Tooling / Mold Material Industrial Adhesives
Last Updated: April 1, 2025
Description
Tooling and mold material industrial adhesives are specialized bonding agents designed to create strong and durable bonds between various materials used in the manufacturing of molds and tooling components. These adhesives are formulated to provide high strength and resistance to environmental factors, ensuring the longevity and reliability of the bonded materials.
Working Principle
Tooling and mold material industrial adhesives work by forming a chemical bond between the surfaces of the materials being joined. This bond is achieved through the curing process, where the adhesive undergoes a chemical reaction, often involving the hardening of a resin component. The resulting bond distributes stress evenly across the bonded area, reducing the risk of material failure and providing a clean, aesthetically pleasing finish without visible fasteners or welds .
Applications
These adhesives are commonly used in industries such as aerospace, automotive, and electronics, where they are employed to bond metals, composites, and plastics. For example, epoxy adhesives are frequently used in the aerospace industry for bonding composite materials in aircraft components due to their high strength and chemical resistance .
Advantages over other Industrial Adhesives
Epoxy adhesives, a common type used in tooling and mold applications, offer several advantages over other industrial adhesives. They are known for their high bonding strength and durability, making them suitable for demanding applications. Additionally, they provide excellent resistance to chemicals and temperature extremes, which is crucial in environments where molds and tooling are exposed to harsh conditions .
Limitations
One limitation of tooling and mold material industrial adhesives is the need for precise mixing and application to achieve optimal performance. Incorrect ratios or application methods can lead to weak bonds or incomplete curing. Additionally, some adhesives may require specific environmental conditions, such as temperature and humidity control, during the curing process to ensure proper bonding .
Considerations
When selecting tooling and mold material industrial adhesives, several factors should be considered. Initial costs can vary depending on the type of adhesive and its formulation. Operating expenses may include the need for specialized equipment or controlled environments for application and curing. Durability and accuracy are critical, as the adhesive must maintain its bond under operational stresses. Replacement and maintenance costs should also be considered, as some adhesives may require periodic inspection and reapplication to ensure continued performance .
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DME Company
ANAEROBICS Boltlocker. Anaerobic Threadlockers are single component liquids which chemically cure & harden in the absence of air. Locks & seals metal threaded assemblies in a wide range of applications. Provides a positive seal that resists most fluids. Prevents nuts, bolts and other... [See More]
- Industry: Tooling
- Type / Form: Liquid
- Cure / Technology: Anaerobic
- Features: Threadlocker or Retainer
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Industry: Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Industry: Electronics; Tooling
- Type / Form: Liquid
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Textiles or Fabrics; Dissimilar Substrates
from GS Polymers, Inc.
Two part, excellent impact resistance, heat cure [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Thermoset; Two Component
from DME Company
RTV Silicone Adhesive Sealant. Bonds Most Plastics Many Assembly Uses. Cures at Room Temperature To A Tough Flexible Rubber. Resists Shrinkage. Perfect For Caulking, Sealing, Waterproofing & Bonding. Bonds & Seals Terminals, Connectors, Mounting Fixtures, Mechanical Gaskets, Glass, Metal,... [See More]
- Industry: Tooling
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Features: Sealant
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from DME Company
Superglue. Instantly bonds glass, metals, plastics, & rubber. Bonds close-fitting parts in seconds. Works on clean surfaces of aluminum, copper, brass, steel, vinyl, PVC, polyester, nylon, fiberglass & wood. #49403 Super Glue. Instant Bond. 3 gram bottle. Ethyl grade. Bonds close fitting... [See More]
- Industry: Tooling
- Cure / Technology: Air Setting / Film Drying
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most. 600 Series products are offered in 2 speeds: a standard 20-25 minute working... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Silicone
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hapco, Inc.
Solid Reaction Injection Molding. S-RIM ™ is a series of advanced casting resins that exhibit high physical properties and are extremely fast curing. Easy to mix with a 1:1 ratio by volume. Available in black or natural/tan. Available in 60 or 240 second gel time. 6260/61 can be de-molded in... [See More]
- Industry: OEM or Industrial; Tooling
- Cure / Technology: Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Hapco, Inc.
Elastomeric Series. Various hardness elastomers, shore 20A - 72D. Clear in color. Available in 2 speeds - fast and slow. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series... [See More]
- Industry: Sanitary; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component
from Hapco, Inc.
Rigid Series. Rigid, tough polymer alloy plastics. High heat distortion. High physical properties. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series exhibit unique... [See More]
- Industry: Sanitary; Tooling
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Two Component