Non-corrosive Cure Industrial Adhesives
from DigiKey
SI 5140 METHOXY 85 GR TB/BN [See More]
- Features: Encapsulant, Potting Compound; Non-corrosive
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DigiKey
5145 RTV SILICONE 3OZ TB/BN [See More]
- Features: Non-corrosive
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
SI 5140 METHOXY 300ML CQ/BN [See More]
- Features: Encapsulant, Potting Compound; Non-corrosive
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
SI5084 NUVA-SIL 300ML CQ/BN [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from DigiKey
SI 5145 RTV SILICONE 300ML CQ/BN [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from DigiKey
LOCTITE NC RTV SIL CL 80ML [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
LOCTITE NC RTV SIL CL 300ML [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
SELF-LEVELING SILICONE (CLEAR) 2 [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DigiKey
INDUSTRIAL GRADE SELF-LEVELING S [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
SELF-LEVELING SILICONE (CLEAR) 2 [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
ELECTRONICS GRADE SELF-LEVELING [See More]
- Features: Non-corrosive
- Chemical System: Silicone
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
HOT MELT ADHESIVE 1 = 1 STICK [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
3M 3748 SCOTCH-WELD HOT MELT 1LB [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Features: High Dielectric; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from DigiKey
HOT MELT ADHESIVE 1 = 22LB BOX [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Features: High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
"HOT MELT ADHESV 5/8""X8"" 1=1STICK" [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DigiKey
3M 3748 SCOTCH-WELD HOT MELT 1LB [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Features: Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
SCOTCHKOTE LIQUID EPOXY COAT [See More]
- Features: Non-corrosive
- Chemical System: Epoxy
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
"HOT MELT ADHESV 5/8""X8"" 1=1STICK" [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DigiKey
"HOT MELT ADHESIV 5/8X2"" 1=1STICK" [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
"HOT MELT ADHESV 5/8""X8"" 1=1STICK" [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
"HOT MELT ADHESV 5/8""X2"" 1=1STICK" [See More]
- Features: Non-corrosive
- Cure / Technology: Thermoplastic / Hot Melt
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
ELECTRONICS GRADE SILICONE ADHES [See More]
- Features: Non-corrosive
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Polyolefin
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from DigiKey
ELECTRONICS GRADE SILICONE ADHES [See More]
- Features: Non-corrosive
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ELECTRONICS GRADE SILICONE ADHES [See More]
- Features: Non-corrosive
from Master Bond, Inc.
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]
- Features: High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ELECTRONICS GRADE SILICONE ADHES [See More]
- Features: Non-corrosive
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Wacker Chemical Corp.
ELASTOSIL ® N2199 is a one-part, nonslumping paste that cures at room temperature to a permanently flexible silicone rubber on exposure to atmospheric moisture. Properties. ELASTOSIL ® N2199 is a ready-to-use, acid- and sovent-free, non-corrosive RTV-1 (room temperature vulcanizing,... [See More]
- Features: Non-corrosive; Sealant
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric; Silicone
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics
from Novagard Solutions
Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]
- Features: High Dielectric; Non-corrosive; Sealant; UL Rating
- Composition: Unfilled
- Chemical System: Elastomeric; Silicone
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing