Thermal / Heat Insulating Industrial Adhesives
Last Updated: April 1, 2025
Description
Thermal or heat insulating industrial adhesives are specialized materials designed to provide insulation against heat transfer. These adhesives are formulated to create a barrier that reduces the flow of heat between surfaces, thereby maintaining temperature stability within the bonded materials.
Working Principle
Thermal insulating adhesives work by incorporating materials that have low thermal conductivity, which helps in minimizing heat transfer. These adhesives often contain fillers or additives that enhance their insulating properties. By forming a continuous bond between surfaces, they effectively reduce the rate of heat flow, making them useful in applications where temperature control is critical. The adhesives are also engineered to withstand extreme temperatures and abrupt temperature shifts, providing both thermal and electrical insulation.
Applications
Thermal insulating adhesives are used in a variety of specific applications. For instance, they are ideal for projects that require both electrical and thermal insulation, such as in the assembly of electronic components where they bond PCBs and heat sinks. They are also used in sealing and gasketing applications to protect enclosures against moisture and temperature variations. Additionally, these adhesives are suitable for component mounting in electronics, providing flexible bonding for delicate parts.
Advantages over other Industrial Adhesives
One of the key advantages of thermal insulating adhesives over other types is their ability to withstand extreme temperatures and thermal cycling. Silicone adhesives, for example, offer high flexibility and temperature resistance, making them ideal for applications involving thermal management and bonding heat sinks. They also provide good electrical insulation and moisture resistance, which are critical in electronic applications.
Limitations
Despite their advantages, thermal insulating adhesives have limitations. They may not be suitable for applications requiring high mechanical strength or where the adhesive bond is subjected to significant physical stress. Additionally, the presence of insulating fillers can sometimes affect the adhesive's bonding strength and flexibility.
Considerations
When selecting thermal insulating adhesives, several factors should be considered. Initial costs can vary depending on the specific formulation and required properties. Operating expenses may include the need for specialized equipment or conditions to apply the adhesive effectively. Durability is a critical factor, as the adhesive must maintain its insulating properties over time and under varying environmental conditions. Replacement and maintenance costs should also be considered, especially in applications where the adhesive may need to be reapplied or replaced due to wear or environmental exposure.
from Master Bond, Inc.
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Sheldahl Flexible Technologies - a Flex company
We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials for audio and medical... [See More]
- Features: Flame Retardant; Laminaes; Thermal Insulation
- Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400EX Series. Aron Alpha 400EX Series is suitable for vibrating areas such as motors and bearings. Featured characteristics are heat resistance up to + 250 °F and impact resistance. The fast curing speed lends itself to high speed assembly processes where handling strength is... [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Features: Sealant; Thermally Conductive; Thermal Insulation
- Type / Form: Sheet or Film
from FSI
OnePart is FSI ’s moisture-cure adhesive with time-tested results in a wide variety of commercial and industrial applications, including entry and garage doors, recreational vehicle components, building and construction products (like SIPs, structural insulated panels) and more. It ’s... [See More]
- Features: Laminaes; Thermal Insulation
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Polyurethane
- Substrate Compatibility: Plastic; Wood; Dissimilar Substrates
from Epoxy Technology
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Thermal Insulation; UL Rating
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from GS Polymers, Inc.
Two part, 4:1 flowable, chemical & thermal resistance [See More]
- Features: Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400X Series. Aron Alpha 400X Series is engineered for high temperature and high impact resistance. Excellent bond strength in conditions up to 250 °F [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Features: Electrically Conductive; Thermal Insulation
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400X Series. Aron Alpha 400X Series is engineered for high temperature and high impact resistance. Excellent bond strength in conditions up to 250 °F [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Features: High Dielectric; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400X Series. Aron Alpha 400X Series is engineered for high temperature and high impact resistance. Excellent bond strength in conditions up to 250 °F [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400X Series. Aron Alpha 400X Series is engineered for high temperature and high impact resistance. Excellent bond strength in conditions up to 250 °F [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400T Series. Aron Alpha 400T Series is classified as a toughened cyanoacrylate technology. It is designed for applications requiring high heat resistance, high peeling resistance, high impact resistance and thermal shock resistance. Maybe be utilized in temperature ranging from – 40... [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400X Series. Aron Alpha 400X Series is engineered for high temperature and high impact resistance. Excellent bond strength in conditions up to 250 °F [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400EX Series. Aron Alpha 400EX Series is suitable for vibrating areas such as motors and bearings. Featured characteristics are heat resistance up to + 250 °F and impact resistance. The fast curing speed lends itself to high speed assembly processes where handling strength is... [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400T Series. Aron Alpha 400T Series is classified as a toughened cyanoacrylate technology. It is designed for applications requiring high heat resistance, high peeling resistance, high impact resistance and thermal shock resistance. Maybe be utilized in temperature ranging from – 40... [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
Aron Alpha 400T Series. Aron Alpha 400T Series is classified as a toughened cyanoacrylate technology. It is designed for applications requiring high heat resistance, high peeling resistance, high impact resistance and thermal shock resistance. Maybe be utilized in temperature ranging from – 40... [See More]
- Features: Thermal Insulation
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid