Clamshell Socket IC Interconnect Components

Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Features: Machined; Open-Top (optional feature); Clamshell Socket
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Socket Type: BGA; LGA; Test
H-Pin QFN Clamshell Burn in IC Socket -- H-Pin QFN Clamshell
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing... [See More]

  • Features: Clamshell Socket
  • Socket Type: QFNL
  • Product Type: IC Socket
  • Current Rating: 0.0500 to 2.93
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
QFN Clamshell Burn in IC Socket -- 04QNMA17050
from Plastronics Socket Company, Inc.

Available with optional Heat Slug, Spring-Loaded Center Pin or Slug/Pin Combination. Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. With the largest QFN... [See More]

  • Features: Clamshell Socket
  • Socket Type: QFNL
  • Product Type: IC Socket
  • Mounting: Through-Hole
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]

  • Features: Clamshell Socket
  • Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Product Type: IC Socket
  • Current Rating: 4
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
from Aries Electronics, Inc.

High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: DIP; Test
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket
  • Contact Resistance: 40
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]

  • Features: Clamshell Socket
  • Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Product Type: IC Socket
  • Operating Temperature: -67 to 392
Kelvin Test Socket
from Aries Electronics, Inc.

FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
Universal PLCC ZIF Test Socket – Live Bug Type – Series 537
from Aries Electronics, Inc.

FEATURES. This Universal PLCC ZIF Test Socket takes seven sizes of PLCC footprints with Aries Insert Plates. The PLCC is inserted ‘live bug ’ (pins down) into the position over the bed; the top half of the clamshell is closed for testing, programming, etc. The bottom solder tail pins are... [See More]

  • Features: ZIF Lock; Clamshell Socket
  • Socket Type: PLCC; Test
  • Product Type: IC Socket
  • Mounting: Through-Hole
Universal SOIC ZIF Test Socket – Series 547
from Aries Electronics, Inc.

FEATURES. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to... [See More]

  • Features: ZIF Lock; Clamshell Socket
  • Socket Type: SOIC; Test
  • Product Type: IC Socket
  • Current Rating: 1