Optical Grade / Material Industrial Adhesives

42 Results
ALPHA ® HiTech ® AD13-9692B
from MacDermid Alpha Electronics Solutions

A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview. A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other... [See More]

  • Industry: Electronics; Optical; Semiconductors, IC's
  • Features: Thermally Conductive
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal; Plastic; Compatible with substrates like stainless steel, polyimide, and LCP
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; Single Component; LED Cure
  • Composition: Filled
  • Type / Form: Liquid
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE
from Master Bond, Inc.

Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC
from Master Bond, Inc.

For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexible epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance characteristics of... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy; Polyurethane
  • Type / Form: Liquid
Flexible, Thixotropic, One Component Dual Cure Epoxy -- UV23FLDC-80TK
from Master Bond, Inc.

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]

  • Industry: Aerospace; Automotive; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: UV curing; Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Flowable Silicone Offers Thermal Cycling and Shock Resistance -- MasterSil 323
from Master Bond, Inc.

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: UV curable
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermally Stable Electrically Insulating Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL
from Master Bond, Inc.

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity -- Supreme 121AO
from Master Bond, Inc.

Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE
from Master Bond, Inc.

Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
3000/3100 Series UV Curable Resins and Adhesives -- TB3017D
from ThreeBond International, Inc.

Our UV curable resins are materials that are polymerized and cured in a short time by the energy radiated from ultraviolet irradiation devices. We offer our UV curing adhesives in many variations to meet almost any industrial need. Curing is completed in several seconds through UV light irradiation. [See More]

  • Industry: Optical
  • Substrate Compatibility: Rubber or Elastomer
  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 13000
Optically Transparent Epoxy -- 20-3302
from Epoxies Etc...

20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This... [See More]

  • Industry: Electronics; Optical
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
UV Structural Adhesive -- ELC 4481
from Electro-Lite Corporation

ELC-4481 optically transparent acrylic with a refractive index of 1.48 is an excellent material for use in fiber optics, lenses tacking and laser applications. Available in 300cps -- 5000cps -- 20,000cps [See More]

  • Industry: Optical; Photonics; OEM or Industrial; Fiber Optics
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Polyurethane; Acrylic
  • Type / Form: Liquid
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Industry: Sanitary; Optical; Photonics
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type / Form: Liquid
Die Attach Adhesives -- LOCTITE ECCOBOND LUX AA50T
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE ® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue)... [See More]

  • Industry: Optical
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Viscosity: 96000
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Chemical System: Elastomeric; Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Silver Filled Epoxy Resin -- 40-3900
from Epoxies Etc...

40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature... [See More]

  • Industry: Electronics; Optical; Photonics
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 27
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]

  • Industry: Optical
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type / Form: Liquid
Electrically Non-Conductive Adhesives -- LOCTITE DSP 3803
from Henkel Corporation - Industrial

LOCTITE DSP 3803, Acrylic, Display material, Optical lamination, Single Component, UV Curable Adhesive LOCTITE ® DSP 3803 is a single component UV curable adhesive, specifically designed for PSA lamination process. LOCTITE DSP 3803 is a medium viscosity yet high performance adhesive. It cures... [See More]

  • Industry: Optical
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Type / Form: Liquid
Electrically Non-Conductive Adhesives -- LOCTITE ECCOBOND F 113
from Henkel Corporation - Industrial

LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE ® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays and other optical components. LOCTITE ECCOBOND F 113 bonds offer resistance to... [See More]

  • Industry: Optical
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Chemical System: Epoxy
  • Viscosity: 180
Electrically Non-Conductive Adhesives -- LOCTITE ECCOBOND F 120
from Henkel Corporation - Industrial

LOCTITE ECCOBOND F 120, Epoxy, Assembly LOCTITE ® ECCOBOND F 120 adhesive is designed for high performance fiber optic and optical bonding applications. This adhesive provides outstanding chemical resistance to a variety of ambient gases, solvents and solutions. LOCTITE ECCOBOND F 120 is... [See More]

  • Industry: Optical
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Use Temperature: 76 to 239
Electrically Non-Conductive Adhesives -- LOCTITE ECCOBOND LS 3106P
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LS 3106P, Acrylate, Lid attach, Sealant LOCTITE ® ECCOBOND LS 3106P is specifically designed for bonding optical components requiring excellent water proof sealing. One component. UV curable. Low viscosity and thixotropic index to provide excellent self-sealing. Low weight loss. [See More]

  • Industry: Optical
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: Sealant
Electrically Non-Conductive Adhesives -- LOCTITE STYCAST OS 8300
from Henkel Corporation - Industrial

LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy. LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic, and optoelectronic devices. High spectral transmission  . Excellent adhesion  . [See More]

  • Industry: Optical
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
LOCTITE DSP 3193HS
from Henkel Corporation - Industrial

Optical bonding UV curing acrylic for Displays. Part of Henkel's Liquid Optically Clear Adhesives (LOCAs) line of products. [See More]

  • Industry: Optical
Potting Compounds -- LOCTITE STYCAST ES 1904
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE ® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part adhesive... [See More]

  • Industry: Optical
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Leveling Filling
Structural Adhesives -- LOCTITE EA E-30CL A&B
from Henkel Corporation - Industrial

2-part, low viscosity, industrial grade epoxy adhesive. It cures at room temperature with minor shrinkage to form an ultra clear adhesive bondline. LOCTITE ®EA E-30CL is a clear, colorless to slightly yellowish, 2-part, low viscosity, industrial grade epoxy adhesive. It cures at room... [See More]

  • Industry: Optical
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
UV Light Cure Adhesives -- LOCTITE 3D 3840
from Henkel Corporation - Industrial

Acrylic liquid resin used for prototyping which cures with very short exposure to monochromatic light sources. LOCTITE ® 3D 3840 is a clear, white, gray or black, UV light, low viscosity, room temperature-cure, acrylic compound used for prototyping via stereolithography. It requires very short... [See More]

  • Industry: Optical
UV Light Cure Adhesives -- LOCTITE AA 3301
from Henkel Corporation - Industrial

colorless, transparent, instant light-cure universal acrylic-based adhesive. For stress-sensitive plastics with high, on-demand, curing speed. LOCTITE ® AA 3301 is a transparent, colorless, light-cured, universal, acrylic-based instant adhesive, suitable for metals and stress-sensitive plastics... [See More]

  • Industry: Optical
  • Viscosity: ? to 150
  • Chemical System: Acrylic
  • Use Temperature: 65 to 300
UV Light Cure Adhesives -- LOCTITE EA 3355
from Henkel Corporation - Industrial

Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE ® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy adhesive liquid designed for bonding optical connectors,... [See More]

  • Industry: Optical
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
UV Light Cure Adhesives -- LOCTITE ECCOBOND LUX A4083T
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LUX A4083T , Acrylate, Assembly, Photocurable Adhesive LOCTITE ® ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices. In addition to light cure, this adhesive contains a secondary... [See More]

  • Industry: Optical
  • Substrate Compatibility: Ceramic, Glass
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 300