Thermal / Heat Conductive Industrial Adhesives
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Hernon Manufacturing, Inc.
Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]
- Features: Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Features: Flame Retardant; Thermally Conductive; UL Rating
- Cure / Technology: Single Component; Alkoxy
- Chemical System: Silicone
- Industry: Automotive; Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 25
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Features: Thermally Conductive
- Industry: Automotive; Electronics; Semiconductors, IC's
from Richardson RFPD
DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]
- Features: Thermally Conductive
from Ellsworth Adhesives
3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge. [See More]
- Features: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 60000
from RS Components, Ltd.
Heatsink compound DC340 [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Chemical System: Silicone
- Use Temperature: 392
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Features: Thermally Conductive
- Use Temperature: 32 to 450
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]
- Features: Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 15
from Richardson RFPD
DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]
- Features: Thermally Conductive
from Ellsworth Adhesives
3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge. [See More]
- Features: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 40000 to 80000
from RS Components, Ltd.
Loctite Circuit+ el conductive paint 2ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Features: Thermally Conductive
- Use Temperature: 32 to 2200
- Cure / Technology: Single Component
- Thermal Conductivity: 25.96 to 51.92
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Features: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 35
from Richardson RFPD
DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]
- Features: Thermally Conductive
from Ellsworth Adhesives
Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]
- Features: Leveling Filling; Thermally Conductive
- Viscosity: 25
- Cure / Technology: Two Component
- Thermal Conductivity: 1.8
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: UV Curing
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Features: Thermally Conductive
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 6
from Richardson RFPD
ADHESIVE, ACRYLIC, SYRINGE, 25ML [See More]
- Features: Thermally Conductive
from Ellsworth Adhesives
Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]
- Features: Leveling Filling; Thermally Conductive
- Viscosity: 300000
- Cure / Technology: Two Component
- Thermal Conductivity: 2
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Features: Thermally Conductive
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 4
from Richardson RFPD
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]
- Features: Thermally Conductive
from Ellsworth Adhesives
Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures and has excellent mechanical and chemical stability. 600 cc Cartridge. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 200000
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Features: Thermally Conductive
- Type / Form: Gel
- Chemical System: Silicone
- Industry: Electronics
from Ellsworth Adhesives
Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has high tensile... [See More]
- Features: Thermally Conductive
- Viscosity: 61000
- Cure / Technology: Single Component
- Thermal Conductivity: 1.8
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
- Use Temperature: -58 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental... [See More]
- Features: Thermally Conductive
- Viscosity: 50000
- Cure / Technology: Single Component
- Thermal Conductivity: 1.9
from RS Components, Ltd.
Silver loaded epoxy adhesive,10gm 2 vial [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
- Use Temperature: 302
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
- Use Temperature: -58 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond... [See More]
- Features: Thermally Conductive
- Viscosity: 58000
- Cure / Technology: Single Component
- Thermal Conductivity: 1.9
from RS Components, Ltd.
DP810 LWODR ACR ADH GN 400 mL CAR 6 /CV [See More]
- Features: Thermally Conductive
- Industry: OEM or Industrial; Industrial, Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
- Use Temperature: -58 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat cure, glass beads for controlling bond line thickness, self priming, good dielectric properties, and... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Cure / Technology: Single Component
- Viscosity: 80000
from RS Components, Ltd.
Loctite 3875 pt A [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Chemical System: Acrylic
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Features: Thermally Conductive
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 15
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]
- Features: Thermally Conductive
- Industry: Semiconductors, IC's
- Cure / Technology: Single Component
- Viscosity: 81000
from RS Components, Ltd.
Silicone heat transfer compound HTSP 50T [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Chemical System: Silicone
- Use Temperature: 392
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Starch
- Use Temperature: ? to 302
from Ellsworth Adhesives
Dow DOWSIL ™ Q1-9226 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone adhesive that is used for bonding with a variety of substrates such as filled plastics, metals, epoxies, laminate boards, and ceramics. It is typically used for bonding substrates to heat sinks... [See More]
- Features: Thermally Conductive
- Viscosity: 50000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.7400
from RS Components, Ltd.
