Test / Prototyping Socket IC Interconnect Components

1011180 [32-6554-10 from Aries Electronics, Inc.]
from RS Components, Ltd.

A universal socket which will accept devices of either 0.3, 0.4, or 0.6 inch wide, on 0.1 inch pitch, with a pin width of 0.015 to 0.045 inch. Solder tail pin style. Breakdown voltage: 1000Vac minimum . Life: 25000 cycles. Temperature range -55 to +105 °C. Gender = Female. Number of Contacts =... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Current Rating: 1
Power Transistor Test Sockets, Combination Bus Bar Tape, High Current, High Voltage, High Temperature -- T3P-L214-BB-xx
from JC Cherry, Inc.

Power Transistor Test Sockets. Combination Bus Bar Tape. High Current. High Voltage. High Temperature. ●Power Transistor Test Socket accommodate various packages. ●Support the package such as TO-3P, TO-66, TO-220, TO-247, TO-254, TO-257, TO-262, TO-264. [See More]

  • Socket Type: Test
  • Insulation Resistance: 500
  • Product Type: IC Socket
  • Contact Resistance: 50
Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Socket Type: BGA; LGA; Test
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
1178766 [IC51-0162-1035 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Clamshell test sockets for SOPs (small outline packages). Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. Full performance material and electrical specification. Body material glass filled Polyetherimide (PEI). Contact material Beryllium Copper. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Power Transistor Test Sockets, Combination Bus Bar Tape, Low-Inductance, High Current, High Voltage, High Temperature -- TT3P-L214-BB-xx
from JC Cherry, Inc.

Power Transistor Test Sockets. Combination Bus Bar Tape. Low-Inductance. High Current. High Voltage. High Temperature. ●The signal are improved by wide drain and source (Collector and Emitter) and low inductance of the transistor electrode. ●Power Transistor Test Socket accommodate... [See More]

  • Socket Type: Test
  • Insulation Resistance: 500
  • Product Type: IC Socket
  • Contact Resistance: 50
1178794 [IC51-0202-347 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Clamshell test sockets for SOPs (small outline packages). Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. Full performance material and electrical specification. Body material glass filled Polyetherimide (PEI). Contact material Beryllium Copper. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Power Transistor Test Sockets, Low Insertion Force -- T3P-L213-ST
from JC Cherry, Inc.

Power Transistor Test Sockets. Low Insertion Force. ●For Test of Power Transistor, Thyristors and other discrete devices. ●Kelvin Contact type. ●Support the package such as TO-220, TO-3P, TO-66, TO-247, TO-254, TO-262, TO-264. [See More]

  • Socket Type: Test
  • Current Rating: 30
  • Product Type: IC Socket
  • Insulation Resistance: 500
1828275 [IC189-0162-019 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Small outline package test and burn-in sockets to enable component testing during operation. Open top low actuation force socket. Body material Polyetherimide (PEI) glass filled. Contact material Beryllium Copper. Contact plating Gold over Nickel. Flammability UL 94 V-0. Insulation Resistance 1000M... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Power Transistor Test Sockets, PC Board Mounting Tape, Low-Inductance, High Current, High Voltage, High Temperature -- TT3P-L214-ST-xx
from JC Cherry, Inc.

Power Transistor Test Sockets. PC Board Mounting Tape. Low-Inductance. High Current. High Voltage. High Temperature. ●The signal are improved by wide drain and source (Collector and Emitter) and low inductance of the transistor electrode. ●Power Transistor Test Socket accommodate various... [See More]

  • Socket Type: Test
  • Insulation Resistance: 500
  • Product Type: IC Socket
  • Contact Resistance: 50
1828281 [IC189-0202-017 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Small outline package test and burn-in sockets to enable component testing during operation. Open top low actuation force socket. Body material Polyetherimide (PEI) glass filled. Contact material Beryllium Copper. Contact plating Gold over Nickel. Flammability UL 94 V-0. Insulation Resistance 1000M... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Power Transistor Test Sockets, PC Board Mounting type, High Current, High Voltage, High Temperature -- T3P-L214-ST-xx
from JC Cherry, Inc.

