Cured-in-Place (CIP) Gaskets and Gasketing

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Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) -- SEMICOSIL® 986/1K - Image

Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) -- SEMICOSIL® 986/1K
from Wacker Chemical Corp.

SEMICOSIL ® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features. ready-to-use, one-part system. thixotropic. translucent. medium hardness. high flexibility (low-stress-adhesive). primerless adhesion to many substrates. rapid heat cure. [See More]

Gasket Type: Cured-in-Place (CIP); Formed-in-Place (FIP)
Material: Room Temperature Vulcanizing (RTV) Silicone; Silicone Rubber

Cure Method: Room Temperature Vulcanizing (RTV)