TECBOND 280 Trans Yellow glue stick 5kg [See More]
- Features: Thermally Conductive
- Industry: Bonding
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow DOWSIL ™ SE 4486 Thermally Conductive Adhesive is a one component, moisture and heat curing, silicone elastomer that is used for potting power supplies, attaching base plates and heat sinks. It offers good dielectric properties, stress relief, wide temperature range, and resistance to... [See More]
- Features: Thermally Conductive
- Viscosity: 25000
- Cure / Technology: Single Component
- Thermal Conductivity: 1.53
from RS Components, Ltd.
TECBOND LM41 White glue sticks [See More]
- Features: Thermally Conductive
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Features: Thermally Conductive
- Use Temperature: -58 to 302
- Industry: Electronics
- Thermal Conductivity: 7
from Ellsworth Adhesives
Dow DOWSIL ™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has low thermal... [See More]
- Features: Leveling Filling; Thermally Conductive
- Industry: Automotive; Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Viscosity: 2360
from RS Components, Ltd.
DP760 high temp epoxy adhesive,50ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Features: Thermally Conductive
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 5
from Ellsworth Adhesives
Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 300 mL Cartridge. [See More]
- Features: Thermally Conductive
- Viscosity: 360000 to 850000
- Cure / Technology: Single Component
- Thermal Conductivity: 0.8080
from RS Components, Ltd.
AS1803 Silicone Adhesive 310 ml Cart [See More]
- Features: Thermally Conductive
- Use Temperature: 428
- Industry: Thermal Management
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Features: Thermally Conductive
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 4
from Ellsworth Adhesives
Henkel Loctite 3873 Thermally Conductive Acrylic Adhesive is a one component, high strength, adhesive that is used for bonding heat generating devices. It offers high viscosity, high modulus, and is self-shimming. It is typically used with Activator 7387 ™ to increase cure speed and strength. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Thermal Conductivity: 1.25
from RS Components, Ltd.
9455 A &B structural adhesive hysol,50ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Features: Thermally Conductive
- Type / Form: Gel
- Chemical System: Silicone
- Industry: Electronics
from Ellsworth Adhesives
Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet. [See More]
- Features: Electrically Conductive; Thermally Conductive
- Thermal Conductivity: 1.5
- Cure / Technology: Two Component
from RS Components, Ltd.
3425 A &B structural adhesive hysol,50ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Polyolefin
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Features: Thermally Conductive
- Use Temperature: -58 to 257
- Industry: Electronics
- Thermal Conductivity: 10
from Ellsworth Adhesives
Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 1 lb Bottle. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 150 to 600
from RS Components, Ltd.
9461 A &B structural adhesive hysol,50ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Features: High Dielectric; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 30
from Ellsworth Adhesives
Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 150 to 600
from RS Components, Ltd.
3430 A &B structural adhesive hysol,24ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Features: Thermally Conductive
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 3
from Ellsworth Adhesives
Henkel Loctite 4204 Prism one component, medium viscosity general purpose adhesive that is suitable for applications where heat resistance is needed. It is toughened with elastomers for flexibility, impact resistance and improved resistance to heat and humidity. 1 lb Bottle. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 2000 to 6000
from RS Components, Ltd.
3423 A & B general purpose hysol,50ml [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 20
from Ellsworth Adhesives
Henkel Loctite 4204 Prism is a medium viscosity, thermally resistant general purpose cyanoacrylate adhesive toughened with elastomers for flexibility, impact resistance and resistance to heat and humidity. 20 g Bottle. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 2000 to 6000
from RS Components, Ltd.
Circuit Works conduct epoxyadhesive,14gm [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: UV curable
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Features: Thermally Conductive
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 45
from Ellsworth Adhesives
Henkel Loctite 4204 Prism one component, medium viscosity general purpose adhesive that is suitable for applications where heat resistance is needed. It is toughened with elastomers for flexibility, impact resistance and improved resistance to heat and humidity. 20 g Tube. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 2000 to 6000
from RS Components, Ltd.