Power Transistor Test Sockets. PC Board Mounting type. High Current. High Voltage. High Temperature. ●Power Transistor Test Socket accommodate various packages. ●Support the package such as TO-3P, TO-66, TO-220, TO-247, TO-254, TO-257, TO-262, TO-264. [See More]

  • Socket Type: Test
  • Insulation Resistance: 500
  • Product Type: IC Socket
  • Contact Resistance: 50
2495933 [200-6311-9UN-1900 from 3M]
from RS Components, Ltd.

Available in 3 different PGA grid sizes, these Zero Insertion Force socket kits are ideal when only a few test sockets are needed. The open pattern top plate allows the user to load only those contacts needed for the specific device pin pattern. Each socket comes with a PTFE coated stainless steel... [See More]

  • Socket Type: Test
  • Contacts Pitch: 2.54
  • Product Type: IC Socket
Test & Burn-In Socket, GQ Frame Series -- GQxxx-xx-xxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GQ Frame Series. Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For SOP Device, LGA Device [See More]

  • Socket Type: Test
  • Voltage Rating: 500
  • Product Type: IC Socket
  • Insulation Resistance: 100
2495949 [200-6315-9UN-1900 from 3M]
from RS Components, Ltd.

Available in 3 different PGA grid sizes, these Zero Insertion Force socket kits are ideal when only a few test sockets are needed. The open pattern top plate allows the user to load only those contacts needed for the specific device pin pattern. Each socket comes with a PTFE coated stainless steel... [See More]

  • Socket Type: Test
  • Contacts Pitch: 2.54
  • Product Type: IC Socket
Test & Burn-In Socket, GU10 Frame Series, Size 10x16mm / 0.39"x0.63" -- GU10-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU10 Frame Series. Size 10x16mm / 0.39"x0.63". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. Solder Dip Type/ High Frequency Response Type. For example:MEMS Device, SAW Filter, Semiconductor,... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
2495955 [200-6321-171-1900 from 3M]
from RS Components, Ltd.

Available in 3 different PGA grid sizes, these Zero Insertion Force socket kits are ideal when only a few test sockets are needed. The open pattern top plate allows the user to load only those contacts needed for the specific device pin pattern. Each socket comes with a PTFE coated stainless steel... [See More]

  • Socket Type: Test
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU16 Frame Series, Size 16x33.5mm / 0.63"x1.32" -- GU16-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU16 Frame Series. Size 16x33.5mm / 0.63"x1.32". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU16-xxxxxxxxxx. *P/N will be informed after fixing... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3722731 [IC46-1610-G4HT from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Two-point, dual-sided movable contacts make for excellent reliability. The contact position is high, supporting a short IC lead. Package Type = SIP. Gender = Female. Number of Contacts = 16. Number of Rows = 1. Pitch = 2.54mm. Body Orientation = Straight. Contact Material = Copper Alloy. Contact... [See More]

  • Socket Type: Test
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU20S Frame Series, Size 20x20mm / 0.79"x0.79" -- GU20S-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU20S Frame Series. Size 20x20mm / 0.79"x0.79". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU20S-xxxxxxxxxx. *P/N will be informed after fixing... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3722747 [IC46-2410-G4HT from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Two-point, dual-sided movable contacts make for excellent reliability. The contact position is high, supporting a short IC lead. Package Type = SIP. Gender = Female. Number of Contacts = 24. Number of Rows = 1. Pitch = 2.54mm. Body Orientation = Straight. Contact Material = Copper Alloy. Contact... [See More]

  • Socket Type: Test
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU22 Frame Series, Size 22x22mm / 0.87"x0.87" -- GU22-xxxxxxxx-Txxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU22 Frame Series. Size 22x22mm / 0.87"x0.87". Can also be used as Burn in Socket. ●Highly reliable M-pin Probes as contact parts. ●High Frequency. For BGA Device, QFN Device. 0.4mm/0.016" Pitch : 16x16 Contact Max. 0.5mm/0.020" Pitch : 10x10 Contact Max [See More]

  • Socket Type: BGA; LGA; QFNL; Test
  • Voltage Rating: 100
  • Product Type: IC Socket
  • Current Rating: 1
3722753 [IC46-3010-G4HT from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Two-point, dual-sided movable contacts make for excellent reliability. The contact position is high, supporting a short IC lead. Package Type = SIP. Gender = Female. Number of Contacts = 30. Number of Rows = 1. Pitch = 2.54mm. Body Orientation = Straight. Contact Material = Copper Alloy. Contact... [See More]

