CSP IC Interconnect Components

BGA 0.50/0.65mm Socket Adapter System
from Advanced Interconnections Corp.

This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package,... [See More]

  • Socket Type: BGA; CSP; LGA; Receptacle (optional feature); Test (optional feature)
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket; IC Headers; Package Adapters / Converters
  • Mounting: SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Socket Type: CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Socket Type: BGA; CSP; Test
  • Mounting: Press-fit / Solderless Technology
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150