Epoxy (EP) Industrial Adhesives
from Newport MKS
The NOA-1375S UV-curing adhesive is clear liquid adhesive that will cure when exposed long wavelength ultraviolet light. NOA-1375S is recommended for bonding for glass to glass. Adhesion is also good to cellulose acetate butyrate. It is cured by ultraviolet light between 315 to 395 nm. Full cure... [See More]
- Chemical System: Epoxy
- Cure / Technology: UV or Radiation Cured
from Ellsworth Adhesives
3M Automix EZ Sand Rigid Parts Repair 5885 is a two component epoxy that is used as a cosmetic filler or for bonding SMC/fiberglass reinforced or rigid plastics for repairs. 200 mL Duo-Pak. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from RS Components, Ltd.
RS PRO RS101 Adhesive [See More]
- Chemical System: Epoxy resin; Epoxy
- Industry: OEM or Industrial; Industrial
- Type / Form: Liquid
from Dexmet® Corporation, a part of PPG’s engineered materials division
Cuming Microwave currently offers a limited line of adhesives for bonding applications. The product line includes an epoxy and a silicone-based system. Pressure sensitive adhesives are available as options with our elastomeric and foam absorbers. For other adhesive recommendations, please contact... [See More]
- Chemical System: Epoxy; Silicone
- Cure / Technology: Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements. [See More]
- Chemical System: Gum; Epoxy
- Industry: Electronics
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Chemical System: Ceramic; Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from DigiKey
LOCTITE STYCAST 2850FT-FR BK GAL [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.23
from Beijing Grish Hitech Co., Ltd.
Fiber Adhesive is a kind of thermo-cured epoxy resin adhesive, which is environmentally friendly solvent-free, 100% solid content. It can work continuously in the environment of 200°C, and can also work in the environment of 300-400°C for a short time. Fiber binders are ideal for most common... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
3M Scotch-Weld 6102 Epoxy Adhesive Black is a one component, water, and impact resistant product. It is designed for bonding dissimilar materials, and electronic-grade plastics with controlled rheology for non-sag bonding. It features a fast, low temperature cure, and flexibility after cure. Ideal... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic
- Cure / Technology: Single Component
- Viscosity: 80000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from RS Components, Ltd.
RS PRO 3353 Adhesive [See More]
- Chemical System: 2-(2h-benzotriazol-2yl)-p-cresol, acetone, butanone, epoxy resin, toluene; Epoxy
- Industry: Bonding
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Chemical System: Ceramic; Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from DigiKey
Thermal Epoxy, 2 Part 140.5 grams [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 3
- Use Temperature: -76 to 248
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1751 is a two component, room temperature curing, structural adhesive that is used for bonding and repairing metals. It is aluminum filled and has excellent void filling abilities. 1 gal Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal
- Cure / Technology: Two Component
- Viscosity: 150000 to 400000
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Thermally Conductive
from RS Components, Ltd.
MG silver conductive epoxy 4H 8331S 15g [See More]
- Chemical System: Epoxy resin; Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Chemical System: Ceramic; Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 8.16 kg Container [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1838 Green is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, controlled flow, and environmental resistance. 1 qt Can Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 70000 to 1.00E6
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Chemical System: Ceramic; Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 18 lb Container [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1838L Clear is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, flowability, and environmental resistance. 1 qt Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 6000 to 15000
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 1 lb Container [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.22
- Use Temperature: -85 to ?
from Ellsworth Adhesives
3M Scotch-Weld 2214 Hi-Temp New Epoxy Gray is a one part, aluminum filled, deaerated adhesive. It is a paste consistency used for bonding metals and many high temperature plastics such as fiberglass reinforced plastic, polyester, and phenolics. 6 oz Cartridge. [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 0.2440
- Cure / Technology: Single Component
- Elongation: 1.0
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 3 lb Container [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.34
- Use Temperature: -4 to ?
from Ellsworth Adhesives
3M Scotch-Weld 2214 Non-Metallic Epoxy Adhesive Cream is a one component, non-metal filled version of Scotch-Weld adhesive 2214 regular. It is a paste consistency, used for bonding metals and high temperature plastics. 6 oz Cartridge. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic
- Cure / Technology: Single Component
- Thermal Conductivity: 0.1210
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Chemical System: Ceramic; Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 18 lb Container [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.34
- Use Temperature: -4 to ?