  • Socket Type: Test
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU29 Frame / BGA pkg, Size 29x30.6mm / 1.14"x1.20" -- GQ29-BGAxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU29 Frame / BGA pkg. Size 29x30.6mm / 1.14"x1.20". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For BGA Device. How to order for Custom design. GQ29-BGAxxxxxxx. *P/N will be informed after... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723015 [IC191-0322-001N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

TSOP-I Package Socket (0.5 mm). Open-top structure. IC package can be inserted/removed by raising/lowering cover. Unique design provides outstanding contact reliability. Lever-operated, so little force is required, and the products durability is enhanced. Package Type = TSOP. Gender = Female. Number... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU31 Frame Series, Size 31x46mm / 1.22"x1.81" -- GU31-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU31 Frame Series. Size 31x46mm / 1.22"x1.81". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU31-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723150 [IC234-0644-024N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

QFP open top-type socket. Makes contact with the leads from the sides of ICs. Keeps foreign matter from touching solder surfaces of IC leads. Works with long and short IC leads. Package Type = QFP. Gender = Female. Number of Contacts = 64. Pitch = 0.8mm. Body Orientation = Straight. Contact Material... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU37 Frame Series, Size 37x39mm / 1.46"x1.54" -- GU37x-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU37 Frame Series. Size 37x39mm / 1.46"x1.54". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃ [See More]

  • Socket Type: Test
  • Contacts Pitch: 0.5000 to 0.8000
  • Product Type: IC Socket
3723166 [IC234-0644-027N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

QFP open top-type socket. Makes contact with the leads from the sides of ICs. Keeps foreign matter from touching solder surfaces of IC leads. Works with long and short IC leads. Package Type = QFP. Gender = Female. Number of Contacts = 64. Pitch = 0.5mm. Body Orientation = Straight. Contact Material... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU40 Frame Series, Size 40x50.25mm / 1.57"x1.98" -- GU40-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU40 Frame Series. Size 40x50.25mm / 1.57"x1.98". Can also be used as Burn in Socket. Customizable to heat sink type. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU40-xxxxxxxxxx. *P/N will be... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723245 [IC234-1004-023N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

QFP open top-type socket. Makes contact with the leads from the sides of ICs. Keeps foreign matter from touching solder surfaces of IC leads. Works with long and short IC leads. Package Type = QFP. Gender = Female. Number of Contacts = 100. Pitch = 0.5mm. Body Orientation = Straight. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU48 Frame Series, Size 48x59.5mm / 1.89"x2.34" -- GU48-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU48 Frame Series. Size 48x59.5mm / 1.89"x2.34". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU48-xxxxxxxxxx. *P/N will be informed after fixing... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723289 [IC234-1204-017N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

QFP open top-type socket. Makes contact with the leads from the sides of ICs. Keeps foreign matter from touching solder surfaces of IC leads. Works with long and short IC leads. Package Type = QFP. Gender = Female. Number of Contacts = 120. Pitch = 0.8mm. Body Orientation = Straight. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU60 Frame Series, Size 60x60mm / 2.36"x2.36" -- GU60-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU60 Frame Series. Size 60x60mm / 2.36"x2.36". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU60-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723318 [IC234-1444-016N from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

QFP open top-type socket. Makes contact with the leads from the sides of ICs. Keeps foreign matter from touching solder surfaces of IC leads. Works with long and short IC leads. Package Type = QFP. Gender = Female. Number of Contacts = 144. Pitch = 0.5mm. Body Orientation = Straight. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU66 Frame Series, Size 58x66mm / 2.29"x2.60" -- GU66-xxxxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU66 Frame Series. Size 58x66mm / 2.29"x2.60". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. How to order for Custom design. GU66-xxxxxxxxxx. *P/N will be informed after fixing specifications. [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723403 [IC51-0484-806 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Clamshell test sockets for QFPs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Range supports a variety of pitches. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU78 Frame / BGA pkg, Size 78x116.7mm / 3.07"x4.59" -- GU78-BGAxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU78 Frame / BGA pkg. Size 78x116.7mm / 3.07"x4.59". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For BGA Device. How to order for Custom design. GU78-BGAxxxxxxx. *P/N will be informed after... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723419 [IC51-0644-807 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Clamshell test sockets for QFPs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Range supports a variety of pitches. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test & Burn-In Socket, GU78 Frame / DIP pkg, Size 78x116.7mm / 3.07"x4.59" -- GU78-DIPxxxxxxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU78 Frame / DIP pkg. Size 78x116.7mm / 3.07"x4.59". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For DIP Device. How to order for Custom design. GU78-DIPxxxxxxx. *P/N will be informed after... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723431 [IC51-1004-809 from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

Clamshell test sockets for QFPs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Range supports a variety of pitches. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test Head -- JCH-xxxxxx-xxP-xxx
from JC Cherry, Inc.

