Dissimilar Substrates Industrial Adhesives
Last Updated: April 1, 2025
Description
Dissimilar substrates industrial adhesives are specialized bonding agents designed to join materials that have different physical or chemical properties. These adhesives are formulated to address the unique challenges posed by bonding materials with varying surface energies, thermal expansion coefficients, and substrate topographies.
Working Principle
The working principle of dissimilar substrates industrial adhesives involves creating a strong bond between materials that typically do not adhere well to each other due to their differing properties. These adhesives often incorporate advanced chemistries, such as urethanes or acrylics, which can bond both high-surface-energy substrates like metals and low-surface-energy substrates like plastics. By accommodating the differential expansion and contraction of materials during temperature fluctuations, these adhesives help maintain the integrity of the bond line, preventing stress and potential failure .
Applications
Dissimilar substrates industrial adhesives are used in a variety of applications where traditional mechanical fasteners may not be suitable. For example, they are employed in the automotive industry to bond ABS plastic to aluminum, where the differing thermal expansion rates of the materials can be a challenge . In electronics, these adhesives are used to bond rubber to steel, overcoming the challenge of bonding materials with vastly different surface energies . Additionally, they are used in the construction of composite materials, where bonding foam to wood requires adhesives that can accommodate uneven substrate topographies .
Advantages over other Industrial Adhesives
One of the primary advantages of dissimilar substrates industrial adhesives is their versatility in bonding a wide range of materials, including those with low surface energy like polypropylene and polyethylene . Unlike traditional adhesives that may require extensive surface preparation, some dissimilar substrates adhesives, such as urethanes, can bond effectively without it, saving time and reducing costs . They also offer excellent impact and vibration resistance, making them suitable for demanding applications .
Limitations
Despite their advantages, dissimilar substrates industrial adhesives have limitations. For instance, bonding materials with significantly different thermal expansion coefficients can still pose challenges, as differential expansion and contraction can lead to stress at the bond line . Additionally, achieving strong adhesion on substrates with low surface energy may require specialized adhesives or surface treatments, which can increase complexity and cost .
Considerations
When selecting dissimilar substrates industrial adhesives, several factors should be considered. Initial costs can vary depending on the specific adhesive formulation and any required surface treatments. Operating expenses may include the cost of surface preparation and application equipment. Durability is generally high, but the longevity of the bond can be affected by environmental factors such as temperature fluctuations and exposure to chemicals. Accuracy in application is crucial to ensure a strong bond, and replacement and maintenance costs should be factored into the overall cost analysis, especially in applications where bond failure could lead to significant downtime or damage.
from Dymax
Dymax Multi-Cure ® 6-621 adhesive is designed for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other substrate materials. The material is specially formulated to cure with heat in applications where shadow areas exist. This product is curable with... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: coil winding, potting, as well as metal-to-glass bonding.
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; EP; PA; Phenolic Plastic; Ceramic; AL; CU; Glass; CRS; Stainless Steel
- Viscosity: 800
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Composition: Unfilled
- Type / Form: Liquid
from Dymax
Dymax Multi-Cure ® 6-630-T structural bonding adhesive cures in seconds for fast assembly of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other substrates. The product demonstrates excellent flexibility and is high-temperature and moisture-resistant. The material cures... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: automotive latch assembly, potting, and bonding glass fixtures and furniture.
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; PEEK; PEI; PSU; PVC; AL; Stainless Steel; Glass
- Viscosity: 6000
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Dymax
Designed for optical bonding applications found in consumer wearables, low-stress 9204-W features very low modulus and low shifting after reliability testing. This optical bonding adhesive is suitable for sealing and packaging due to its high elongation that provides a buffer layer to absorb impact... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Rubber or Elastomer; Dissimilar Substrates; LCP; PC; PS, silicon
- Type / Form: Liquid
- Industry: Designed for optical bonding applications
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Dymax
Dymax 9310 cures upon exposure to light and is designed for rapid ruggedization of circuit board components. This adhesive is specially formulated to cure with heat in applications where shadowed areas exist. Ideal applications for this material include reinforcement of fine-pitch or leadless... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; PVC; SAN; glass
- Type / Form: Gel
- Industry: reinforcement of fine-pitch or leadless components on printed circuit boards, shock absorption, and underfill alternative
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Thermally Conductive
from Dymax
Dymax 9501-F is a UV/Visible light-curing adhesive optimized for LED curing at 385nm designed for electric vehicle battery potting and bonding. This material provides a highly reliable bond for cylindrical cells to the base of the battery pack. This colorless adhesive has no solvents added and will... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: battery assemblies and structural applications
- Substrate Compatibility: Dissimilar Substrates; ABS, CAP, FR-4, GL, PC/ABS Blend, PCTG, PETG, PS, PVC, SAN, AL, Ni Plating
- Viscosity: 10000
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Dymax
Dymax 9505-TC cures upon exposure to UV light and is 405 nm LED curable. 9505-TC thermal interface material is designed for rapid mounting of heat-sensitive components on printed circuit boards. Dymax materials contain no nonreactive solvents. Their ability to cure in seconds enables faster... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 100000
- Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; Aluminum; Glass; PA; SAN; SS
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
from Dymax
Dymax 9801 is an LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle-resistant and meets the stringent low-shrinkage requirements introduced for active alignment... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Dissimilar Substrates; CAP; PS; FR-4; Glass
- Type / Form: Gel
- Industry: for bonding camera modules, lidar, active alignment applications
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Dymax
Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
- Type / Form: Gel
- Industry: used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications.