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 1.36 kg Container [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 3 lb Container [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy creates a... [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 3 lb Container [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 2.78
- Use Temperature: -67 to 311
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 gal... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Features: Sealant
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 20 lb Container [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 2.78
- Use Temperature: -67 to 311
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 pt... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Composition: Unfilled
- Type / Form: Liquid
from DigiKey
Thermal Epoxy, 2 Part (Order Catalyst Separately) 5 gal Container [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Industry: Electronics; Tooling
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive and... [See More]
- Chemical System: Epoxy
- Industry: Automotive; Electronics; Sanitary; Military; OEM or Industrial
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Two Component
- Features: High Dielectric; Thermally Conductive
from IBT Industrial Solutions
Since 1949, IBT Industrial Solutions has been a major supplier to manufacturers, offering reliable products and services in the broad industrial marketplace. We are dedicated to fully meeting your demands for industrial tools and products of the highest quality from the brands you know and trust,... [See More]
- Chemical System: Epoxy; Polyurethane
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 05883 blue two-part epoxy adhesive is compatible with frp and smc materials. Provides a 10 min working time. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Encapsulant, Potting Compound; Sealant
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMINB, Epoxy, Die attach LOCTITE ® ABLESTIK 84-1LMINB electrically conductive adhesive is designed for die attach applications. Electrically conductive. High purity die attach adhesive. Solvent-free [See More]
- Chemical System: Epoxy
- Viscosity: 60000
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically conductive in x, y, z axes. Excellent electrical and... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Thermoset
- Industry: OEM or Industrial
from ThreeBond International, Inc.
These ThreeBond adhesives use epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as polyepoxides, are reactive... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Rubber or Elastomer
- Cure / Technology: Single Component
- Industry: Automotive
from ACCRAbond, Inc.
CONAPOXY ® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200 °F, yet it exhibits good storage life at room temperature. Good... [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; Thermally Conductive
from Chemical Strategies, Inc.
Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from Total Plastics, Inc.
Grey. A two-part adhesive kit (2/3 full container of base, 1 full container of accelerator). 1 Quart. Bonds rubber, metal, wood, plastic and masonry. Available Sizes. 1 Quart [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Chemical System: Epoxy; Silicone
- Features: Electrically Conductive
- Cure / Technology: Heat curing
- Industry: Semiconductors, IC's
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Cure Temperature: 250 - 320 F
- Industry: Sanitary; OEM or Industrial; Sporting Goods
from Henkel Corporation - Electronics
HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils. [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Single Component
from ND Industries, Inc.
Vibra-Tite is one of the world ’s market leaders in anaerobics, cyanoacrylates, epoxies and ultraviolet technologies. Vibra-Tite is quickly becoming one of the most highly respected names in the adhesive industry. And, as a result of ND ’s low overhead expenses and in-house capabilities,... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Chemical System: Epoxy
- Features: Flexible; Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; OEM or Industrial
from Techsil Limited
ITW Devcon 1 minute epoxy is a super-fast general purpose thixotropic epoxy adhesive for applications requiring a fast fix! This clear, quick curing formula is excellent for bonding metals, fiberglass, and ceramics. It works at a lightning fast speed and is perfect for filling gaps, cracks and... [See More]
- Chemical System: Epoxy
- Type / Form: Gel
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Features: Encapsulant, Potting Compound
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 05885 blue two-part epoxy adhesive is compatible with frp and smc materials with a 4 hr cure time. Provides a 10 min working time. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Chemical System: Epoxy
- Features: Thermally Conductive
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Chemical System: Epoxy
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- CTE: 28
from ThreeBond International, Inc.
Our UV curable resins are materials that are polymerized and cured in a short time by the energy radiated from ultraviolet irradiation devices. We offer our UV curing adhesives in many variations to meet almost any industrial need. Curing is completed in several seconds through UV light irradiation. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Rubber or Elastomer
- Cure / Technology: UV or Radiation Cured
- Viscosity: 270000
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Option of one or two component
- Composition: Unfilled
- Type / Form: Liquid
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from Total Plastics, Inc.
Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shenzhen DeepMaterial Technologies Co., Ltd
Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Heat Curing
- Viscosity: 8700
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Cure Temperature: 250 - 320 F
- Industry: Aerospace; Marine; OEM or Industrial; Sporting Goods
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Gel
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling; Sealant
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Honeycomb Core
from Techsil Limited
Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve an extremely strong rigid bond with excellent thixotropic and void filling properties. The adhesive bond... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive; Sealant
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
from R. S. Hughes Company, Inc.
3M 08107 clear two-part epoxy adhesive is compatible with fiberglass, glass, metal, plastic and wood materials with a 60 min cure time. Provides a 3 min working time. Delivers great performance with a shear strength of 110 psi and peel strength of 2 piw. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications. [See More]
- Chemical System: Epoxy
- CTE: 30
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Chemical System: Epoxy
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- Viscosity: 22000
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive
- Cure / Technology: Anaerobic
- Substrate Compatibility: Rubber or Elastomer
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Type / Form: Liquid
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from Total Plastics, Inc.