Test Head. ●Suitable for measuring and verifying test sockets, and mount on the board (Burn-In Board). ●Contact method is adopt probe pin which allow easy to measure. ●We are able to design and manufacture according to your specifications, please feel free to contact us. [See More]

  • Socket Type: Test
  • Insulation Resistance: 100
  • Product Type: IC Socket; IC Headers
  • Contact Resistance: 200
3723447 [NP89-10007-G4-BF from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

ZIF socket for PGA. 3 contact points ensure high reliability. Includes mechanism whereby dust is wiped off IC leads when handle is operated. Package Type = PGA. Gender = Female. Number of Contacts = 100. Pitch = 2.54mm. Body Orientation = Straight. Contact Material = Beryllium Copper. Contact... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
Test Socket, GU29 Frame / QFN pkg, Size 29x30.6mm / 1.14"x1.20" -- GQ29-QFNxxxxxxx
from JC Cherry, Inc.

Test Socket. GU29 Frame / QFN pkg. Size 29x30.6mm / 1.14"x1.20". Can also be used as Burn in Socket. ●High reliability. ●Cost competitive. ●Temperature: -40 to +150 ℃. For QFN Device. How to order for Custom design. GQ29-QFNxxxxxxx. *P/N will be informed after fixing... [See More]

  • Socket Type: Test
  • Product Type: IC Socket
3723453 [NP89-7303-G4-BF from Yamaichi Electronics USA, Inc.]
from RS Components, Ltd.

ZIF socket for PGA. 3 contact points ensure high reliability. Includes mechanism whereby dust is wiped off IC leads when handle is operated. Package Type = PGA. Gender = Female. Number of Contacts = 73. Pitch = 2.54mm. Body Orientation = Straight. Contact Material = Beryllium Copper. Contact Plating... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Contact Plating: Gold; Nickel; Gold over Nickel
403819 [24-6554-10 from Aries Electronics, Inc.]
from RS Components, Ltd.

A universal socket which will accept devices of either 0.3, 0.4, or 0.6 inch wide, on 0.1 inch pitch, with a pin width of 0.015 to 0.045 inch. Solder tail pin style. Breakdown voltage: 1000Vac minimum . Life: 25000 cycles. Temperature range -55 to +105 °C. Gender = Female. Number of Contacts =... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Current Rating: 1
403825 [28-6554-10 from Aries Electronics, Inc.]
from RS Components, Ltd.

A universal socket which will accept devices of either 0.3, 0.4, or 0.6 inch wide, on 0.1 inch pitch, with a pin width of 0.015 to 0.045 inch. Solder tail pin style. Breakdown voltage: 1000Vac minimum . Life: 25000 cycles. Temperature range -55 to +105 °C. Gender = Female. Number of Contacts =... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Current Rating: 1
403831 [40-6554-10 from Aries Electronics, Inc.]
from RS Components, Ltd.

A universal socket which will accept devices of either 0.3, 0.4, or 0.6 inch wide, on 0.1 inch pitch, with a pin width of 0.015 to 0.045 inch. Solder tail pin style. Breakdown voltage: 1000Vac minimum . Life: 25000 cycles. Temperature range -55 to +105 °C. Gender = Female. Number of Contacts =... [See More]

  • Socket Type: Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Current Rating: 1
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Socket Type: CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Operating Temperature: -55 to 150
Socket; 0.025 in.; Black; 132; 0.375 in -- 70041863 [2-822064-5 from TE Connectivity ™]
from Allied Electronics, Inc.

Socket; 0.025 in.; Black; 132; 0.375 in [See More]

  • Socket Type: Test; PQFP
  • Number of Contacts: 132
  • Product Type: IC Socket
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]

  • Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Current Rating: 4
  • Product Type: IC Socket
  • Operating Temperature: -55 to 200
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
from Aries Electronics, Inc.

