Anti-static / ESD Control Industrial Adhesives
Last Updated: April 1, 2025
Description
Anti-static / ESD Control Industrial Adhesives are specialized adhesives designed to prevent the buildup of static electricity and protect sensitive electronic components from electrostatic discharge (ESD). These adhesives are formulated to inhibit triboelectric charging, which occurs when materials become electrically charged through contact or friction with other materials.
Working Principle
The working principle of anti-static and ESD control adhesives involves the use of dissipative materials that allow static charges to flow to the ground more slowly and in a controlled manner. This is achieved by incorporating materials with specific surface resistance properties that prevent rapid discharge, which can damage electronic components. By controlling the rate at which static charges are dissipated, these adhesives help protect sensitive electronics from ESD, thereby enhancing their reliability and longevity.
Applications
Anti-static / ESD control adhesives are widely used in various industries where static electricity poses a risk to electronic components. Specific applications include:
- Electronics Industry: Used in the assembly of printed circuit boards (PCBs), LEDs, and LCDs to prevent ESD damage.
- Aerospace: Bonding composite structures to metallic frames while ensuring ESD protection.
- Automotive: Sealing and bonding panels in vehicles to prevent static buildup that could interfere with electronic systems.
Advantages over other Industrial Adhesives
Anti-static / ESD control adhesives offer several advantages over traditional adhesives:
- ESD Protection: Unlike standard adhesives, these adhesives provide a controlled path for static discharge, protecting sensitive electronics from damage.
- Electromagnetic Interference (EMI) Shielding: They can act as a Faraday cage, distributing charge around the coated object and providing EMI shielding, which is crucial in high-frequency environments.
- Versatility: Suitable for a wide range of substrates, including metals, plastics, and ceramics, offering strong adhesion and chemical resistance.
Limitations
Despite their benefits, anti-static / ESD control adhesives have certain limitations:
- Cost: These adhesives can be more expensive than standard adhesives due to their specialized formulations.
- Application Specificity: They may not be suitable for all types of bonding applications, particularly where high mechanical strength is required without ESD considerations.
Considerations
When selecting anti-static / ESD control adhesives, several factors should be considered:
- Initial Costs: The specialized nature of these adhesives can lead to higher upfront costs compared to conventional adhesives.
- Operating Expense: While they offer protection against ESD, the cost of maintaining and replacing these adhesives should be factored into the overall expense.
- Durability and Maintenance: Consider the environmental conditions and the potential need for reapplication or maintenance to ensure continued ESD protection.
- Accuracy: Ensure that the adhesive's properties align with the specific requirements of the application, particularly in terms of surface resistance and charge dissipation rates.
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350 °F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid "snap cures". The recommended cure for optimum bond strength is 2 minutes at 375-400... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Thermally Conductive; Water Based ; Anti-static, ESD
- Composition: Filled
- Chemical System: Sodium Silicate System
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. It is non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Sealant; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component