LGA IC Interconnect Components

Test & Burn-In Socket, GU22 Frame Series, Size 22x22mm / 0.87"x0.87" -- GU22-xxxxxxxx-Txxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU22 Frame Series. Size 22x22mm / 0.87"x0.87". Can also be used as Burn in Socket. ●Highly reliable M-pin Probes as contact parts. ●High Frequency. For BGA Device, QFN Device. 0.4mm/0.016" Pitch : 16x16 Contact Max. 0.5mm/0.020" Pitch : 10x10 Contact Max [See More]

  • Socket Type: BGA; LGA; QFNL; Test
  • Voltage Rating: 100
  • Product Type: IC Socket
  • Current Rating: 1
LGA Sockets -- 1-1554653-1
from TE Connectivity

Body Features. Frame Style  : Square. Plating Material  : Gold. Plating Thickness (MICIN)  : 30. Configuration Features. Grid Spacing  : 1.016 x .8814  MM   [.040 x .0347  INCH  ]. Number of Positions  : 2011. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Socket Type: BGA; LGA; Test
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
LGA Sockets -- 1-2324271-1
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 30. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 2092. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 1-2324271-5
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 30. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 2092. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 1554653-1
from TE Connectivity

Body Features. Frame Style  : Square. Plating Material  : Gold. Plating Thickness (MICIN)  : 15. Configuration Features. Grid Spacing  : 1.016 x .8814  MM   [.040 x .0347  INCH  ]. Number of Positions  : 2011. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 2-2129710-1
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 15. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 1824. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 2-2129710-2
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 15. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 1823. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 2-2129710-7
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 30. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 1824. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
LGA Sockets -- 2-2129710-8
from TE Connectivity

Body Features. Frame Style  : C Shape. Plating Material  : Gold. Plating Thickness (MICIN)  : 30. Configuration Features. Grid Spacing  : .9906 x .8585  MM   [.039 x .0338  INCH  ]. Number of Positions  : 1823. Contact Features. Contact... [See More]

  • Socket Type: LGA
  • Mounting: SMT; Board Mount
  • Product Type: IC Socket
  • Current Rating: 0.5000
ES-Micro H-Pin IC Socket -- ES-Micro H-Pin Socket
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]

  • Socket Type: LGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 35
CSP/BallNest™Hybrid Socket
from Aries Electronics, Inc.

FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]

  • Socket Type: BGA; CSP; LGA; SZIP
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Open Top H-Pin IC Socket (RA) -- Open Top H-Pin Socket (RA)
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability... [See More]

  • Socket Type: LGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 30
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]

  • Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Current Rating: 4
  • Product Type: IC Socket
  • Operating Temperature: -55 to 200
Open Top H-Pin® IC Socket (RB) -- Open Top H-Pin® Socket (RB)
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability... [See More]

  • Socket Type: LGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 30
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]

  • Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Operating Temperature: -67 to 392
  • Product Type: IC Socket
  • Contacts Pitch: 2.54
QH H-Pin® IC Socket -- QH H-Pin® Socket
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability... [See More]

  • Socket Type: LGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 35