High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]

  • Socket Type: Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]

  • Socket Type: Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40
High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]

  • Socket Type: DIP; Test
  • Operating Temperature: -55 to 150
  • Product Type: IC Socket
  • Contact Type: Spring Loaded
High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]

  • Socket Type: Test
  • Contact Resistance: 40
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]

  • Socket Type: Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Socket Type: Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]

  • Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Operating Temperature: -67 to 392
  • Product Type: IC Socket
  • Contacts Pitch: 2.54
High-Temp (up to 200°C) Universal PGA ZIF Burn-in & Test Sockets
from Aries Electronics, Inc.

FEATURES. A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force. The handle can be provided on right or left hand side. For special handle requirements, consult factory. Any footprint accepted on standard 8x8 to 21x21 grid. GENERAL... [See More]

  • Socket Type: Test
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Current Rating: 1
High-Temp (up to 250°C) RF Test Socket with Replaceable Contact Strips
from Aries Electronics, Inc.

FEATURES. User replaceable patented Microstrip ™ contacts which lie flat on the DUT board, and becomes part of the transmission line decreasing down-time. Same high-frequency performance of our standard Microstrip ™ contacts. Available in lead pitches from 0.4mm to 5.0mm. Easy-to-use... [See More]

  • Socket Type: Test
  • Contact Resistance: 70
  • Product Type: IC Socket
  • Operating Temperature: -40 to 200
High-Temp (up to 300°C) Universal DIP ZIF Burn-in & Test Sockets
from Aries Electronics, Inc.

FEATURES. Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers. Contacts are normally closed to eliminate dependence on plastic to sustain contact. Socket handle can be configured with... [See More]

  • Socket Type: DIP; Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Current Rating: 1
Kelvin Test Socket
from Aries Electronics, Inc.

FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]

  • Socket Type: Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Low-Cost, Quick Turn QFP Prototyping Adapter
from Aries Electronics, Inc.

FEATURES. Mates common QFP packages to standard breadboard and breakout boards for rapid. and easy prototyping. Panelized adapters available upon request. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces. PIN INSULATOR: Polyester, UL 94V-0. PINS: 360... [See More]

  • Socket Type: Test
  • Mounting: Through-Hole
  • Product Type: Prototyping Adapters
  • Operating Temperature: -55 to 125
Low-Cost, Quick Turn Small Outline Prototyping Adapter
from Aries Electronics, Inc.

FEATURES. Mates SOT23, SOIC, MSOP, or TSSOP packages to standard breadboard and breakout boards for rapid and easy prototyping. Panelized adapters available upon request. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL 94V-0 with 1/2-oz. Cu traces. PIN INSULATOR: Polyester, UL... [See More]

  • Socket Type: Test
  • Mounting: Through-Hole
  • Product Type: Prototyping Adapters
  • Operating Temperature: -55 to 122
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages
from Aries Electronics, Inc.

FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]

  • Socket Type: BGA; DIP; Test
  • Contact Resistance: 40
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Type: Spring Loaded
PGA ZIF Test and Burn-in Sockets
from Aries Electronics, Inc.

FEATURES. A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force. The handle can be provided on right or left hand side. For special handle requirements, consult factory. Any footprint accepted on standard 13x13 to 21x21 grid. GENERAL... [See More]

  • Socket Type: PGA; Test
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Current Rating: 1
Quick-Release Universal DIP ZIF Test Socket – Series X57X
from Aries Electronics, Inc.

FEATURES. Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers. All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as... [See More]

  • Socket Type: DIP; Test
  • Mounting: Solder
  • Product Type: IC Socket
  • Operating Temperature: -55 to 200
RF Test Sockets w/Replaceable Contact Strips
from Aries Electronics, Inc.

FEATURES. User replaceable patented Microstrip ™ contacts which lie flat on the DUT board, and become part of the transmission line decreasing down-time. Same high-frequency performance of our standard Microstrip ™ contacts. Available in lead pitches from 0.4mm to 5.0mm. Easy to use... [See More]

  • Socket Type: Test
  • Contact Resistance: 70
  • Product Type: IC Socket
  • Contact Plating: Gold (optional feature); Nickel (optional feature)