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Type / Form: Liquid
from Dymax
Dymax 9906-AA is a heat and/or LED light-curable epoxy adhesive designed specifically for use in Asia. This active alignment adhesive meets NASA ASTM E595 low-outgassing specifications making it ideal for critical optical components, camera modules, LiDAR (Light Detection and Ranging, and other ADAS... [See More]
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; ABS; CAP; FR-4 Board; LCP; PC; PET; PPS; PS; Stainless Steel; Aluminum; Glass; Magnesium
- Type / Form: Gel
- Industry: lens bonding, bonding the lens barrel to holder, or bonding the holder to printed circuit boards (PCBs).
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
from Dymax
Dymax Low-Shrink ™ OP-81-LS is a UV/Visible light-curable optical adhesive epoxy with very low shrinkage during cure and is ideal for rapid positioning of optical components. OP-81-LS cures with UV light and includes a low-temperature heat-curing function in applications where shadow areas... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; CAP; PS; FR-4; PA; PC; PETG; PMMA; SAN; Glass, Aluminum, Stainless Steel
- Type / Form: Gel
- Viscosity: 60000
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Powder
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Features: Non-corrosive; Sealant
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Type / Form: Liquid
from FSI
OnePart is FSI ’s moisture-cure adhesive with time-tested results in a wide variety of commercial and industrial applications, including entry and garage doors, recreational vehicle components, building and construction products (like SIPs, structural insulated panels) and more. It ’s... [See More]
- Chemical System: Polyurethane
- Features: Laminaes; Thermal Insulation
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Substrate Compatibility: Plastic; Wood; Dissimilar Substrates
from Techsil Limited
Techsil ® PS-6675 is a pressure sensitive adhesive which has excellent adhesion to a wide range of substrates and excellent tack over a wide range of temperatures. Its medium viscosity allows excellent spray properties and clean coating characteristics. PS 6775 is suitable for use as a... [See More]
- Chemical System: Gum
- Type / Form: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Contact or Pressure Sensitive Adhesives
- Substrate Compatibility: Paper or Paperboard; Dissimilar Substrates
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Textiles or Fabrics; Dissimilar Substrates
- Features: High Dielectric; Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Wacker Chemical Corp.
ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]
- Chemical System: Elastomeric; Silicone
- Features: Flame Retardant (optional feature); Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Condensation Cured
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
from Acoustiblok, Inc.
FCA10 Fast Cure Industrial Adhesive is not a contact cement - It is waterproof and will bond Acoustiblok ® to itself, wood, metal, and most other surfaces. Acoustiblok must be held in place while curing. Very fast cure time, varying with temperature and humidity. Due to the unique properties of... [See More]
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Composites; Metal; Wood; Dissimilar Substrates; Acoustiblok
- Type / Form: Gel
- Industry: Construction; Soundproofing
from DME Company
ANAEROBICS Boltlocker. Anaerobic Threadlockers are single component liquids which chemically cure & harden in the absence of air. Locks & seals metal threaded assemblies in a wide range of applications. Provides a positive seal that resists most fluids. Prevents nuts, bolts and other... [See More]
- Cure / Technology: Anaerobic
- Features: Threadlocker or Retainer
- Type / Form: Liquid
- Substrate Compatibility: Plastic; Dissimilar Substrates
from Acoustical Solutions, Inc.
