OEM / Industrial Industrial Adhesives
from RS Components, Ltd.
RS PRO RS101 Adhesive [See More]
- Industry: OEM or Industrial; Industrial
- Type / Form: Liquid
- Chemical System: Epoxy resin; Epoxy
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from RS Components, Ltd.
Quick setting epoxy adhesive,200ml [See More]
- Industry: OEM or Industrial; Industrial
- Type / Form: Liquid
- Chemical System: Bisphenol a-(epichlorhydrin), bisphenol f
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Teroson TEROSTAT 92, WEISS Adhesive [See More]
- Industry: OEM or Industrial; Industrial
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
TEROSTAT 92 PU- ADHESIVE GREY" [See More]
- Industry: OEM or Industrial; Industrial
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from RS Components, Ltd.
Quick setting epoxy adhesive,40ml [See More]
- Industry: OEM or Industrial; Industrial
- Type / Form: Liquid
- Chemical System: Bisphenol a-(epichlorhydrin), bisphenol f
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Brake Bonder 362 is a black heat curing, nitrile/phenolic solvent-based adhesive. Cured Brake Bonder 362 furnishes excellent resistance to thermal shock, chemicals, and water. The cured bond withstands temperatures exceeding 600 °F (315 °C). The primary application for Brake Bonder 362 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 370 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 370 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Electronics; Sanitary; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Hernon ® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond ® 374. Fusionbond ® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 375 is a highly thixotropic, two component, room temperature curing, 1:1 ratio, methacrylate adhesive system. Fusionbond ® 375 is formulated to provide fixturing strength within 7 to 10 minutes. This adhesive product forms resilient bonds and maintains its strength over a wide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
- Chemical System: Vinyl; Acrylic
- Substrate Compatibility: Metal; Plastic; PVC, acrylic, ABS, stainless steel, and some types of fiberglass
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
Assembly of cylindrical parts, such as rotors, gears, bushings, collars and bearings, can be effectively and reliably accomplished with HERNON ® ’s line of Cylinlock ® Retaining Compounds. Cylinlock ® high strength products eliminate the need for mechanical methods of assembly... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Type / Form: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® RT 2100 is a room temperature vulcanizing silicone rubber. It is. especially useful for electrical insulation applications such as potting, encapsulating, embedding, sealing and environmental protection. ELASTOSIL ® RT 2100 is simple to handle and offers a balanced property... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Gel
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: UV or Radiation Cured
- Chemical System: Epoxy
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
Krylex KT722 is a high strength, high viscosity, high service temperature, anaerobic thread locker. KT722 cures when confined in the absence of air between close-fitting metal surfaces. KT722 is formulated to lock all metric and imperial nuts and bolts, preventing vibration loosening and leakage... [See More]
- Industry: Construction; OEM or Industrial
- Cure / Technology: Anaerobic; Two Component (optional feature); Single Component
- Chemical System: Dimethacrylate
- Type / Form: Liquid
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from AkzoNobel N.V.
