Electrical Power / HV Industrial Adhesives
Last Updated: April 1, 2025
Description
Electrical Power / HV Industrial Adhesives are specialized substances designed to bond materials together by surface attachment. These adhesives are formulated to withstand high voltage environments, providing strong adhesion and electrical insulation properties. They are capable of maintaining their bonding strength under various environmental conditions, ensuring the longevity and reliability of the bonded components.
Working Principle
These adhesives work by forming a strong bond between substrates through chemical reactions that occur during the curing process. The adhesives are often composed of polymer resins that, when cured, create a robust and durable bond. Their dielectric strength is a critical feature, allowing them to withstand high voltage without breaking down, which is essential for electrical insulation. This makes them particularly useful in applications where electrical insulation and thermal management are crucial, such as in electronic circuitry and powerlines.
Applications
Electrical Power / HV Industrial Adhesives are used in a variety of specific applications. For instance, they are employed in the assembly of electric motor components, where they bond substrates like metals and plastics. They are also used for potting and sealing electrical connections, ensuring that these connections remain insulated and protected from environmental factors. Additionally, in high-performance electric motors, thermally conductive adhesives are used to attach heat sinks and other components to improve heat transfer and thermal management.
Advantages over other Industrial Adhesives
These adhesives offer several advantages over other types of industrial adhesives. For example, their high dielectric strength makes them particularly suitable for applications requiring electrical insulation, such as electronic components and devices. They also provide excellent thermal conductivity, which helps dissipate heat generated by electronic components, preventing damage from overheating. Furthermore, they exhibit strong adhesion to a variety of substrates, including metals, plastics, and ceramics, and are resistant to a wide range of chemicals, making them suitable for harsh environments.
Limitations
One limitation of Electrical Power / HV Industrial Adhesives is that they may require specific curing conditions to achieve optimal performance, which can complicate the manufacturing process. Additionally, while they offer excellent electrical insulation and thermal management properties, they may not be suitable for all types of substrates or environments, particularly those that do not require high dielectric strength or thermal conductivity.
Considerations
When selecting Electrical Power / HV Industrial Adhesives, several considerations should be taken into account. Initial costs can vary depending on the specific formulation and required properties, such as dielectric strength and thermal conductivity. Operating expenses may include the cost of curing equipment and energy consumption during the curing process. Durability is generally high, but the specific environmental conditions and mechanical stresses should be considered to ensure long-term performance. Maintenance and replacement costs are typically low, as these adhesives are designed to provide lasting bonds with minimal need for repairs.
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow SYLGARD ™ Q3-3600 Thermally Conductive Encapsulant Gray is a two component, heat curing, silicone adhesive that is used to improve thermal transfers of cooling mechanisms in the industrial and automotive industries. It provides high flowability, long working times, low viscosity, flame... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow SYLGARD ™ Q3-3600 Thermally Conductive Encapsulant Gray is a two component, heat curing, silicone adhesive that is used to improve thermal transfers of cooling mechanisms in the industrial and automotive industries. It provides high flowability, long working times, low viscosity, flame... [See More]
- Industry: Electric Power
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Viscosity: 4700
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Henkel Loctite Dri 2045 ™ Methacrylate Adhesive is a two component, medium to high strength, pre-applied threadlocker designed to meet automotive specification requirements with good substrate compatibility. It is formulated for use on passivated and plain metal surfaces. It is designed to act... [See More]
- Industry: Electric Power
- Features: Sealant; Threadlocker or Retainer
- Cure / Technology: Anaerobic; Two Component
- Viscosity: 600 to 5000
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Henkel Loctite OXY-CAST 6850FT-LV Epoxy with HARDENER RT-7LC is a two component, low viscosity, epoxy casting system that is used for electrical casting, encapsulating, and high voltage applications. It offers high thermal conductivity, electrical, flow, and wetting properties. It is resistant to... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Permabond 102 Cyanoacrylate is a one component, low viscosity, fast curing adhesive that is ideal for bonding tight fitting parts. It develops fast, strong bonds with a variety of materials such as metals, rubber, and plastics. It is 100% reactive, ideal for high speed production, and requires no... [See More]
- Industry: Electric Power
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Substrate Compatibility: Plastic
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
ResinLab OXY-BOND ™ 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 2500
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Brake Bonder 362 is a black heat curing, nitrile/phenolic solvent-based adhesive. Cured Brake Bonder 362 furnishes excellent resistance to thermal shock, chemicals, and water. The cured bond withstands temperatures exceeding 600 °F (315 °C). The primary application for Brake Bonder 362 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 370 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 370 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Fusionbond ® 371 is a two components methacrylate adhesive. It is specially formulated for structural bonding of thermoplastics, metal, wood and composite assemblies. Fusionbond ® 371 is an excellent choice for composite bonding applications in the marine, automotive and construction... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Hernon ® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond ® 374. Fusionbond ® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Fusionbond ® 375 is a highly thixotropic, two component, room temperature curing, 1:1 ratio, methacrylate adhesive system. Fusionbond ® 375 is formulated to provide fixturing strength within 7 to 10 minutes. This adhesive product forms resilient bonds and maintains its strength over a wide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
- Chemical System: Vinyl; Acrylic
- Substrate Compatibility: Metal; Plastic; PVC, acrylic, ABS, stainless steel, and some types of fiberglass
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Hernon Manufacturing, Inc.
HASA 39781 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 39781 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon ® Primer 50 accelerates the cure. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
HASA 716 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. This high strength acrylic adhesive cures when it is confined between mating surfaces. Utilized for bonding magnets in motor assemblies and structural applications, HASA 716... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Acrylic
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
HASA 718 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies. HASA 718 cures when it is confined between mating surfaces. Hernon? Activator 56 accelerates the cure. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
HASA 722 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 722 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Instantbond ® 109 is a low viscosity, state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 109... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Instantbond ® 110 is a state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 110 develops... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Instantbond ® 112 is a low viscosity, state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 112... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
- Substrate Compatibility: Metal
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Instantbond ® 113 is a state-of-the-art, single component, solventless, room temperature curing cyanoacrylate adhesive that polymerizes rapidly when pressed into a thin film between parts. The presence of surface moisture commences the cure of the adhesive. Instantbond ® 113 develops... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Chemical System: Ceramic; Cyanoacrylate
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Chemence Inc.
Krylex KHB8636 is a one component reactive polyurethane hot melt. It is solid at room temperature. It is a poly-battery assembly adhesive. After being applied warm the product will cool to allow immediate handling. Upon further exposure to ambient humidity Krylex KHB8636 will achieve high strength... [See More]
- Industry: Electric Power; Construction; OEM or Industrial
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyurethane
- Type / Form: Pellets
from Techsil Limited
TSE3941 is a flame retardant silicone adhesive sealant from Momentive Performance Materials, designed for electrical and electronic applications. This non-flowable, one-component RTV forms a soft elastic silicone rubber which is non-corrosive to metallic substrates. Product Benefits. High thermal... [See More]
- Industry: Electronics; Electric Power
- Features: Flame Retardant
- Chemical System: Elastomeric; Silicone
- Use Temperature: -55 to 200
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from ND Industries, Inc.
Vibra-Tite light cure adhesives are single-part, photo-initiated acrylates that cure on demand when exposed to UV-light. Almost instant cure. Some cure with very low intensity. Flexible or rigid products available. High optical clarity & non-yellowing. Bonds a wide range of substrates [See More]
- Industry: Electronics; Electric Power
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type / Form: Liquid
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Industry: Electronics; Electric Power
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Features: Electrically Conductive; Sealant
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Option of one or two component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing