Solderless IC Interconnect Components

CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Features: Solderless
  • Socket Type: CSP; Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
SOIC/SOJ Test Clip -- 5250 [5250 from Pomona Electronics]
from All-Spec Industries

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  • Features: Solderless
  • Mounting: SMT
  • Product Type: Pin Probes
  • Contact Type: Spring Loaded
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
from Aries Electronics, Inc.

High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: DIP; Test
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket
  • Contact Resistance: 40
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
Kelvin Test Socket
from Aries Electronics, Inc.

FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]

  • Features: Solderless; Clamshell Socket
  • Socket Type: Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages
from Aries Electronics, Inc.

FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]

  • Features: Solderless; Clamshell Socket (optional feature)
  • Socket Type: BGA; DIP; Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40