QFP IC Interconnect Components

10 Results
IC & Component Sockets -- 97-AQ132D [97-AQ132D from Aries Electronics, Inc.]
from Powell Electronics, Inc.

IC & Component Sockets 132P PQFP/PGASKT [See More]

  • Socket Type: PGA; QFP
  • Product Type: IC Socket
132-Pin Amp PQFP-to-PGA Footprint Socket
from Aries Electronics, Inc.

FEATURES. Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
Sockets & Adapters Socketed Mini Mod SPC560P QFP64 -- 761-SPC560PADPT64S [SPC560PADPT64S from STMicroelectronics]
from Utmel Electronic Limited

Sockets & Adapters Socketed Mini Mod SPC560P QFP64 [See More]

  • Socket Type: QFP
  • RoHS Compliant: RoHS Compliant
  • Product Type: IC Socket; Package Adapters / Converters
  • Mounting: Fixed
144-Pin QFP-to-PGA Adapter for Motorola 68340
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
144-Pin VQFP-to-PGA Adapter
from Aries Electronics, Inc.

FEATURES. Convert surface-mount VQFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
High-Frequency (RF) Interposer Socket
from Aries Electronics, Inc.

FEATURES. Pressure-mount plunge to board interposer. Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more. Very low inductance per contact site. High cycle life with easy maintenance. Manual or Automated Handler applications. GENERAL SPECIFICATIONS. INSERTION LOSS: less than -1dB... [See More]

  • Socket Type: BGA; CSP; QFNL; QFP
  • Current Rating: 4
  • Product Type: IC Socket
  • Contact Resistance: 20
QFP-to-PGA Adapter for 160-Position, 0.0256" [0.65mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 15x15 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
QFP-to-PGA Adapter for JEDEC 132-Position, 0.025" [0.64mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
QFP-to-PGA Adapter for Motorola DSP56000/001
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 13x13 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
QFP-to-PGA Adapter for SOIC (EIAJ) 208-Position, 0.0197" [0.50mm] Pitch
from Aries Electronics, Inc.

FEATURES. Convert surface-mount QFP packages to a 17x17 PGA footprint. Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and... [See More]

  • Socket Type: QFP
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105