SOIC / SOP IC Interconnect Components

SOIC Adapter Series
from Advanced Interconnections Corp.

Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC Devices (SOIC to DIP). RoHS Compliant designs and mating DIP Sockets are available. [See More]

  • Socket Type: SIP; SOIC
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Headers; Package Adapters / Converters
  • Mounting: Through-Hole; Solder
Series 350000 SOIC & SOJ-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu... [See More]

  • Socket Type: SOIC
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Current Rating: 3
Series 350000-11-RC Lead-Free RoHS/WEEE-Compliant SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16] or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with... [See More]

  • Socket Type: SOIC
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
Series 350000-HT High-Temperature SOIC-to-DIP Adapter
from Aries Electronics, Inc.

FEATURES. A cost-effective means of upgrading to SOIC without changing your PCB layout. Available on 0.300 [7.62] centers. For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58] thick Polyimide, Tg 260 °C with 1-oz. [See More]

  • Socket Type: SOIC
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 93
Series 354000 DIP-to-SOIC Adapter
from Aries Electronics, Inc.

FEATURES. Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts. GENERAL SPECIFICATIONS. SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170 °C continuous use temp. PCB: FR-4, 0.062 [1.58] thick. MALE ADAPTER PIN: Brass 360 1/2-hard per UNS C36000, ASTM... [See More]

  • Socket Type: SOIC
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Current Rating: 3
Series 354000 DIP-to-SOIC Adapter – RoHS/WEEE-Compliant
from Aries Electronics, Inc.

FEATURES. A lead-free RoHS/WEEE-compliant cost-effective adapter to upgrade DIP-to-SOIC on 0.300" [7.62] centers without changing your PCB layout. GENERAL SPECIFICATIONS. SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170 °C continuous use temperature. PCB: 0.062 [1.58] thick FR-4 or IS410... [See More]

  • Socket Type: SOIC
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
Series 45000X-11-RC & 65000X-11-RC SOIC & SOJ-to-DIP Adapter – RoHS/WEEE-Compliant
from Aries Electronics, Inc.

FEATURES. Lead-Free RoHS/WEEE-compliant. A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout. Available on 0.400 [10.16] and 0.600 [15.24] centers. For Adapters on 0.300 [7.62] centers, consult Data Sheet 18010. GENERAL SPECIFICATIONS. BOARD MATERIAL: 0.062 [1.58]... [See More]

  • Socket Type: SOIC
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
SOIC-to-JEDEC TO Adapter
from Aries Electronics, Inc.

FEATURES. 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board. For Panelized Form or for... [See More]

  • Socket Type: SOIC
  • Mounting: Through-Hole
  • Product Type: Package Adapters / Converters
  • Operating Temperature: 105
SOIC-to-JEDEC TO Adapter RoHs-Compliant
from Aries Electronics, Inc.

FEATURES. Lead-Free RoHs/WEEE-compliant. 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the... [See More]

  • Socket Type: SOIC
  • RoHS Compliant: RoHS Compliant
  • Product Type: Package Adapters / Converters
  • Mounting: Through-Hole
Universal SOIC ZIF Test Socket – Series 547
from Aries Electronics, Inc.

FEATURES. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC Gull-wing and J-lead devices, up to 44 pins on 0.050 [1.27] lead pitch, body widths from 0.150 to... [See More]

  • Socket Type: SOIC; Test
  • Current Rating: 1
  • Product Type: IC Socket
  • Operating Temperature: 125