THERMALLY ADHESIVE 5 G [See More]
- Features: Thermally Conductive
- Industry: Thermal Management
- Chemical System: Epoxy Resin; Epoxy
- Use Temperature: 302
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Features: Thermally Conductive
- Type / Form: Gel
- Chemical System: Silicone
- Industry: Electronics
from Ellsworth Adhesives
Henkel Loctite 4205 is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube. [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Cyanoacrylate
- Viscosity: 10000 to 60000
from RS Components, Ltd.
Titanium Putty, Grey, Tub [See More]
- Features: Thermally Conductive
- Industry: OEM or Industrial; Industrial, Thermal Management
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Features: Sealant; Thermally Conductive; Thermal Insulation
- Type / Form: Sheet or Film
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Chemical System: Silicone
- Type / Form: Gel
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; UL Rating
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyolefin
- Type / Form: Pellets
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]
- Features: Leveling Filling; Thermally Conductive
- Chemical System: Silicone
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Features: High Dielectric; Sealant; Thermally Conductive; Threadlocker or Retainer
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Features: Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Type / Form: Liquid
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Features: Thermally Conductive
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Acrylic
- Industry: Electronics
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Features: Flexible; Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Substrate Compatibility: Metal; Plastic
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Industry: Electronics; Sanitary; Optical; Photonics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high adhesion to a variety of substrates. High thermal... [See More]
- Features: Thermally Conductive
- CTE: 27
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Flexible; Electrically Conductive; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Features: High Dielectric; Electrically Conductive; Thermally Conductive
- Substrate Compatibility: Ceramic, Glass; Metal; Textiles or Fabrics; Dissimilar Substrates
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Features: Thermally Conductive
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Features: Thermally Conductive
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Epoxies Etc...
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. [See More]
- Features: Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE ® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer... [See More]
- Features: Thermally Conductive
- Thermal Conductivity: 10
- Viscosity: 9000
- CTE: 22
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Features: Thermally Conductive
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Substrate Compatibility: Metal
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]
- Features: Thermally Conductive
- Cure / Technology: Air Setting / Film Drying (optional feature); Thermoset (optional feature); Single Component
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Features: Thermally Conductive
- Type / Form: Gel
- Chemical System: Silicone
- Industry: OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]
- Features: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 40000
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 247500
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications. High thermal conductivity. High reflectivity. Excellent anti-yellowing properties [See More]
- Features: High Dielectric; Thermally Conductive
- Thermal Conductivity: 0.8000
- Viscosity: 21000
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach. LOCTITE ® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in solvent... [See More]
- Features: Thermally Conductive
- CTE: 22
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic... [See More]
- Features: Thermally Conductive
- CTE: 20
from Techsil Limited
Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2700HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE ® ABLESTIK 2700HT die attach adhesive is designed for Pbfree array packaging. This adhesive is ideal for small needle dispensing in SiP or MCM die attach applications. Excellent bleed performance. Good workability. High... [See More]
- Features: Thermally Conductive
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach. LOCTITE ® ABLESTIK 8008 snap curable adhesive is designed for small die sizes ( <3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then... [See More]
- Features: Thermally Conductive
- CTE: 23
- Cure / Technology: Contact or Pressure Sensitive Adhesives
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]
- Features: Thermally Conductive
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Single Component
- CTE: 34
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8038, Acrylate, Die attach LOCTITE ® ABLESTIK ABP 8038 die attach adhesive is designed for high reliability leadframe packaging applications. This adhesive is formulated to eliminate silver migration concerns by replacing silver with gold and palladium. Conductive. Low... [See More]
- Features: Thermally Conductive
- CTE: 20
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE ® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. High thermal... [See More]
- Features: Thermally Conductive
- CTE: 26
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Features: Flame Retardant; Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone
from Henkel Corporation - Industrial
LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE ® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer... [See More]
- Features: Thermally Conductive
from Techsil Limited
Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
- Use Temperature: -40 to 200
from Techsil Limited
Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]
- Features: High Dielectric; Thermally Conductive
- Industry: Electronics
- Chemical System: Elastomeric; Silicone
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type / Form: Liquid