ZIP / SZIP IC Interconnect Components

CSP/BallNest™Hybrid Socket
from Aries Electronics, Inc.

FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]

  • Socket Type: BGA; CSP; LGA; SZIP
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150