Spring Loaded IC Interconnect Components

Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Contact Type: Low Profile Pins (optional feature); Solder Tail Pins (optional feature); Spring Loaded
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Socket Type: BGA; LGA; Test
SOIC/SOJ Test Clip -- 5250 [5250 from Pomona Electronics]
from All-Spec Industries

[See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: Pin Probes
  • Number of Contacts: 8
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: CSP; Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
H033 Series H-Pin
from Plastronics Socket Company, Inc.

Access to a high performance pin at a very low cost. Ability to reduce cost through blanket purchases. Stable high volume, 100% automated supply chain. On-site inventory – zero cost and zero lead-time. 18 of the top 25 semiconductor companies in the world have used the H-Pin. For customers... [See More]

  • Contact Type: Spring Loaded
  • Current Rating: 2.9
  • Product Type: PCB Pins
  • Contact Resistance: 35
integraMate™ 0.6mm Hyperboloid PCB Termination Socket
from QA Technology Company, Inc.

QA Technology integraMate ® Contact Systems use high quality, high reliability hyperboloid contacts intended for a wide range of applications. Our patented design provides lower insertion force, closer connector pin spacing, and better protection from damage than competitive designs. In... [See More]

  • Contact Type: Spring Loaded
  • RoHS Compliant: RoHS Compliant
  • Product Type: PCB Receptacles
  • Current Rating: 4
Insulated Spring Pin -- 807-XX-001-30-000101
from Mill-Max Mfg. Corp.

Spring-Loaded Header Initial Height .100" (2,54mm) [See More]

  • Contact Type: Spring Loaded
  • Contact Plating: Gold; Gold Shell
  • Product Type: PCB Pins
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which, are accurately... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
H057 Series H-Pin
from Plastronics Socket Company, Inc.

Access to a high performance pin at a very low cost. Ability to reduce cost through blanket purchases. Stable high volume, 100% automated supply chain. On-site inventory – zero cost and zero lead-time. 18 of the top 25 semiconductor companies in the world have used the H-Pin. For customers... [See More]

  • Contact Type: Spring Loaded
  • Current Rating: 3
  • Product Type: PCB Pins
  • Contact Resistance: 30
Insulated Spring Pin -- 807-XX-001-30-001101
from Mill-Max Mfg. Corp.

Spring-Loaded Header Initial Height .137" (3,48mm) [See More]

  • Contact Type: Spring Loaded
  • Contact Plating: Gold; Gold Shell
  • Product Type: PCB Pins
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square
from Aries Electronics, Inc.

CSP/ µBGA Test & Burn-In Socket for Devices up to 13mm Square. Chinese. FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications. Any device pitch of 0.20mm and larger. Sockets are easily mounted/removed to and from... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
H077 Series H-Pin
from Plastronics Socket Company, Inc.

Access to a high performance pin at a very low cost. Ability to reduce cost through blanket purchases. Stable high volume, 100% automated supply chain. On-site inventory – zero cost and zero lead-time. 18 of the top 25 semiconductor companies in the world have used the H-Pin. For customers... [See More]

  • Contact Type: Spring Loaded
  • Current Rating: 4
  • Product Type: PCB Pins
  • Contact Resistance: 16
Insulated Spring Pin -- 807-XX-001-30-003101
from Mill-Max Mfg. Corp.

Spring-Loaded Header Initial Height .177" (4,50mm) [See More]

  • Contact Type: Spring Loaded
  • Contact Plating: Gold; Gold Shell
  • Product Type: PCB Pins
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 810-XX-002-40-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Horizontal Mount, 0.1 pitch 0.09 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single Point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 811-XX-001-30-000101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.039 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. 4-point crown insures “scrub ” on solder oxides. Single-point Probes available for small land area contact pads. Signal path... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 811-XX-001-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.045 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 812-XX-002-30-000101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
CSP/BallNest™Hybrid Socket
from Aries Electronics, Inc.

FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; CSP; LGA; SZIP
  • Product Type: IC Socket
  • Mounting: Through-Hole
SLC Header -- 812-XX-002-30-000191
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
from Aries Electronics, Inc.

High-Frequency Center Probe Test Socket for Devices up to 27mm Square. Chinese. FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4-point crown insures “scrub ” on... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 812-XX-003-30-010101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount with Alignment Pins, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which are accurately located by two molded plastic... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 813-XX-004-30-000101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.039 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4 Point crown insures scrub on solder oxides. Single-point Probes available for small land area contact pads. Signal path during test only 0.077 [1.96]. Socket is easily mounted... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: DIP; Test
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
SLC Header -- 813-XX-004-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.045 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
from Aries Electronics, Inc.

FEATURES. For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. 4-point crown insures scrub on solder oxides, while pointed probe works with LGA ’s, MLF ’s, etc. Single-point Probes available for small land area contact pads. Signal... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket
  • Contact Resistance: 40
SLC Header -- 814-XX-004-30-000101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square
from Aries Electronics, Inc.

FEATURES. For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any pitch device from 0.20mm. Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression Spring-Probes which, are accurately located by two molded plastic... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 814-XX-004-30-000191
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
from Aries Electronics, Inc.

FEATURES. For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Any device pitch from 0.20mm. Pressure mounting, no soldering required. 4 Point crown (other styles also available) insures scrub on solder oxides. Signal path during test only 0.077 [1.96]. [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 814-XX-006-30-010101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount with Alignment Pins, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
Kelvin Test Socket
from Aries Electronics, Inc.

FEATURES. Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
SLC Header -- 815-XX-001-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages
from Aries Electronics, Inc.

FEATURES. Solderless Spring-Probes pressure mount to the test board and device solder ball or pad. Only 0.077 [1.96] signal path. Very low inductance and capacitance. Small footprint allows max. use of test board area. Chip guides allow accurate device location. Spring loaded contacts provide high... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: BGA; DIP; Test
  • Product Type: IC Socket; IC Probing / Analysis Adapters
  • Contact Resistance: 40
SLC Header -- 816-XX-002-10-000101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 817-XX-004-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.024 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 818-XX-004-10-000101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 819-XX-001-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.09 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 820-XX-004-30-001101
from Mill-Max Mfg. Corp.

Surface Mount Spring-Loaded Header Vertical Mount SMT, 0.1 pitch 0.09 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: SMT
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 821-XX-002-10-000101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.039 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 821-XX-002-10-001101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.045 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 823-XX-004-10-000101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.039 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 823-XX-004-10-001101
from Mill-Max Mfg. Corp.

Through Hole Spring-Loaded Header Vertical Mount Through-Hole, 0.1 pitch 0.045 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Through-Hole
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell
SLC Header -- 824-XX-002-00-001000
from Mill-Max Mfg. Corp.

Spring-Loaded Header Vertical Mount Soldercup Tail, 0.1 pitch 0.055 stroke [See More]

  • Contact Type: Spring Loaded
  • Mounting: Solder
  • Product Type: IC Headers
  • Contact Plating: Gold; Gold Shell