test application as well as provide structural and algorithmic solutions that can alleviate the low-power test problems. We first review some basic elements of power modeling and related terminologies. After discussing test power issues, promising low-power test techniques to deal with nanometer system-on-chip (SOC) designs are presented. These techniques can be broadly classified into those that apply during scan testing and those that apply during built-in self-test (BIST). A few of them are also applicable to test compression circuits or memory designs.

In the literature, techniques that reduce power consumption during test application are generally referred to as power-conscious testing, power-aware testing, power-constrained testing, or low-power testing. These terms are used interchangeably throughout the chapter whenever fit.

7.1 INTRODUCTION

With the advance in semiconductor manufacturing technology, a very-large-scale-integrated

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