Engineered wood and laminates are an important part of the wood products industry. And, for over 80 years, we ™ve provided the innovative and market-leading wood adhesives and board resins that make engineered wood products a more dimensional, durable, and stable substrate than solid wood. [See More]
- Industry: OEM or Industrial
- Substrate Compatibility: Composites; Wood
- Features: Laminaes
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]
- Industry: Electronics; OEM or Industrial
- Type / Form: Sheet or Film
- Chemical System: Polyimide
- Features: Encapsulant, Potting Compound; UL Rating
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Industry: OEM or Industrial
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ Contact Adhesive 2000NF Blue is a water-dispersed, high solids, activated adhesive. Provides immediate bonding and handling strength bonds flexible polyurethane and latex foams, plastic laminate, wood, plywood, without forced drying equipment. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Two Component ; Contact or Pressure Sensitive Adhesives
- Chemical System: Elastomeric
- Type / Form: Liquid
from Sheldahl Flexible Technologies - a Flex company
We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials for audio and medical... [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
- Features: Flame Retardant; Laminaes; Thermal Insulation
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Type / Form: Liquid
from FSI
OnePart is FSI ’s moisture-cure adhesive with time-tested results in a wide variety of commercial and industrial applications, including entry and garage doors, recreational vehicle components, building and construction products (like SIPs, structural insulated panels) and more. It ’s... [See More]
- Industry: Construction; OEM or Industrial
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Polyurethane
- Features: Laminaes; Thermal Insulation
from Cattie Adhesive Solutions
Hot Melts & Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS. Cattie Adhesive Solutions offers a Complete line of high quality Hot Melts, Low Temperature Hot Melts and Water-Based Adhesives for BOOKBINDING & GRAPHIC ARTS applications. For more info, Please call one of our Adhesive... [See More]
- Industry: OEM or Industrial; Book Bindings, Stationary
- Cure / Technology: Thermoplastic / Hot Melt
- Composition: Unfilled
- Type / Form: Pellets
from CoorsTek
CoorsTek understands ceramic-to-metal bonding and offers a diverse product portfolio of Durall ™ adhesive products. Our industrial bonding experts will help you select the best adhesive for your specific wear application to ensure long-lasting bonds and reduced downtime for critical material... [See More]
- Industry: OEM or Industrial; Material Handling
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Ceramic; Silicone
- Type / Form: Gel; Liquid
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Industry: Sanitary; OEM or Industrial; Sporting Goods
- Cure / Technology: Cure Temperature: 250 - 320 F
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from Berry Plastics Corporation - Engineered Materials Division
Nashua Tapes Products 398 Spray Adhesive. GENERAL PURPOSE SPRAY ADHESIVE - LOW VOC. Aggressive spray adhesive designed for temporary and permanent bonding. (Net weight 12 oz. NT WT, 17 Fluid oz.) Meets FDA requirements for indirect food packaging when used in accordance with 21 CFR 175.105. [See More]
- Industry: OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Air Setting / Film Drying; Single Component
from Epoxies Etc...
20-3005 is a two component chemical resistance epoxy system. It was developed for potting, coating, and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates and will cure at low temperatures. 20-3005 has a convenient 2:1 volumetric... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Hi-Tech Seals, Inc.
Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Elastomeric; Silicone
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
Krylex KB014 is a low viscosity, surface insensitive cyanoacrylate instant adhesive. It provides excellent adhesion to plastics, metals and elastomers as well as acidic surfaces such as wood, leather and paper. Krylex KB014 provides high strength bonds within seconds and achieves full cure within 24... [See More]
- Industry: Automotive; Electronics; Construction; OEM or Industrial
- Cure / Technology: Two Component (optional feature); Single Component; Reactive or Moisture Cured (optional feature)
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ 30NF Contact Adhesive is a water-dispersed high strength contact adhesive. High immediate bond strength and long bonding range. It is non-flammable in the wet state, post-formable and heat resistant. It bonds most foamed plastics, plastic laminate, wood, plywood, wood... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Industry: OEM or Industrial
- Features: Thermally Conductive
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Cattie Adhesive Solutions
PADDING Hot Melts and Low Temperature Hot Melts for Brackett Padding Machines. Cattie Adhesive Solutions offers a Full line of high quality PADDING Hot Melts, Low Temperature Hot Melts and Water-Based Adhesives for your PADDING applications. For more Info, Pricing and Samples, please call one of our... [See More]
- Industry: OEM or Industrial
- Type / Form: Pellets (optional feature)
- Cure / Technology: Thermoplastic / Hot Melt
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Industry: Aerospace; Marine; OEM or Industrial; Sporting Goods
- Cure / Technology: Cure Temperature: 250 - 320 F
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from Berry Plastics Corporation - Engineered Materials Division
Polyken 1027. LIQUID ADHESIVE/PRIMER. Polyken 1027 liquid adhesive system is ideal for slower machine application to rough, reconditioned, or grit-blasted pipe surfaces. It provides a uniformly smooth, instant tack surface for Polyken coating systems. Applications. Solvent based primer designed for... [See More]
- Industry: OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Air Setting / Film Drying; Single Component
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Industry: Electronics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from Hi-Tech Seals, Inc.