A specifically formulated epoxy adhesive that will bond treated fluoropolymers to all common materials (wood, metal, glass, ceramics, etc.) One pint offers 80 square feet of coverage. Available Sizes. Container Size: pint [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant to various chemicals and solvents,... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Features: Electrically Conductive
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
from Techsil Limited
Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general purpose material which dries to a clear product to achieve an extremely strong rigid bond with excellent thixotropic... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08115 black two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3309 psi. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE ® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue)... [See More]
- Chemical System: Epoxy
- Industry: Optical
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 96000
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes NASA outgassing... [See More]
- Chemical System: Epoxy
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
- Viscosity: 7500
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Type / Form: Gel
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from Total Plastics, Inc.
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes. Kit (E502 Quart). Kit (E504 1/2 Gallon) [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Two Component
from Epoxies Etc...
UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]
- Chemical System: Epoxy
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
from Techsil Limited
Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. The bonds are permanent and non shrinking and can work down to -40C when cured. It has good dielectric strength... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08116 amber two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 to 120 min working time. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE ® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This material is the lower viscosity version of LOCTITE ABLESTIK 16-1 adhesive. [See More]
- Chemical System: Epoxy
- Viscosity: 17000
- Cure / Technology: Two Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]
- Chemical System: Epoxy
- Features: Flame Retardant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing (optional feature)
- Industry: OEM or Industrial
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Flame Retardant
from Techsil Limited
Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. This Devcon epoxy offers bonds which are permanent, non shrinking and will continue working all the way down to... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08217 clear two-part epoxy adhesive is compatible with glass, metal and plastic materials with a 60 min cure time. Provides a 3 min working time. Minimum to maximum operating temperatures are -20 F to +180 F. [See More]
- Chemical System: Epoxy
- Viscosity: 8000 to 15000
- Features: Leveling Filling
- Use Temperature: -20 to 180
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE ® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Two Component
- Viscosity: 6500
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
- Cure / Technology: Thermoset
- Industry: OEM or Industrial
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Flexible
from Techsil Limited
Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]
- Chemical System: Epoxy
- Features: Sealant
- Cure / Technology: Thermoset
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08227 white / black two-part epoxy adhesive with a 2 hr cure time. Provides a 4 min working time. Minimum to maximum operating temperatures are -20 F to +180 F. [See More]
- Chemical System: Epoxy
- Use Temperature: -20 to 180
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE ® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior electrical and... [See More]
- Chemical System: Epoxy
- Viscosity: 40000
- Cure / Technology: Two Component
- Use Temperature: 76 to 347
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; OEM or Industrial
from Techsil Limited
LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08274 black two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3309 psi. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly. LOCTITE ® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Use Temperature: 76 to 248
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Substrate Compatibility: Metal; Plastic
from Techsil Limited
LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08275 blue two-part epoxy adhesive is compatible with frp and smc materials. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 57C, Epoxy, Assembly. LOCTITE ® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive. Thermally conductive. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Use Temperature: 76 to 248
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 08307 amber two-part epoxy adhesive. Provides a 15 min working time. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 64C, Epoxy, Assembly. LOCTITE ® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive adhesives to corrode. Please refer... [See More]
- Chemical System: Epoxy
- Use Temperature: 67 to 266
- Cure / Technology: Two Component
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It protects against static... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Features: Electrically Conductive; Sealant
from R. S. Hughes Company, Inc.
3M 08641 black two-part epoxy adhesive with a 24 hr cure time. Provides a 5 min working time. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE ® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe. Electrically conductive. Low bleed. Low outgassing [See More]
- Chemical System: Epoxy
- Viscosity: 30000
- Cure / Technology: Single Component
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Metal; Honeycomb Core
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Features: Thermally Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from R. S. Hughes Company, Inc.
3M 58115 epoxy adhesive is compatible with aluminum, frp, smc and steel materials. [See More]
- Chemical System: Epoxy
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE ® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of ABLEBOND 958 adhesive series. Electrically conductive. Good adhesion to gold [See More]
- Chemical System: Epoxy
- Viscosity: 90000
- Cure / Technology: Single Component
from Chemical Strategies, Inc.
Chemical Strategies offers all Krylon products. If you are unable to locate a paint or coating you need, our sales department can custom source any needed materials for you directly. [See More]
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Thermoset; Single Component
- Features: Sealant
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Industry: Electronics