Encapsulating / Potting Industrial Adhesives
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from DigiKey
SI 5140 METHOXY 85 GR TB/BN [See More]
- Features: Encapsulant, Potting Compound; Non-corrosive
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld DP270 Epoxy Adhesive Duo-Pak Black is a two-part epoxy adhesive. It is used for the potting and encapsulation of many heat sensitive or delicate components. It has good thermal shock resistance, long worklife, and excellent electrical properties. 400 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
SI 5140 METHOXY 300ML CQ/BN [See More]
- Features: Encapsulant, Potting Compound; Non-corrosive
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from DigiKey
TRANSFER ADHESIVE FOR DISPLAY WI [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from DigiKey
TWO-PART POTTING COMPOUND 100ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Ceramic
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 8000
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
TWO-PART POTTING COMPOUND 200ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Chemical System: Silicone
- Thermal Conductivity: 0.2000
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
TWO-PART POTTING COMPOUND 400ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ Q2-3067 Optical Couplant is a grease-like material that is used to improve sensitivity of optical devices, prevent loss of intensity during light transmission, and for optical coupling. It provides good shear stability, low temperature bonding, and high clarity. 113 g Bottle. [See More]
- Features: Encapsulant, Potting Compound
- Industry: Photonics
- Cure / Technology: Single Component
- Elongation: 110.0
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND CLEAR 400ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ Q2-3067 Optical Couplant is a grease-like material that is used to improve sensitivity of optical devices, prevent loss of intensity during light transmission, and for optical coupling. It provides good shear stability, low temperature bonding, and high clarity. 453 g Jar. [See More]
- Features: Encapsulant, Potting Compound
- Industry: Photonics
- Cure / Technology: Single Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND CLEAR 200ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ SE 9120 Clear Adhesive is a one component, room temperature curing, silicone adhesive that is used for encapsulating electrical devices, coating PCB, and LCD module assembly. It is flowable, tack free, low viscosity, and has a controlled silicone volatility. 330 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 6500
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND BLACK 50ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow SYLGARD ™ Q3-3600 Thermally Conductive Encapsulant Gray is a two component, heat curing, silicone adhesive that is used to improve thermal transfers of cooling mechanisms in the industrial and automotive industries. It provides high flowability, long working times, low viscosity, flame... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Electric Power
- Cure / Technology: Two Component
- Viscosity: 4700
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND BLACK 400ML [See More]
- Features: Encapsulant, Potting Compound
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
DYMAX 9102 Light/Moisture Cure Encapsulant Clear is a one component, UV light and moisture curing, acrylated urethane that is used for wire bonding and as a chip-encapsulant. It is flexible, tack free, moisture and thermal resistant. 30 mL MR Syringe. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 17000
- Cure / Technology: Single Component
- Tensile (Break): 703
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND BLACK 200ML [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Dymax EMAX 99004 Light Yellow is a UV light curing, blue fluorescing, wire bond adhesive encapsulant with secondary moisture cure. It is ideal for use where shadow areas exist including chip-on-board, chip-on-flex, and chip-on-glass applications. Contains no nonreactive solvents and adheres well to... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 15000
- Cure / Technology: Single Component
- Tensile (Break): 1200
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from DigiKey
BLACK EPOXY, POTTING COMPOUND [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Dymax EMAX 99004 Light Yellow is a UV light curing, blue fluorescing, wire bond adhesive encapsulant with secondary moisture cure. It is ideal for use where shadow areas exist including chip-on-board, chip-on-flex, and chip-on-glass applications. Contains no nonreactive solvents and adheres well to... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 15000
- Cure / Technology: Single Component
- Tensile (Break): 1200
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
TRANSLUCENT EPOXY, POTTING COMPO [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and instant curing urethane that is used for bonding electronic devices, print circuit boards, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 4500
- Cure / Technology: Single Component
- Tensile (Break): 750
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
POTTING COMPOUND FLAME RETARDT [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant
from Ellsworth Adhesives
DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and instant curing urethane that is used for bonding electronic devices, print circuit boards, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 4500
- Cure / Technology: Single Component
- Tensile (Break): 750
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
HIGH TEMPERATURE EPOXY [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 10000 to 24000
- Cure / Technology: Single Component
- Tensile (Break): 750
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
BLACK EPOXY, POTTING COMPOUND [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 10000 to 24000
- Cure / Technology: Single Component
- Tensile (Break): 750
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ADHESIVE SEALANT SIL WHITE PASTE [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 10000 to 24000
- Cure / Technology: Single Component
- Tensile (Break): 750
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ADHESIVE SEALANT SIL WHITE PASTE [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite 5620 Silicone Potting Compound Clear is a two component material that turns to a flexible elastomer after curing at room or elevated temperatures. It is used for potting and protection components from vibrations, moisture, mechanical and thermal shock. 400 mL Dual Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 200 to 450
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ADHESIVE SEALANT SIL BLACK PASTE [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and low coefficient... [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 1.2
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from DigiKey
ADHESIVE SEALANT SIL BLACK PASTE [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 200 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6200 to 13000
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from DigiKey
ADHESIVE SEALANT SIL TRANSLUCENT [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 400 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6200 to 13000
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from DigiKey
ADHESIVE SEALANT SIL TRANSLUCENT [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 50 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6200 to 13000
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from DigiKey
ADHESIVE SEAL SIL WHITE FLOWABLE [See More]
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 4000
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]
- Features: Encapsulant, Potting Compound; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Polyimide
- Industry: Electronics; OEM or Industrial
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from ACCRAbond, Inc.
INSTAbond ® M810 -- a two-part epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications. Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. Certified to Mil-A-81236 Type 1 & Type 2. [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Features: Encapsulant, Potting Compound
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Techsil Limited
Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot filling... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; UL Rating
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyolefin
- Type / Form: Pellets
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® N10 is a flowable silicone sealant which cures at room temperature under influence of atmospheric moisture. Special features. neutral-curing system (oxime). low viscosity, no thixotropy. solventfree. excellent primerless adhesion to many substrates. Application. Multipurpose grade... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric; Silicone
- Type / Form: Gel
from Shenzhen DeepMaterial Technologies Co., Ltd
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Heat Curing
- Chemical System: Epoxy
- Industry: Electronics; Semiconductors, IC's
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Henkel Corporation - Industrial
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Thermal Insulation; UL Rating
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Chemence Inc.
KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Type / Form: Gel
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Henkel Corporation - Industrial
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: ? to 4000
- Cure / Technology: Thermoplastic / Hot Melt
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Sealant
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Silicone
- Use Temperature: 392
from Henkel Corporation - Industrial
LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Polyurethane
- Viscosity: 120
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Epoxies Etc...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Composition: Filled
- Type / Form: Gel