BGA IC Interconnect Components

Test & Burn-In Socket, GU22 Frame Series, Size 22x22mm / 0.87"x0.87" -- GU22-xxxxxxxx-Txxx
from JC Cherry, Inc.

Test & Burn-In Socket. GU22 Frame Series. Size 22x22mm / 0.87"x0.87". Can also be used as Burn in Socket. ●Highly reliable M-pin Probes as contact parts. ●High Frequency. For BGA Device, QFN Device. 0.4mm/0.016" Pitch : 16x16 Contact Max. 0.5mm/0.020" Pitch : 10x10 Contact Max [See More]

  • Socket Type: BGA; LGA; QFNL; Test
  • Voltage Rating: 100
  • Product Type: IC Socket
  • Current Rating: 1
Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Socket Type: BGA; LGA; Test
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
C-Series H-Pin® IC Socket -- C-Series H-Pin® Socket
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]

  • Socket Type: BGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 35
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Header -- 587-XX-216-09-005437
from Mill-Max Mfg. Corp.

Surface Mount .050 Grid; BGA Header [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
D-Series H-Pin® IC Socket -- D-Series H-Pin® Socket
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]

  • Socket Type: BGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 35
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Header -- 599-XX-004-01-003429
from Mill-Max Mfg. Corp.

Surface Mount 0.8mm Grid; BGA Header [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
Open Top H-Pin® IC Socket (RA) -- Open Top H-Pin® Socket (RA)
from Plastronics Socket Company, Inc.

Flexible socket designs - reduced cost and. lead-time. Integrated socket solutions - reduced risk. In-house tool and mold - rapid response and turnaround. Extensive catalog - easy purchase. Plastronics patented technologies are based on solving the difficult industry problems associated with high... [See More]

  • Socket Type: BGA
  • Current Rating: 1
  • Product Type: IC Socket
  • Contact Resistance: 30
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Socket -- 582-XX-216-09-005414
from Mill-Max Mfg. Corp.

Surface Mount .050 Grid; BGA Socket [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Socket
  • Contact Plating: Gold; Gold Shell, Gold Inner Contact
Single Beam IC Socket -- Single Beam Socket
from Plastronics Socket Company, Inc.

Less complex and more precise tooling. Larger arrays - increase socket utilization. Socket footprint - increase board utilization. Slider-carrier - less contact stress loads. More robust - increase socket life. Plastronics patented technologies are based on solving the difficult industry problems... [See More]

  • Socket Type: BGA
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Current Rating: 1
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Socket -- 582-XX-336-10-007414
from Mill-Max Mfg. Corp.

Surface Mount .050 Grid; BGA Socket [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Socket
  • Contact Plating: Gold; Gold Shell, Gold Inner Contact
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Socket -- 599-XX-004-01-003442
from Mill-Max Mfg. Corp.

Surface Mount 0.8mm Grid; BGA Socket [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Socket
  • Contact Plating: Gold; Gold Shell, Gold Inner Contact
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Ball Grid Array Socket -- 599-XX-054-04-005428
from Mill-Max Mfg. Corp.

Surface Mount 1mm Grid; BGA Socket [See More]

  • Socket Type: BGA
  • Mounting: SMT
  • Product Type: IC Socket
  • Contact Plating: Gold; Gold Shell, Gold Inner Contact
CSP/BallNest™Hybrid Socket
from Aries Electronics, Inc.

FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]

  • Socket Type: BGA; CSP; LGA; SZIP
  • Mounting: Through-Hole
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, high-current, reliable, durable). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low cost hand test... [See More]

  • Socket Type: BGA; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Current Rating: 4
  • Product Type: IC Socket
  • Operating Temperature: -55 to 200
High-Frequency (RF) Interposer Socket
from Aries Electronics, Inc.

FEATURES. Pressure-mount plunge to board interposer. Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more. Very low inductance per contact site. High cycle life with easy maintenance. Manual or Automated Handler applications. GENERAL SPECIFICATIONS. INSERTION LOSS: less than -1dB... [See More]

  • Socket Type: BGA; CSP; QFNL; QFP
  • Current Rating: 4
  • Product Type: IC Socket
  • Contact Resistance: 20
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration
from Aries Electronics, Inc.

KEY PERFORMANCE ELEMENTS – Series AR4HT. High-Temperature 200 °C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing). Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). [See More]

  • Socket Type: BGA; CSP; LGA; QFNL; Test; MLCC, Bumped Die Devices
  • Operating Temperature: -67 to 392
  • Product Type: IC Socket
  • Contacts Pitch: 2.54
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages
from Aries Electronics, Inc.

FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]

  • Socket Type: BGA; DIP; Test
  • Contact Resistance: 40
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Type: Spring Loaded