SIP IC Interconnect Components
Last Updated: April 1, 2025
Description
System-in-Package (SiP) IC Interconnect Components are designed to integrate multiple integrated circuits (ICs) and passive components within a single chip carrier package. This packaging approach allows the SiP to perform the functions of an entire system, effectively combining various functionalities into a compact form factor .
Working Principle
SiP technology utilizes advanced interconnect methods to combine different ICs and passive components into a single package. This integration is achieved by subdividing large complex chip designs into functional circuit blocks, known as chiplets, which are then recombined onto a high-density substrate. This approach allows for the emulation of more complex ICs and helps overcome the limitations of traditional system-on-a-chip (SoC) architectures, particularly as Moore's Law slows down .
Applications
SiP IC Interconnect Components are particularly useful in applications where space is limited, and multiple functionalities need to be integrated into a single package. For example, they are used in flip chip and memory package applications, where a central ASIC device is surrounded by high-speed memory devices, decoupling capacitors, and terminating resistors. This configuration is common in high-performance computing and telecommunications systems .
Advantages over other IC Interconnect Components
One of the main advantages of SiP over traditional SoC architectures is its ability to circumvent the increasing costs associated with SoC production. By using chiplets, SiP can offer a more cost-effective solution while still providing the necessary performance and functionality. Additionally, SiP technology allows for greater flexibility in design, as different chiplets can be combined to meet specific system requirements .
Limitations
SiP technology does have its limitations. The initial design phase can be challenging due to the complexity of component layout and the wireability demands between components. Ensuring that the interconnects between components and the I/O of the package are achievable requires careful planning and design. Additionally, the integration of multiple components into a single package can lead to issues with parasitic inductance, capacitance, and resistance, which can affect performance at higher frequencies .
Considerations
When considering SiP IC Interconnect Components, it is important to evaluate the initial costs, which can be significant due to the complexity of the design and the need for advanced simulation tools. Operating expenses may also be higher compared to traditional ICs, as the integration of multiple components can lead to increased power consumption. Durability and accuracy are generally high, but the complexity of the package can make replacement and maintenance more challenging and costly. Therefore, careful consideration of the specific application requirements and long-term costs is essential when choosing SiP technology .
from TE Connectivity
Body Features. Color : Black. Sleeve Material : Copper. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 10. Number of Rows : 1. Contact Features. Contact Base Material : Beryllium Copper. Contact Current Rating (Max) (AMP)... [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 3
from TE Connectivity
Body Features. Color : Black. Sleeve Material : Copper. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 10. Number of Rows : 1. Contact Features. Contact Base Material : Beryllium Copper. Contact Current Rating (Max) (AMP)... [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 3
from TE Connectivity
Configuration Features. Number of Positions : 16. Contact Features. Contact Current Rating (Max) (AMP) : 1. Housing Features. Centerline (Pitch) : 2.54 MM [.09 INCH ]. Mechanical Attachment. Connector Mounting Type : Board Mount. [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 1
from TE Connectivity
Configuration Features. Number of Positions : 20. Contact Features. Contact Current Rating (Max) (AMP) : 1. Housing Features. Centerline (Pitch) : 2.54 MM [.09 INCH ]. Mechanical Attachment. Connector Mounting Type : Board Mount. [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 1
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 9. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 9
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 15. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 15
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 32. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 32
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 40. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 40
from TE Connectivity
Body Features. Sleeve Material : Brass. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 10. Contact Features. Contact Base Material : Beryllium Copper. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 1
from TE Connectivity
Body Features. Color : Black. Sleeve Material : Brass. Sleeve Plating Material : Gold. Configuration Features. Number of Positions : 10. Number of Rows : 1. Contact Features. Contact Base Material : Beryllium Copper. Contact Current Rating (Max) (AMP)... [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 3
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 10. Contact Features. Contact Base Material : Copper Alloy. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Mounting: Board Mount
- Product Type: IC Socket
- Current Rating: 1
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 10. Contact Features. Contact Base Material : Copper Alloy. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Current Rating: 1
- Product Type: IC Socket
- Operating Temperature: -67 to 257
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 16. Contact Features. Contact Base Material : Copper Alloy. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Current Rating: 1
- Product Type: IC Socket
- Operating Temperature: -67 to 257
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 20. Contact Features. Contact Base Material : Copper Alloy. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Current Rating: 1
- Product Type: IC Socket
- Operating Temperature: -67 to 257
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Sleeve Plating Material : Tin. Configuration Features. Number of Positions : 20. Contact Features. Contact Base Material : Copper Alloy. Contact Current Rating (Max) (AMP) : 1. Contact Mating Area Plating Material... [See More]
- Socket Type: SIP
- Current Rating: 1
- Product Type: IC Socket
- Operating Temperature: -67 to 257
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 2. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 2
from TE Connectivity
Body Features. Sleeve Material : Copper Alloy. Configuration Features. Number of Positions : 4. Contact Features. Contact Base Material : Copper Alloy. Housing Features. Centerline (Pitch) : 2.54 MM [.1 INCH ]. Operation/Application. [See More]
- Socket Type: SIP
- Operating Temperature: -67 to 257
- Product Type: IC Socket
- Number of Contacts: 4
from JC Cherry, Inc.
Modular Socket for Power Semiconductor Package. For Power Transistor. For SIP Package. For Intelligent Power Module(IPM). - Able to place with various layout according to the package. - Kelvin contact type. - High temperature type. - We also design and manufacture sockets according to your... [See More]
- Socket Type: DIP; SIP
- Contact Resistance: 20
- Product Type: IC Socket
- Operating Temperature: -55 to 150
from Advanced Interconnections Corp.
Single In-Line "Snap SIP" Socket Strips are breakable at .100" (2.54mm) increments for ultimate inventory flexibility. [See More]
- Socket Type: SIP; Receptacle; Display Socket
- RoHS Compliant: RoHS Compliant (optional feature)
- Product Type: IC Socket
- Mounting: SMT (optional feature); Through-Hole; Solder
from Excel Cell Electronic USA Corp.
Life cycle of 100 operations [See More]
- Socket Type: SIP
- Mounting: Through-Hole
- Product Type: IC Socket
- Insulation Resistance: 1.00E7