Aerospace Industrial Adhesives
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
3M Scotch-Weld EC 2216 Epoxy Adhesive Gray is a two component, room temperature curing epoxy. It is certified for use in aircraft and aerospace application. It also features resistance to extreme shock, vibration, and flexing, and good retention of strength after environmental aging. 41.5 mL... [See More]
- Industry: Aerospace
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 75000 to 150000
from RS Components, Ltd.
Structutal acrylic adhesive DP8405 45ml [See More]
- Industry: Aerospace; Automotive; Electronics; Construction; OEM or Industrial; Aerospace, Automotive, Construction, Consumer Goods, Electronics, General Industrial, Metal, MRO, Signage, Specialty Vehicle
- Type / Form: Liquid
- Chemical System: Acrylic
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from MacDermid Alpha Electronics Solutions
Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue. Product Overview. A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed... [See More]
- Industry: Aerospace; Electronics; Sanitary; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Bostik L4145-30 Light Amber is a one component, solvent based adhesive based on nitrile rubber with a fast drying time and high viscosity. It requires no curative and its dried film provides tough elastic bonds. 1 gal Can. [See More]
- Industry: Aerospace
- Viscosity: 8000
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 730 FS Solvent Resistant Sealant White is a one component, non-slumping, fluorosilicone paste that is used for bonding, sealing, repairing, or assembling applications that are exposed to moisture, extreme temperatures, shock, oils, solvents, fuels, and swelling effects. It offers... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: Sealant
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 730 Solvent Resistant Sealant White is a one component, non-slumping, fluorosilicone paste that is used for bonding, sealing, repairing, or assembling applications that are exposed to moisture, extreme temperatures, shock, oils, solvents, fuels, and swelling effects. It offers... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: Sealant
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: Sealant
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: Sealant
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: Sealant
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Henkel Loctite Ablestik SF 40 Amber, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, syntactic foam, epoxy adhesive liquid that is used for hydrospace and aerospace applications. It bonds well to plastics, metal, and ceramics. It is lightweight, non-sagging, and... [See More]
- Industry: Aerospace
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 95
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Henkel Loctite EA E-120HP is a high-viscosity, non-sag aerospace grade epoxy adhesive. Once fully cured it offers superior thermal shock resistance, excellent mechanical and electrical properties, and is able to withstand exposure to a wide variety of solvents and chemicals. 200 mL Cartridge. [See More]
- Industry: Aerospace
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Metal
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
from Ellsworth Adhesives
Henkel Loctite EA E-120HP is a high-viscosity, non-sag aerospace grade epoxy adhesive. Once fully cured it offers superior thermal shock resistance, excellent mechanical and electrical properties, and is able to withstand exposure to a wide variety of solvents and chemicals. 50 mL Cartridge. [See More]
- Industry: Aerospace
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Metal
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Brake Bonder 362 is a black heat curing, nitrile/phenolic solvent-based adhesive. Cured Brake Bonder 362 furnishes excellent resistance to thermal shock, chemicals, and water. The cured bond withstands temperatures exceeding 600 °F (315 °C). The primary application for Brake Bonder 362 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 370 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 370 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Hernon ® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond ® 374. Fusionbond ® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Fusionbond ® 375 is a highly thixotropic, two component, room temperature curing, 1:1 ratio, methacrylate adhesive system. Fusionbond ® 375 is formulated to provide fixturing strength within 7 to 10 minutes. This adhesive product forms resilient bonds and maintains its strength over a wide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
- Chemical System: Vinyl; Acrylic
- Substrate Compatibility: Metal; Plastic; PVC, acrylic, ABS, stainless steel, and some types of fiberglass
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
HASA 39781 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 39781 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Hernon Manufacturing, Inc.
HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon ® Primer 50 accelerates the cure. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
HASA 716 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. This high strength acrylic adhesive cures when it is confined between mating surfaces. Utilized for bonding magnets in motor assemblies and structural applications, HASA 716... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Acrylic
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
HASA 718 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies. HASA 718 cures when it is confined between mating surfaces. Hernon? Activator 56 accelerates the cure. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
HASA 722 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 722 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Instantbond ® 109 is a low viscosity, state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 109... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Instantbond ® 110 is a state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 110 develops... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Instantbond ® 112 is a low viscosity, state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 112... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Instantbond ® 113 is a state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 113 develops... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
from Epoxy Technology
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]
- Industry: Aerospace; Sanitary; Optical; Photonics; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ® EA 9309NA AERO is a toughened adhesive ideal for bonding metal, wood, plastics and glass. Bonds are flexible and resist water, salt spray and most common fluids. Its outstanding feature is excellent peel strength to aluminum. Features: High Peel Strength. Bonds Many Surfaces. Room... [See More]
- Industry: Aerospace
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Industry: Aerospace; Military
- Cure / Technology: Cure Temperature: 250 - 320 F
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ Contact Adhesive 2000NF Blue is a water-dispersed, high solids, activated adhesive. Provides immediate bonding and handling strength bonds flexible polyurethane and latex foams, plastic laminate, wood, plywood, without forced drying equipment. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Two Component ; Contact or Pressure Sensitive Adhesives
- Chemical System: Elastomeric
- Type / Form: Liquid
from Sheldahl Flexible Technologies - a Flex company
We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials for audio and medical... [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
- Features: Flame Retardant; Laminaes; Thermal Insulation
from Wacker Chemical Corp.
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. ELASTOSIL ® 4100 cures at room temperature under the action of atmospheric moisture to give a permanently flexible silicone rubber. Special features. suitable for use in sanitary areas. [See More]
- Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric; Silicone
- Type / Form: Gel
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55 °C to 150 °C). A unique and popular feature of the 10-3785 is its ’ ability to cure at temperatures as low as 93 °C (200... [See More]
- Industry: Aerospace; Electronics; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Gel
from Henkel Corporation - Industrial
Loctite ® Klean 'N Prime ™ Anaerobic Activator is a solvent based primer that features very long on-part life. Use to speed the cure of all Loctite anaerobic products and ensure proper cure on inactive metals. Ideal for cure conditions below room temperature. Typical Applications: All nut... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Anaerobic
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Industry: Aerospace; Marine; OEM or Industrial; Sporting Goods
- Cure / Technology: Cure Temperature: 250 - 320 F
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ 30NF Contact Adhesive is a water-dispersed high strength contact adhesive. High immediate bond strength and long bonding range. It is non-flammable in the wet state, post-formable and heat resistant. It bonds most foamed plastics, plastic laminate, wood, plywood, wood... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Fastbond ™ Foam Adhesive 100NF Neutral is a water dispersed neoprene contact adhesive. Bonds many porous substrates to porous or non-porous substrates with minimal dry time. It is fast tacking to hold seams and curves within 15 seconds and foam-tearing strength after completely set. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Features: Electrically Conductive; Sealant
from 3M Aerospace and Aircraft Maintenance Division
High strength, fast contact-type adhesive. Fast contact strength buildup for many decorative laminates. Only needs one minute of drying time. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
Quick-tacking, fast strength buildup. Aerosol, for bonding hard to hold materials like polyethylene and polypropylene. SBR rubber, fabric and felt. This product can effectively bond many hard to hold materials such as polyethylene. It can bond rubber, fabric, felt, cardboard, cork, foil, and many... [See More]
- Industry: Aerospace; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Repositionable Spray Adhesive 75 is an adhesive that provides tape-like bonds on many lightweight materials. It adheres in seconds, yet has an extra-long tack range that allows you to lift and reposition materials. Excellent for production line work where parts are held in place... [See More]
- Industry: Aerospace; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Solvent Based
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847 is a premium quality, reddish brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and rubbers,... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847L is a lower viscosity premium quality, brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Features: Flexible; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Leveling Filling; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]
- Industry: Aerospace; OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Industry: Aerospace; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Industry: Aerospace; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Industry: Aerospace; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Neoprene High Performance Contact Adhesive 1357L Gray-Green, Is a lower viscosity, grey-green high performance contact adhesive that provides a long bonding range and initial strength. Gray-Green can be used to bond most rubber, cloth, metal, wood, foamed glass, paper... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Low Density Composite Surfacing Films AF 325 is a thermosetting, laminated metal foil film that adheres to cold and release coated tools. Excellent for surfacing composites. Provides a smooth void-free surface. Co-cure compatible with most epoxy composites. Compatible... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Phenol Aldehyde Epoxy Resin
- Type / Form: Sheet or Film
from 3M Aerospace and Aircraft Maintenance Division
One-component, 100% Solids, Polyurethane Reactive Adhesive for Bonding Various Substrates. It can be used in the woodworking, laminating and plastic component assembly markets. [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Single Component; Reactive or Moisture Cured
- Chemical System: Polyurethane
- Substrate Compatibility: Plastic
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Sheet or Film
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Primer EC-1593 is a sprayable primer for use with 3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30. This product is suggested for use where good aluminum and magnesium overlap shear strengths from -67 °F to 180 °F (-55 °C to... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Sheet or Film