Thermosetting / Crosslinking Industrial Adhesives
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Composition: Unfilled
- Chemical System: Silicone
- Type / Form: Liquid
from ELANTAS PDG, Inc.
Trickle resin system for impregnation or protective overcoat [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin. The resin exhibits superior adhesion to a rage of materials,... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
- Substrate Compatibility: Excellent adhesion to a wide variety of substrates
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from MacDermid Alpha Electronics Solutions
Product Description. GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding. The product is suitable for a wide variety of applications due to its high bonds strength. Typical applications include bonding between plastic-plastic, plastic-glass, glass-glass,... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Excellent adhesion to a wide variety of substrates
- Chemical System: Epoxy
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It ’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame retardant... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Excellent adhesion to a wide variety of substrates
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: High Dielectric; Non-corrosive; Thermally Conductive
from MacDermid Alpha Electronics Solutions
Product Description. ER2223 highly chemical resistant epoxy potting compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical resistance, including most fluids found in the engine compartment of... [See More]
- Cure / Technology: Thermoset
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
- Substrate Compatibility: Excellent adhesion to a wide variety of substrates
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid; Powder
from MacDermid Alpha Electronics Solutions
Product Description. ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components. The resin has good chemical resistance and a wide operating temperature range, performing exceptionally at high... [See More]
- Cure / Technology: Thermoset
- Substrate Compatibility: Excellent adhesion to a wide range of substrates
- Chemical System: Epoxy
- Industry: Automotive; Electronics; OEM or Industrial
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Elastomeric
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Chemical System: Epoxy
- Use Temperature: -40 to 266
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Chemical System: Silicone
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
from MacDermid Alpha Electronics Solutions
Product Description. ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units. ER6002LV has good flow characteristics which allows potting of small units or complex geometries. Featuring an off-white colour finish, ER6002LV is designed... [See More]
- Cure / Technology: Thermoset
- Features: Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Excellent adhesion to a wide variety of substrates
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically designed for compatibility with reflow applications, therefore remaining stable for... [See More]
- Cure / Technology: Thermoset
- Features: Encapsulant, Potting Compound; Flame Retardant
- Chemical System: Epoxy
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2219 single component epoxy resin is a versatile resin suitable for use as a glob-top resin, or for dipping hybrid circuits and individual components which require discrete concealment. The resin is semi-thixotropic allowing for efficient heat curing and a faster process time. [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Flame Retardant
- Chemical System: Epoxy
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
from MacDermid Alpha Electronics Solutions
Product Description. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system which is ideal for potting and... [See More]
- Cure / Technology: Thermoset
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes and low smoke emission and the lack of abrasive fillers means that there is lower wear on... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Flame Retardant; Thermally Conductive
- Chemical System: Epoxy
- Thermal Conductivity: 1.26
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from MacDermid Alpha Electronics Solutions
Product Description. ER1426 Transparent / Colourless Epoxy Encapsulation Resin is a two part resin designed for powder bonding and impregnation applications. It ’s a very low viscosity resin system ideal for use on complicated geometries or around components placed close together. The long... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Powder
- Chemical System: Epoxy
- Industry: Electronics
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Silicone
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: Sealant
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Elastomeric
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: Sealant
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: High Dielectric; Non-corrosive; Sealant
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Powder
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: Non-corrosive; Sealant
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Chemical System: Silicone
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847 is a premium quality, reddish brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and rubbers,... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Elastomeric
- Features: Solvent Based
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Cure / Technology: Thermoset
- Type / Form: Liquid
- Chemical System: Elastomeric; Silicone
- Features: Sealant
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Silicone
- Type / Form: Liquid
from Techsil Limited
Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve an extremely strong rigid bond with excellent thixotropic and void filling properties. The adhesive bond... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Henkel Corporation - Electronics
LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense. [See More]
- Cure / Technology: Anaerobic; Thermoset
- Industry: Electronics
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound; Sealant
from Acoustical Solutions, Inc.
AlphaPanel ™ Adhesive is a non-toxic water based adhesive that makes installation quick and easy by providing a strong permanent bond when apply foam panels to walls or ceilings. It offers easy clean up and is compatible with all polyurethane and melamine foam products. The tubes are 10.1... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Flexible; Water Based
- Chemical System: Elastomeric; Latex Based
- Substrate Compatibility: Paper or Paperboard; Plastic; Porous Surfaces; Dissimilar Substrates; Acoustical Foam Products
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Cure / Technology: Thermoset
- Type / Form: Liquid
- Chemical System: Silicone
- Features: Thermally Conductive
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847L is a lower viscosity premium quality, brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Elastomeric
- Features: Solvent Based
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Gel
from Wacker Chemical Corp.
ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Features: Flexible; Sealant
- Chemical System: Elastomeric; Silicone
- Industry: Electronics
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Polyurethane
- Type / Form: Liquid
from Techsil Limited
Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general purpose material which dries to a clear product to achieve an extremely strong rigid bond with excellent thixotropic... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically conductive in x, y, z axes. Excellent electrical and... [See More]
- Cure / Technology: Thermoset
- Type / Form: Sheet or Film
- Chemical System: Epoxy
- Industry: OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Flexible; Sealant
- Chemical System: Epoxy
- Industry: Aerospace; OEM or Industrial
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Type / Form: Liquid
- Composition: Unfilled
- Features: Electrically Conductive; Thermal Insulation
from Techsil Limited
Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. The bonds are permanent and non shrinking and can work down to -40C when cured. It has good dielectric strength... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Sealant
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; OEM or Industrial
- Chemical System: Epoxy
- CTE: 28
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Leveling Filling; Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Honeycomb Core
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Flexible; Electrically Conductive; Thermally Conductive
from Techsil Limited
Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. This Devcon epoxy offers bonds which are permanent, non shrinking and will continue working all the way down to... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; OEM or Industrial
- Chemical System: Epoxy
- Viscosity: 22000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Cure / Technology: Thermoset; Option of one or two component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Techsil Limited
Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]
- Cure / Technology: Thermoset
- Features: Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes NASA outgassing... [See More]
- Cure / Technology: Thermoset
- Industry: OEM or Industrial
- Chemical System: Epoxy
- Viscosity: 7500
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Polyurethane
- Type / Form: Liquid
from Techsil Limited
LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive specially designed for use in the assembly of high power and high temperature electronic devices. It is formulated with a more enhanced resin bleed control. LOCTITE ABLESTIK ICP 9000 is designed to provide high adhesion and low... [See More]
- Cure / Technology: Thermoset
- Industry: OEM or Industrial
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Chemical System: Epoxy
- Features: Flame Retardant
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Liquid
- Composition: Unfilled
- Features: High Dielectric; Sealant; Thermal Insulation
from Techsil Limited
LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Cure / Technology: Thermoset
- Industry: Electronics; OEM or Industrial
- Features: Electrically Conductive
- CTE: 34
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Chemical System: Epoxy
- Features: Flexible
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing (optional feature)
- Features: Flame Retardant
- Chemical System: Epoxy
- Industry: OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Chemical System: Epoxy
- Industry: Aerospace; OEM or Industrial
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Features: Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]
- Cure / Technology: Thermoset
- Features: Leveling Filling
- Chemical System: Epoxy
- Industry: OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Plastic Adhesive 1099H is a fast drying and heat curable Nitrile adhesive. Air dried bonds have high strength; resist weathering, water, oil and fuel. It is excellent for bonding most vinyl extrusions and sheeting. Also bonds many fabrics. [See More]
- Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
- Type / Form: Liquid
- Chemical System: Elastomeric
- Features: Solvent Based
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Features: Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Nitrile High Performance Plastic Adhesive 1099L is a low viscosity fast drying and heat curable Nitrile adhesive. Tan can bond most vinyls (supported and unsupported) wood, metal, rubber to fiberglass, painted, primed or bare steel, and molded plastics. This product... [See More]
- Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
- Type / Form: Liquid
- Chemical System: Elastomeric
- Features: Solvent Based
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Cure / Technology: Thermoset
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Industry: Electronics
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Low Density Composite Surfacing Films AF 325 is a thermosetting, laminated metal foil film that adheres to cold and release coated tools. Excellent for surfacing composites. Provides a smooth void-free surface. Co-cure compatible with most epoxy composites. Compatible... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Sheet or Film
- Chemical System: Phenol Aldehyde Epoxy Resin
- Substrate Compatibility: Composites
from Techsil Limited
Panacol Vitralit ® UC 1619 is a uv-curable compound designed for opto-electronic components like LED and VCSEL. This product features excellent transmission (650-1300nm) along with ionic pureness, non-yellowing and extremely good thermal shock resistance when operating between -55 °C and... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Low Density Composite Surfacing Films AF 325LS is a thermosetting, laminated metal foil film that adheres to cold and release coated tools. Comes in two weights of copper screen for lightning dissipation applications. Excellent for surfacing composites. Provides a... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Sheet or Film
- Chemical System: Phenol Aldehyde Epoxy Resin
- Substrate Compatibility: Composites
from Techsil Limited
Techsil ® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil ® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical... [See More]
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Techsil Limited
Techsil ® EP21480 is a two part epoxy resin systems that cures at room temperature to a high gloss black finish. It is flame retardant and thermally conductive. This resin system is slightly flexible to allow for thermal fluctuations and is suitable for the encapsulation of PCB's and general... [See More]
- Cure / Technology: Thermoset
- Features: UL Rating
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Chemical System: Epoxy
- Industry: Aerospace; OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Sheet or Film
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Honeycomb Core
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30 is an unsupported, thermosetting film adhesive developed for structural bonding of metals and high strength plastic laminates (epoxy and phenolic). Some advantages of Scotch-Weld ™ AF 30 are high shear strength, high peel strength,... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Sheet or Film
- Chemical System: Nitrile Phenolic
- Features: Flexible
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Primer EC-1593 is a sprayable primer for use with 3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30. This product is suggested for use where good aluminum and magnesium overlap shear strengths from -67 °F to 180 °F (-55 °C to... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Liquid
- Chemical System: Elastomeric
- Substrate Compatibility: Metal
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]
- Cure / Technology: Thermoset; Single Component
- Type / Form: Sheet or Film
- Chemical System: Epoxy
- Features: Sealant
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates and is designed to... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Flexible
- Chemical System: Polyurethane
- Substrate Compatibility: Metal; Plastic
from 3M Aerospace and Aircraft Maintenance Division
Two-component, polyurethane adhesive which cures at room temperature. Forms tough, impact-resistant structural bonds. Excellent adhesion to many primed or painted metal and plastic substrates. Designed to develop sag resistance approximately 30 seconds after mixing. Work Life: 100 grams mixed at 75F... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Flexible
- Chemical System: Polyurethane
- Substrate Compatibility: Metal; Plastic