ZIP / SZIP IC Interconnect Components
from Aries Electronics, Inc.
FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]
- Socket Type: BGA; CSP; LGA; SZIP
- Mounting: Through-Hole
- Product Type: IC Socket
- Operating Temperature: -55 to 150