The Nuts N ’ Bolts is an anaerobic adhesive, used in nut and bolt assemblies. When the adhesive is confined between substrates, the oxygen is eliminated and the adhesive cures. These thread locking adhesives offer a wide-range of strengths, viscosities, and temperature ranges for just about... [See More]
- Industry: Automotive; OEM or Industrial
- Cure / Technology: Anaerobic; Single Component
- Chemical System: Acrylic
- Type / Form: Liquid
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Features: Electrically Conductive; Sealant
from Chemence Inc.
KG105 is a single component, thixotropic, low-medium strength, high temperature anaerobic gasket compound. KG105 cures rapidly when confined in the absence of air on close-fitting metal surfaces. KG105 will give an almost instant low-pressure seal (up to 0.5 Bar after 20 mins.) to allow on-line... [See More]
- Industry: Automotive; Construction; OEM or Industrial
- Cure / Technology: Anaerobic; Two Component (optional feature); Single Component
- Chemical System: Dimethacrylate
- Features: Sealant
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ Foam Adhesive 100NF Neutral is a water dispersed neoprene contact adhesive. Bonds many porous substrates to porous or non-porous substrates with minimal dry time. It is fast tacking to hold seams and curves within 15 seconds and foam-tearing strength after completely set. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Industry: OEM or Industrial
- Features: Thermally Conductive
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Cattie Adhesive Solutions
Permanent Hot melt adhesives are 100% solids formulations based on thermoplastic polymers. They are solid at room temperature and are activated upon heating above their softening point, at which stage they are liquid, and can be applied. After application, they retain the ability to wet-out the... [See More]
- Industry: OEM or Industrial; Case/Carbon Sealing, Coated Boards
- Type / Form: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
- Substrate Compatibility: Plastic; Wood
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most. 600 Series products are offered in 2 speeds: a standard 20-25 minute working... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Berry Plastics Corporation - Engineered Materials Division
Nashua Tapes Products 357 Spray Adhesive. SPRAY ADHESIVE - TEMPORARY & PERMANENT BONDING. Designed for temporary and permanent bonding (20 fluid oz can). Low VOC for compliance with state regulations. Meets FDA requirements for indirect food packaging when used in accordance with 21 CFR 175.105. [See More]
- Industry: OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Air Setting / Film Drying; Single Component
from Epoxies Etc...
40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety of... [See More]
- Industry: Electronics; OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
The Quantum ® group of HERNON ® cyanoacrylates offers specialized performance attributes. This range of grades has been engineered to provide solutions to specific cyanoacrylate challenges. Three categories are offered: surface insensitive, toughened, and low odor-low blooming. [See More]
- Industry: OEM or Industrial
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon ™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists weathering,... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Silicone
- Substrate Compatibility: Plastic
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
High strength, fast contact-type adhesive. Fast contact strength buildup for many decorative laminates. Only needs one minute of drying time. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Industry: OEM or Industrial
- Features: Thermally Conductive
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Cattie Adhesive Solutions
Pressure Sensitive Hot Melts (PSA) are unique because they do not solidify to form a solid material, they remain permanently tacky and have the ability to wet-out substrates on contact. Bonds are formed by bringing the PSA adhesive in contact with the substrate and applying pressure. When inadequate... [See More]
- Industry: OEM or Industrial; Packaging, Label, POP, Mattress/Bedding
- Cure / Technology: Thermoplastic / Hot Melt; Contact or Pressure Sensitive Adhesives
- Chemical System: Acrylic
- Features: Solvent Based; Water Based
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Berry Plastics Corporation - Engineered Materials Division
Polyken 44SA. SPRAY ADHESIVE - TEMPORARY & PERMANENT BONDING. Fast skin, high tack, low soak in rate adhesive designed for temporary and permanent bonding. Meets FDA requirements for indirect food packaging when used in accordance with 21 CFR 175.105. Applications. Bonds foils and metals to... [See More]
- Industry: OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Air Setting / Film Drying; Single Component
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Acrylic
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Industry: Electronics; Sanitary; OEM or Industrial; Printing, Medical use and General Industrial Assembly
- Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Option of one or two component
from 3M Aerospace and Aircraft Maintenance Division
Quick-tacking, fast strength buildup. Aerosol, for bonding hard to hold materials like polyethylene and polypropylene. SBR rubber, fabric and felt. This product can effectively bond many hard to hold materials such as polyethylene. It can bond rubber, fabric, felt, cardboard, cork, foil, and many... [See More]
- Industry: Aerospace; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Industry: OEM or Industrial
- Type / Form: Gel
- Chemical System: Silicone
- Features: Thermally Conductive
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Silicone
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
Self Locker thread locking adhesives are pre-applied products designed for production environments. This line features microscopic glass spheres that remain dry until activated by thread engagement. The shearing action of the engagement breaks the spheres releasing the contained anaerobic thread... [See More]
- Industry: Automotive; OEM or Industrial
- Features: Threadlocker or Retainer
- Chemical System: Acrylic
- Substrate Compatibility: Metal
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
Krylex KH102 is a one component reactive polyurethane hot melt. It is solid at room temperature. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KH102 will achieve high strength bonds and excellent environmental resistance. [See More]
- Industry: Construction; OEM or Industrial
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyurethane
- Type / Form: Pellets
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Repositionable Spray Adhesive 75 is an adhesive that provides tape-like bonds on many lightweight materials. It adheres in seconds, yet has an extra-long tack range that allows you to lift and reposition materials. Excellent for production line work where parts are held in place... [See More]
- Industry: Aerospace; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically conductive in x, y, z axes. Excellent electrical and... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from Hapco, Inc.
Solid Reaction Injection Molding. S-RIM ™ is a series of advanced casting resins that exhibit high physical properties and are extremely fast curing. Easy to mix with a 1:1 ratio by volume. Available in black or natural/tan. Available in 60 or 240 second gel time. 6260/61 can be de-molded in... [See More]
- Industry: OEM or Industrial; Tooling
- Cure / Technology: Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]
- Industry: OEM or Industrial
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Acrylic
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847 is a premium quality, reddish brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and rubbers,... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- CTE: 28
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847L is a lower viscosity premium quality, brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Viscosity: 22000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Features: Flexible; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes NASA outgassing... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Viscosity: 7500
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive specially designed for use in the assembly of high power and high temperature electronic devices. It is formulated with a more enhanced resin bleed control. LOCTITE ABLESTIK ICP 9000 is designed to provide high adhesion and low... [See More]
- Industry: OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Industry: Aerospace; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Industry: Electronics; OEM or Industrial
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- CTE: 34
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Low Density Composite Surfacing Films AF 325 is a thermosetting, laminated metal foil film that adheres to cold and release coated tools. Excellent for surfacing composites. Provides a smooth void-free surface. Co-cure compatible with most epoxy composites. Compatible... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Phenol Aldehyde Epoxy Resin
- Type / Form: Sheet or Film
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing (optional feature)
- Chemical System: Epoxy
- Features: Flame Retardant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
One-component, 100% Solids, Polyurethane Reactive Adhesive for Bonding Various Substrates. It can be used in the woodworking, laminating and plastic component assembly markets. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Single Component; Reactive or Moisture Cured
- Chemical System: Polyurethane
- Substrate Compatibility: Plastic
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Leveling Filling
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Primer EC-1593 is a sprayable primer for use with 3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30. This product is suggested for use where good aluminum and magnesium overlap shear strengths from -67 °F to 180 °F (-55 °C to... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Sheet or Film