Electrically Insulating / Dielectric Industrial Adhesives
from MacDermid Alpha Electronics Solutions
A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages. Product Overview. STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and... [See More]
- Features: High Dielectric; Electrically Conductive
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Thermoset
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Features: High Dielectric; UL Rating
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow DOWSIL ™ ME-1070 Silicone Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength, flowability, low... [See More]
- Features: High Dielectric; Sealant
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 18000
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Parker Lord Sipiol ® UV is a one component, dielectric coating that is used on electrically-sensitive substrates. It provides electrical insulation, durability, and environmentally friendly benefits. 5 gal Pail. [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 5000 to 10000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Features: High Dielectric; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Features: High Dielectric; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Features: High Dielectric; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting... [See More]
- Features: High Dielectric
- Thermal Conductivity: 1
- Viscosity: 9830
- CTE: 28
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Industry: Electronics; Sanitary; Optical; Photonics
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Thermal Insulation; UL Rating
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HXC is DuPont ™ Kapton ® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux ® HXC coverlay is used to... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Polyimide
- Industry: Electronics; OEM or Industrial
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Features: High Dielectric; Sealant; Thermally Conductive; Threadlocker or Retainer
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Techsil Limited
Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]
- Features: High Dielectric; Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Features: High Dielectric
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; UL Rating
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyolefin
- Type / Form: Pellets
from Wacker Chemical Corp.
ELASTOSIL ® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features. Neutral cure. Solvent-free. Primerless adhesion to most substrates. Available in Black or Gray. Application. ELASTOSIL ® N198 BLACK US is intended for... [See More]
- Features: High Dielectric
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric; Silicone
- Industry: Electronics
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive. LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall... [See More]
- Features: High Dielectric
- CTE: 62
- Viscosity: 4100
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Features: High Dielectric
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Option of one or two component
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Features: High Dielectric; Electrically Conductive; Thermally Conductive
- Substrate Compatibility: Ceramic, Glass; Metal; Textiles or Fabrics; Dissimilar Substrates
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Techsil Limited
TSE3221S is a heat curable translucent silicone adhesive designed for sealing and coating applications. This grade adheres well to a variety of substrates such as metals, plastics, ceramic and glass without the use of a primer. Potential applications include sealing and coating for hybrid Ics,... [See More]
- Features: High Dielectric
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications. Low modulus. Black pigmentation for blocking light [See More]
- Features: High Dielectric
- Viscosity: 12254
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Features: High Dielectric
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Composition: Unfilled
- Chemical System: Elastomeric; Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE ® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates. Fast and low temperature cure. Sag resistant paste. Resilient. [See More]
- Features: High Dielectric
- Viscosity: 150000
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Features: High Dielectric; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 104, Epoxy, Assembly. LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230 ºC. It has also been tested to withstand short term exposures up to... [See More]
- Features: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach LOCTITE ® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging. Non-conductive. High reliability. Improved work life [See More]
- Features: High Dielectric
- Thermal Conductivity: 0.4000
- Viscosity: 11500
- CTE: 31
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed... [See More]
- Features: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE ® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants, gasoline, jet... [See More]
- Features: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]
- Features: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE ® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to... [See More]
- Features: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 20000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 9200
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE ® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand. Electrically Insulating. One component. Solvent-free formulation. Long work life. [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 50000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 247500
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE ® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive. Stress absorbing [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 45000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive. One component. Readily pourable. Fast cure. Good toughness. Excellent chemical resistance [See More]
- Features: High Dielectric; Sealant
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 21500
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive. LOCTITE ® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based product has unique properties including excellent worklife... [See More]
- Features: High Dielectric
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications. Low modulus. Black pigmentation for blocking light [See More]
- Features: High Dielectric
- Viscosity: 14500
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications. Electrically non-conductive. Low modulus. Low temperature cure [See More]
- Features: High Dielectric
- Viscosity: 12000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications. High thermal conductivity. High reflectivity. Excellent anti-yellowing properties [See More]
- Features: High Dielectric; Thermally Conductive
- Thermal Conductivity: 0.8000
- Viscosity: 21000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE ® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use... [See More]
- Features: High Dielectric
- Thermal Conductivity: 0.6000
- Viscosity: 10900
- CTE: 20
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE ® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE... [See More]
- Features: High Dielectric
- Thermal Conductivity: 0.3000
- Viscosity: 13500
- CTE: 30
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE ® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product is formulated to temporarily cure when exposed to UV light, followed with a secondary... [See More]
- Features: High Dielectric
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE ® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in applications, such as, bonding of light diffusing lenses over... [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 46100
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in applications, such as, bonding of light diffusing lenses over LEDs and... [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Type / Form: Liquid