Acoustical wall fabric adhesive is a heavy duty clay based adhesive. This is an ideal adhesive for use with our CrossPoint Acoustical Wall Fabric. The adhesive is sold in five gallon buckets, which will cover 750 square feet. The adhesive can be rolled, painted or trowelled onto surfaces. [See More]
- Chemical System: Clay Based
- Features: Flexible
- Cure / Technology: Single Component
- Substrate Compatibility: Paper or Paperboard; Textiles or Fabrics; Dissimilar Substrates
from Phelps Industrial Products
Phelps Style 9750 is a Contact Cement that provides a long bonding range and excellent initial strength. Ideal for plastic laminates, paper honeycomb, rubber, cloth, metal and wood. Meets requirements of Mil-A-1154C, Mil-A-21366 and MMM-A-121. Ensure both surfaces are clean and dry. Apply coating to... [See More]
- Cure / Technology: Air Setting / Film Drying
- Features: Laminaes; Sealant; Solvent Based
- Type / Form: Liquid
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates; Paper
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
- Composition: Unfilled
- Features: High Dielectric; Flame Retardant; Thermally Conductive
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
Quick-tacking, fast strength buildup. Aerosol, for bonding hard to hold materials like polyethylene and polypropylene. SBR rubber, fabric and felt. This product can effectively bond many hard to hold materials such as polyethylene. It can bond rubber, fabric, felt, cardboard, cork, foil, and many... [See More]
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Industry: Electronics; Tooling
from DME Company
RTV Silicone Adhesive Sealant. Bonds Most Plastics Many Assembly Uses. Cures at Room Temperature To A Tough Flexible Rubber. Resists Shrinkage. Perfect For Caulking, Sealing, Waterproofing & Bonding. Bonds & Seals Terminals, Connectors, Mounting Fixtures, Mechanical Gaskets, Glass, Metal,... [See More]
- Chemical System: Silicone
- Features: Sealant
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Plastic; Dissimilar Substrates
from Acoustical Solutions, Inc.
Green Glue is a liquid, waterborne, viscoelastic damping compound which represents the highest performance product of its type. It is used in between sheets of drywall, subflooring or other building materials. It is significantly lower in applied cost than competitive products, with an excellent... [See More]
- Chemical System: Gum
- Type / Form: Liquid
- Cure / Technology: Single Component
- Features: Flexible
from Phelps Industrial Products
Pheps Style 9740 is an RP 1000 Adhesive. This Cyanoacrylate adhesive needs only drops to develop a very strong bond between metals, ceramics, plastics and rubber. Water does not affect this adhesive's bond. Care should be taken to ensure surfaces are clean, and dry; use solvent if necessary. Apply... [See More]
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying
- Features: Solvent Based
from Epoxies Etc...
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]
- Chemical System: Elastomeric; Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Plastic Adhesive 1099L is a low viscosity fast drying and heat curable Nitrile adhesive. Tan can bond most vinyls (supported and unsupported) wood, metal, rubber to fiberglass, painted, primed or bare steel, and molded plastics. This product... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
- Features: Solvent Based
from DME Company
Superglue. Instantly bonds glass, metals, plastics, & rubber. Bonds close-fitting parts in seconds. Works on clean surfaces of aluminum, copper, brass, steel, vinyl, PVC, polyester, nylon, fiberglass & wood. #49403 Super Glue. Instant Bond. 3 gram bottle. Ethyl grade. Bonds close fitting... [See More]
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
from Acoustical Solutions, Inc.
AlphaPanel ™ Adhesive is a non-toxic water based adhesive that makes installation quick and easy by providing a strong permanent bond when apply foam panels to walls or ceilings. It offers easy clean up and is compatible with all polyurethane and melamine foam products. The tubes are 10.1... [See More]
- Chemical System: Elastomeric; Latex Based
- Features: Flexible; Water Based
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Paper or Paperboard; Plastic; Porous Surfaces; Dissimilar Substrates; Acoustical Foam Products
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Neoprene Contact Adhesive 10 Light Yellow is a is a brushable, light yellow colored contact adhesive. Air drying contact adhesive which bonds immediately and permanently upon application of contact pressure - no clamping or fixturing. It bonds many decorative and high... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Contact or Pressure Sensitive Adhesives; Single Component
- Features: Solvent Based
from Acoustical Solutions, Inc.
Sonex ™ panel adhesive has been specially formulated to use Sonex ™ acoustical panels. This non-toxic, water-based adhesive makes installation hassle-free and provides a strong, permanent bond when adhering Sonex ™ Panels to walls or ceilings. It is a non-toxic, water-based adhesive... [See More]
- Cure / Technology: Single Component
- Substrate Compatibility: Paper or Paperboard; Plastic; Porous Surfaces; Dissimilar Substrates; Acoustical Foam Products
- Features: Flexible
- Industry: Construction; Acoustical
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Neoprene Rubber And Gasket Adhesive 2141 is a light yellow, high strength, solvent type synthetic rubber-based brushable adhesive. Used for bonding rubber and gasketing materials. It is also useful for bonding fabric and leather to metal, wood and many plastic... [See More]
- Chemical System: Elastomeric
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
from Acoustical Solutions, Inc.
Acoustical Solutions offers Sure Seal Heavy Duty Double Sided Tape to assist you with the installation of acoustical foam. [See More]
- Chemical System: Acrylic
- Type / Form: Sheet or Film
- Cure / Technology: Single Component
- Features: Flexible